CN202713247U - 压电振动元件、压电振子、压电振荡器以及电子设备 - Google Patents

压电振动元件、压电振子、压电振荡器以及电子设备 Download PDF

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Publication number
CN202713247U
CN202713247U CN2012200940009U CN201220094000U CN202713247U CN 202713247 U CN202713247 U CN 202713247U CN 2012200940009 U CN2012200940009 U CN 2012200940009U CN 201220094000 U CN201220094000 U CN 201220094000U CN 202713247 U CN202713247 U CN 202713247U
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axis
piezoelectric
excitation
substrate
vibrating element
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CN2012200940009U
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Chinese (zh)
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伊井稔博
内藤松太郎
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Seiko Epson Corp
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Seiko Epson Corp
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/022—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H03H2003/0407—Temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H03H2003/0414—Resonance frequency
    • H03H2003/0421—Modification of the thickness of an element
    • H03H2003/0435—Modification of the thickness of an element of a piezoelectric layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H03H2003/0414—Resonance frequency
    • H03H2003/0485—Resonance frequency during the manufacture of a cantilever

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN2012200940009U 2011-03-18 2012-03-13 压电振动元件、压电振子、压电振荡器以及电子设备 Expired - Fee Related CN202713247U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-060457 2011-03-18
JP2011060457A JP5708089B2 (ja) 2011-03-18 2011-03-18 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス

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CN202713247U true CN202713247U (zh) 2013-01-30

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CN2012200940009U Expired - Fee Related CN202713247U (zh) 2011-03-18 2012-03-13 压电振动元件、压电振子、压电振荡器以及电子设备
CN201710646628.2A Expired - Fee Related CN107681991B (zh) 2011-03-18 2012-03-13 压电振动元件、压电振子、压电振荡器以及电子设备
CN201210065906.2A Expired - Fee Related CN102684638B (zh) 2011-03-18 2012-03-13 压电振动元件、压电振子、压电振荡器以及电子设备

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CN201210065906.2A Expired - Fee Related CN102684638B (zh) 2011-03-18 2012-03-13 压电振动元件、压电振子、压电振荡器以及电子设备

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Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202535316U (zh) 2011-03-09 2012-11-14 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
JP5708089B2 (ja) 2011-03-18 2015-04-30 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス
JP2013098814A (ja) * 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP5943186B2 (ja) 2012-03-19 2016-06-29 セイコーエプソン株式会社 振動片、振動子、電子デバイス、および電子機器
JP5943187B2 (ja) 2012-03-21 2016-06-29 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、および電子機器
JP6182968B2 (ja) 2012-08-14 2017-08-23 株式会社リコー 電気機械変換素子、液滴吐出ヘッド、画像形成装置及び電気機械変換素子の製造方法
JP6332738B2 (ja) 2013-06-19 2018-05-30 株式会社リコー アクチュエータ及びその製造方法、並びに、そのアクチュエータを備えた液滴吐出ヘッド、液滴吐出装置及び画像形成装置
JP6155897B2 (ja) * 2013-06-24 2017-07-05 セイコーエプソン株式会社 振動片、振動子、電子デバイス、電子機器及び移動体
TWI657659B (zh) * 2014-04-11 2019-04-21 Seiko Epson Corporation 電子裝置、電子機器及移動體
FR3022690B1 (fr) * 2014-06-24 2016-07-22 Commissariat Energie Atomique Dispositif de connexion electrique comportant des elements de connexion a position commandable
JP6618675B2 (ja) * 2014-07-30 2019-12-11 セイコーエプソン株式会社 振動デバイス、電子機器及び移動体
JP6390836B2 (ja) 2014-07-31 2018-09-19 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
KR101616632B1 (ko) * 2014-09-23 2016-04-28 삼성전기주식회사 수정 진동자와 이를 포함하는 패키지
US9503045B2 (en) * 2015-01-19 2016-11-22 Seiko Epson Corporation Resonator element, resonator, oscillator, electronic apparatus, and moving object
JP2016140024A (ja) * 2015-01-29 2016-08-04 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP6592906B2 (ja) * 2015-01-29 2019-10-23 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
JP2016152477A (ja) 2015-02-17 2016-08-22 セイコーエプソン株式会社 振動子、振動デバイス、発振器、電子機器、および移動体
JP6561568B2 (ja) * 2015-05-08 2019-08-21 セイコーエプソン株式会社 無線送信装置
JP6090686B1 (ja) * 2015-06-12 2017-03-08 株式会社村田製作所 水晶片及び水晶振動子
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JP2017139682A (ja) * 2016-02-05 2017-08-10 セイコーエプソン株式会社 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局
JP6612150B2 (ja) * 2016-02-25 2019-11-27 京セラ株式会社 水晶振動素子及び水晶振動デバイス
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JP2017183808A (ja) * 2016-03-28 2017-10-05 京セラ株式会社 水晶素子および水晶デバイス
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JP2018164126A (ja) * 2017-03-24 2018-10-18 セイコーエプソン株式会社 振動デバイス、発振器、ジャイロセンサー、電子機器および移動体
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JP6822380B2 (ja) * 2017-11-02 2021-01-27 Tdk株式会社 振動デバイス
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JP6998795B2 (ja) * 2018-02-28 2022-01-18 京セラ株式会社 水晶振動素子及び水晶デバイス
CN113302838B (zh) * 2019-03-27 2024-03-26 株式会社村田制作所 振动元件、振子以及振动元件的制造方法
JP7311152B2 (ja) * 2020-03-18 2023-07-19 有限会社マクシス・ワン 水晶振動子の電極構造、水晶振動子、水晶発振器
JP7099596B1 (ja) * 2021-07-14 2022-07-12 Tdk株式会社 圧電素子
WO2023048014A1 (ja) * 2021-09-24 2023-03-30 株式会社大真空 圧電振動デバイス
US12615032B2 (en) 2024-10-15 2026-04-28 Txc Corporation Quartz resonator

