CN201788971U - A light-emitting module and application device with high heat conduction and light conduction functions - Google Patents

Abstract

The utility model provides a light-emitting module, it includes the base plate, locates a plurality of luminous wafers on the base plate and covers fluorescent glue layer and protection glue film on luminous wafer. The substrate comprises a substrate and a wafer bonding pad arranged on the substrate and used for bearing the light-emitting wafer. Wherein, a plurality of through holes are formed through the wafer welding pad and the substrate, and the fluorescent glue layer and the protective glue layer both comprise light guide structures so as to guide the light emitted by the light-emitting wafer. According to the utility model discloses a luminous module's base plate structure has realized thermoelectric separation, has improved luminous wafer's radiating effect. And simultaneously, according to the utility model discloses a luminous module can promote the stability of colour and to the throughput of light shape at the during operation.

Description

A light-emitting module and application device with high heat conduction and light conduction functions

【Technical field】

The utility model relates to a packaging structure based on a plurality of light-emitting diode chips, in particular to a light-emitting module with high heat conduction and light conduction functions and an application device thereof.

【Background technique】

Please refer to FIG. 12 , which shows a schematic structural view of a conventional lighting module 10 . The light-emitting module 10 includes a light-emitting diode component (LED Component) 11, copper foil 12, insulating heat-conducting adhesive 14, and an aluminum plate 16. The manufacturing process of the light emitting module 10 is complicated and the cost is high. In addition, the heat dissipation effect of the substrate composed of the copper foil 12 , the insulating heat-conducting adhesive 14 and the aluminum plate 16 needs to be improved.

At present, the dispensing mode is widely used to package the light-emitting diode chip (LED Chip) on a metal support, and then weld the packaged light-emitting diode components on a circuit board (PCB) one by one to form a light-emitting module, such as LED light bar (Light Bar). The color stability of this type of light-emitting module is poor, and the ability to process light shapes is also very limited.

In addition, in the current manufacturing process of light-emitting modules, the existing circuit layout design makes the LED light strips have to be cut from the mother circuit board to become finished products before testing. Both production efficiency and yield rate need to be improved.

Therefore, it can be seen from the above that the current packaging structure of the light-emitting module and the light-emitting diode element obviously has inconveniences and shortcomings, and needs to be improved.

Therefore, the inventor of this utility model feels that the above-mentioned deficiency can be improved, and based on the relevant experience in this field for many years, carefully observes and studies, and cooperates with the application of theories, and proposes a utility model that is reasonably designed and effectively improves the above-mentioned deficiency. .

【Content of utility model】

The technical problem to be solved by the utility model is to provide a light-emitting element, a circuit substrate, a light-emitting module, a light-emitting device, and a display device. The color stability of substrates, light-emitting modules, light-emitting devices, and display devices. In addition, products can be inspected for defects during the manufacturing process without waiting for finished products to be inspected, so as to improve yield and reduce costs.

In order to solve the above technical problems, according to a preferred embodiment of the present invention, a light-emitting module is provided, including a substrate, a plurality of light-emitting chips, and a protective adhesive layer. The plurality of light-emitting chips have positive terminals and negative terminals, and are arranged on the substrate. The protective adhesive layer is placed on the plurality of light-emitting chips, and has a protective adhesive light-guiding structure to integrally form a protective adhesive layer with the function of an optical lens to guide the light emitted by the light-emitting chips.

Wherein, the light guiding structure of the protective glue includes one of an optical focusing structure, a matte structure and a planar structure.

Wherein, the protective adhesive layer is made of completely or partially transparent materials.

Wherein, the protective adhesive layer is placed on the light emitting chip by dispensing, spraying or pressing.

The utility model also provides a light emitting device and a display device including the features of the above light emitting module.

Therefore, when the circuit substrate of the present invention is working, thermoelectric separation can be realized, that is, the connection circuit between the LEDs and the LEDs are on the same surface of the circuit substrate, and the other side of the circuit substrate is a metal film to receive the LEDs emitted by the heat dissipation holes. The heat acts as a heat sink. In addition, the light-emitting module according to the present invention can improve the stability of the color and the ability to process the light shape during operation. At the same time, in the process of manufacturing the light-emitting module according to the present invention, since the plating wires on the second surface of the substrate are removed by etching, the light-emitting chip can be tested after being wire-bonded on the substrate. It solves the problem that the product can be inspected during the manufacturing process, without waiting for the finished product to be inspected, which improves the yield rate and reduces the cost.

In order to further understand the technology, means and effects that the utility model adopts to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the utility model, and believe that the purpose, features and characteristics of the utility model can be obtained from this For an in-depth and specific understanding, the attached drawings are only for reference and illustration, and are not intended to limit the present invention.

【Description of drawings】

The utility model can be described more specifically through examples with reference to the accompanying drawings, wherein the accompanying drawings are not drawn to scale, and in the accompanying drawings:

Fig. 1 is a schematic diagram of the front structure of the first embodiment of the lighting module according to the present invention;

Fig. 2 is a schematic diagram of the back structure of the light-emitting module shown in Fig. 1;

Fig. 3 is a three-dimensional schematic diagram of the light emitting module shown in Fig. 1;

Fig. 4 is another perspective view of the light emitting module shown in Fig. 1;

Fig. 5 is a schematic side view of the light-emitting module shown in Fig. 1;

Fig. 6 is a schematic view of the front structure of the second embodiment of the lighting module according to the present invention;

Fig. 7 is a schematic diagram of the back structure of the light emitting module shown in Fig. 6;

Fig. 8 is a front view of an array of light-emitting modules with electroplated wires;

Figure 9 is a rear view of the array shown in Figure 8;

Fig. 10a is a schematic structural view of the third embodiment of the lighting module according to the present invention;

Fig. 10b is a schematic diagram of the brightness-angle relationship when the appearance of the colloid lens of the light-emitting module shown in Fig. 10a is matte;

Fig. 10c is a schematic diagram of the brightness-angle relationship when the colloidal lens of the light-emitting module shown in Fig. 10a is transparent in appearance;

Fig. 11a to Fig. 11h are schematic structural views of the fourth to eleventh embodiments of the light emitting module according to the present invention; and

FIG. 12 shows a schematic structural view of a conventional lighting module 10 .

【Detailed ways】

Please refer to FIG. 1 to FIG. 5 , which respectively show different views of the first embodiment of the lighting module 100 of the present invention. The light emitting module includes a plurality of light emitting chips 110 and a conductive substrate. The conductive substrate includes a base material 180 , a chip pad 160 , a wire pad 170 and a heat conduction layer 150 .

A first surface (ie, the front side shown in FIG. 1 , not marked) and a second side opposite to the first surface (ie, the back side shown in FIG. 2 , not marked) are formed on the substrate 180 . Conductive traces 182, 186 are provided thereon. Wherein the conductive track 182 is a positive conductive track, and the conductive track 186 is a negative conductive track. Of course, the positive and negative poles of the above-mentioned conductive traces can be adjusted as required, or combined with the chip pad 160 to meet the restrictions of different types of light-emitting chips, such as light-emitting chips with the positive and negative electrodes on the same plane or different planes.

Chip bonding pads 160 and wire bonding pads 170 are disposed on the first surface. The light emitting chip 110 is disposed on the chip bonding pads 160 . The wire bonding pads 170 electrically connect the light emitting chip 110 to the conductive traces 182 and 186 through wires 112 . The heat conduction layer 150 is disposed on the second surface, wherein the base material 180 has a plurality of through holes 162 connecting the chip pads 160 and the heat conduction layer 150 . In this embodiment, the holes of the perforations 162 are not filled with medium. Each light emitting wafer 110 shown in the figure corresponds to a set of 8 through-holes 162 . However, the number of perforations 162 is not limited thereto, and can be adjusted according to circumstances. In addition, the through hole 162 may pass through the die bonding pad 160 , the base material 180 and the heat conduction layer 150 , or may not pass through the above structures, as long as the heat generated on the first surface can be transferred to the second surface.

In this embodiment, the base material 180 may use materials known to those skilled in the art. Both the chip pad 160 and the heat conduction layer 150 are made of materials with good heat conduction performance. Due to the connection function of the through hole 162 , the heat generated during the operation of the light-emitting chip 110 can be transmitted to the back of the substrate through the through hole 162 and dissipated through the heat conducting layer 150 . Therefore, the light-emitting module and the conductive substrate of this embodiment have good heat dissipation performance. At the same time, because there are gaps or openings on the edge of the substrate, the light-emitting module of this embodiment can be directly screwed or fitted to pass through the conductive substrate. The gap fixes the light-emitting module of this embodiment to the light-emitting device or the display device, and conducts the heat on the module from the heat-conducting layer to the device to have a better heat dissipation effect.

Please refer to FIG. 6 and FIG. 7 , which show a schematic structural diagram of a second embodiment of the lighting module 200 according to the present invention. The structure of the light emitting module 200 of this embodiment is basically the same as that of the light emitting module 100 of the first embodiment, and also includes a light emitting chip 210 , chip pads 260 , a substrate 280 and a plurality of through holes 262 . The difference is that the hole of the through hole 262 of the light-emitting module 200 of this embodiment is filled with a heat-conducting substance, such as silver-containing paste, copper paste and other pastes containing metal heat-conducting molecules (shown in dark color in the figure, not marked) . The filled heat conduction substance helps to further improve the heat dissipation performance of the conductive substrate and the light emitting module.

Please refer to FIG. 8 and FIG. 9 , which show a schematic view of an array of light emitting modules 300 . FIG. 8 shows the front structure of the array, which includes a plurality of light emitting chips 310 and a plurality of wire bonding pads 370 . FIG. 9 shows the rear structure of the array, which includes a plurality of thermal conductive layers 350 . There is a plating wire 380 (extending along the H direction shown in FIGS. 8 and 9 ) between every two heat conducting layers 350 along the L direction shown in FIGS. 8 and 9 . The position of the electroplating wire 380 is shown in dotted line in FIG. 8 , wherein the electroplating wire 380 communicates with the wire pad 370 through a through hole (not shown) passing through the substrate. The function of the plated wire 380 is to facilitate the creation of the wire pad 370 on the substrate. Once the wire pad 370 is formed, the plated wire 380 is disabled. However, since the electroplated wire 380 is always in communication with the wire pad 370, the LED light strip must be cut from the mother circuit board to become a finished product before testing. In addition, the part of the electroplated wire must be insulated with solder resist, which increases the uncertainty of heat dissipation. In order to solve this problem, this paper also proposes a solution to remove the plating wire 380 by etching the plating wire 380 a second time during the manufacturing process. Since the substrate undergoes an etching process in the early stage of the manufacturing process, the subsequent etching is called secondary etching. In this way, it can be realized that the defective product can be inspected during the manufacturing process, and it is not necessary to wait for the finished product to be inspected.

Fig. 10a shows a schematic structural diagram of a third embodiment of a lighting module 400 according to the present invention. The light emitting module 400 includes a light emitting chip 410 , a substrate 480 and a protective glue layer 420 . The light-emitting chip 410 has a positive terminal and a negative terminal and is disposed on the substrate 480. The protective adhesive layer 420 is placed on the light-emitting chip 410. The protective adhesive layer 420 includes a light guide structure to integrally form a The protective glue layer 420 functioning as an optical lens guides the light emitted by the light-emitting chip 410 .

According to different application requirements, the light guide structure of the protective adhesive layer 420 can be one of an optical focusing structure, a fog surface structure and a planar structure. FIG. 10 b is a schematic diagram showing the relationship between brightness and angle of the light emitting module 400 when the appearance of the light guide structure is matte. The matte structure can be achieved by roughening the surface of the protective adhesive layer 420 , or by adding impurities such as titanium dioxide or phosphor powder into the colloid, or by selecting partially transparent colloidal materials. When the light-emitting angle of the light-guiding structure reaches 180°, the light emitted by the light-emitting chip 410 can produce a wide-area lighting effect after being guided by the light-guiding structure, so the matte lens structure is suitable for lighting applications. Fig. 10c shows a schematic diagram of the luminance-angle relationship of the light emitting module 400 when the light guiding structure is a transparent optical focusing structure. The optical focusing structure can be realized by shaping the protective adhesive layer 420 into various lens structures such as convex lens, concave-convex lens, or rod lens. When the light-emitting angle of the light-guiding structure reaches 63°, the The emitted light can produce a focused lighting effect after being guided by the light guide structure, so the lens structure is suitable for use in a backlight (Backlight) module as a display light source of a display device.

Please refer to FIG. 11a to FIG. 11h , which respectively show the structural schematic diagrams of the fourth to eleventh embodiments of the light emitting module according to the present invention. 11a , 11b , 11e , 11g and 11h , the light-emitting modules shown in FIG. 11h respectively cover different integrated structures and different numbers of fluorescent adhesive layers on the top of the light-emitting chip. For example, the fluorescent adhesive layer 520 shown in FIG. 11 b has a zigzag light guiding structure; the fluorescent adhesive layer 720 shown in FIG. 11 e has a planar light guiding structure. There are multiple fluorescent glue layers 920 shown in FIG. 11 g , and the multiple fluorescent glue layers 920 are respectively placed on each light-emitting chip 910 . The fluorescent adhesive layer 920' shown in FIG. 11h is single, and the single fluorescent adhesive layer 920' is placed on a plurality of light emitting chips 910'.

The light-emitting modules shown in Fig. 11c, Fig. 11d and Fig. 11f are respectively covered with a fluorescent adhesive layer and a protective adhesive layer on the top of the light-emitting chip. Wherein, the protective glue 630 shown in FIG. 11c is placed on the fluorescent glue 620, and the light guide structure of the fluorescent glue 620 is arc-shaped. The protective glue 630' shown in Fig. 11d is still placed on the fluorescent glue 620', but the light guiding structure of the fluorescent glue 620' is planar. The fluorescent glue 820 shown in FIG. 11f is placed on the protective glue 830 , and both the fluorescent glue 820 and the protective glue 830 have similar arc-shaped light guiding structures.

Regarding the molding method of the fluorescent adhesive layer, for the light-emitting module shown in FIG. 11g, the fluorescent adhesive layer 920 can be placed on the light-emitting chip 910 by dispensing, spraying or pressing. For the light-emitting module shown in FIG. 11h, the fluorescent adhesive layer 920' can be placed on the light-emitting chip 910' by dispensing, spraying or pressing.

The light-emitting module of the present invention also includes at least the following modifications. The protective adhesive layer is directly placed on a plurality of light-emitting chips, and the protective adhesive layer has a protective adhesive light-guiding structure similar to the structure of the fluorescent adhesive layer in Figure 11a, Figure 11b, and Figure 11e, that is, the protective adhesive layer light-guiding structure It can be an optical focusing structure, a fog surface structure or a planar structure. The material of the protective adhesive layer can be fully transparent or partially transparent. The coating method of the protective adhesive layer includes compression molding, dispensing or spraying. In addition, regardless of the protective adhesive layer or the combination of the fluorescent adhesive layer and the protective adhesive layer, the structures shown in FIG. 11g and FIG. 11h can be made.

It should be noted that the utility model is mainly described above by taking the light-emitting module as an example. In fact, various improvements of the present invention can be similarly applied to light-emitting elements, light-emitting devices and display devices. For example, the light-emitting module with heat dissipation holes can be applied to light-emitting devices such as general lighting fixtures or lighting tubes. At the same time, the above-mentioned light-emitting module, display screen and control module can be combined into a display device such as an LCD display screen or an outdoor electronic signboard. In addition, the circuit substrate with heat dissipation holes of the present invention can also be applied to various semiconductor circuits to improve the heat dissipation efficiency of the semiconductor chip during operation.

In the above embodiments, the utility model is only described as an example, but those skilled in the art can make various modifications to the utility model without departing from the spirit and scope of the utility model after reading this patent application.

Claims (18)

1. A light emitting module, characterized in that the light emitting module comprises: a plurality of light-emitting chips with positive and negative terminals; a substrate, the plurality of light-emitting chips are arranged on the substrate; A protective glue layer is placed on the light-emitting chip, and the protective glue layer includes a light-guiding structure of protective glue so as to guide the light emitted by the light-emitting chip. 2 . The light emitting module according to claim 1 , wherein the light guiding structure of the protective glue comprises one of an optical focusing structure, a matte structure and a planar structure. 3 . 3. The light-emitting module according to claim 1, wherein the protective adhesive layer is made of completely or partially transparent materials. 4. The light-emitting module according to claim 1, wherein the protective adhesive layer is placed on the light-emitting chip by dispensing, spraying or pressing. 5. The light-emitting module according to claim 1, wherein there are multiple protective adhesive layers, and the multiple protective adhesive layers are placed on each light-emitting chip. 6. The light-emitting module according to claim 1, wherein the protective adhesive layer is single, and the single protective adhesive layer is placed on a plurality of light-emitting chips. 7. A light emitting device, characterized in that the light emitting device comprises the light emitting module according to claim 1. 8 . The light emitting device according to claim 7 , wherein the protective glue light guiding structure of the light emitting module comprises one of an optical focusing structure, a fog surface structure and a planar structure. 9. The light-emitting device according to claim 7, wherein the protective adhesive layer of the light-emitting module is made of completely or partially light-transmitting materials. 10. The light emitting device according to claim 7, wherein the protective adhesive layer of the light emitting module is placed on the light emitting chip by dispensing, spraying or pressing. 11. The light emitting device according to claim 7, characterized in that there are multiple protective adhesive layers of the light emitting module, and the multiple protective adhesive layers are placed on each light emitting chip. 12. The light emitting device according to claim 7, wherein the protective adhesive layer of the light emitting module is single, and the single protective adhesive layer is placed on a plurality of light emitting chips. 13. A display device, characterized in that the display device comprises: a plurality of light-emitting chips with positive and negative terminals; a substrate, the plurality of light-emitting chips are arranged on the substrate; A protective glue layer is placed on the light-emitting chip, and the protective glue layer includes a protective glue light guiding junction structure, so as to guide the light emitted by the light-emitting chip, and A display screen and a control device, the light emitted by the light-emitting chip is controlled by the control device to be displayed on the display screen. 14 . The display device according to claim 13 , wherein the light guiding structure of the protective glue comprises one of an optical focusing structure, a fog surface structure and a planar structure. 15 . The display device according to claim 13 , wherein the protective adhesive layer is made of a material that is completely transparent or partially transparent. 16. The display device according to claim 13, wherein the protective adhesive layer is placed on the light emitting chip by dispensing, spraying or pressing. 17. The display device according to claim 13, wherein there are multiple protective adhesive layers, and the multiple protective adhesive layers are placed on each light-emitting chip. 18. The display device according to claim 13, wherein the protective adhesive layer is single, and the single protective adhesive layer is placed on a plurality of light-emitting chips. the

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