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845205B2 (ja) 1974-08-23 1983-10-07 セイコーエプソン株式会社 メサ型水晶振動子の製造方法
JPS5847316A (ja) 1981-09-16 1983-03-19 Seikosha Co Ltd 厚みすべり圧電振動子およびその製法
JPH0257009A (ja) 1988-08-23 1990-02-26 Yokogawa Electric Corp 圧電共振器
US5198716A (en) * 1991-12-09 1993-03-30 The United States Of America As Represented By The United States Department Of Energy Micro-machined resonator
JPH0652230U (ja) 1992-12-11 1994-07-15 シチズン時計株式会社 圧電振動子
US6194816B1 (en) * 1996-11-19 2001-02-27 Miyota Co., Ltd. Piezoelectric vibrator
JPH10308645A (ja) 1997-05-08 1998-11-17 Toyo Commun Equip Co Ltd Atカット水晶振動子及びその製造方法
JP3731348B2 (ja) * 1998-06-09 2006-01-05 松下電器産業株式会社 圧電振動子
JP2000252786A (ja) 1999-03-01 2000-09-14 Matsushita Electric Ind Co Ltd 圧電振動素子
JP3702723B2 (ja) 1999-09-01 2005-10-05 セイコーエプソン株式会社 圧電振動片の製造方法
JP2001230654A (ja) 2000-02-16 2001-08-24 Matsushita Electric Ind Co Ltd 圧電振動素子およびその製造方法
JP4665282B2 (ja) 2000-02-18 2011-04-06 エプソントヨコム株式会社 Atカット水晶振動子
JP3438709B2 (ja) * 2000-08-31 2003-08-18 セイコーエプソン株式会社 圧電デバイス及びその製造方法と圧電発振器の製造方法
TW567664B (en) * 2001-10-09 2003-12-21 Ebauchesfabrik Eta Ag Piezoelectric resonator and assembly comprising the same enclosed in a case
JP2003163567A (ja) 2001-11-22 2003-06-06 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2003273682A (ja) * 2002-03-15 2003-09-26 Seiko Epson Corp 圧電振動片の周波数調整方法、圧電振動片および圧電デバイス
JP2004180274A (ja) 2002-11-15 2004-06-24 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2004200777A (ja) 2002-12-16 2004-07-15 Toyo Commun Equip Co Ltd メサ構造の圧電基板、圧電振動素子、圧電振動子、及び圧電発振器
JP4506135B2 (ja) 2003-09-18 2010-07-21 エプソントヨコム株式会社 圧電振動子
JP2005159717A (ja) * 2003-11-26 2005-06-16 Toyo Commun Equip Co Ltd 圧電振動子とその製造方法
JP2005318477A (ja) 2004-04-30 2005-11-10 Seiko Epson Corp 圧電振動片、その電極形成方法、及び圧電デバイス
JP4075893B2 (ja) 2004-05-21 2008-04-16 セイコーエプソン株式会社 水晶振動子の製造方法、その装置及び水晶振動子
JP4558433B2 (ja) * 2004-10-01 2010-10-06 日本電波工業株式会社 水晶振動子
US7388454B2 (en) 2004-10-01 2008-06-17 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using alternating frame structure
CN101142742B (zh) * 2005-04-18 2011-06-15 株式会社大真空 压电振动片和压电振动器件
JP4341583B2 (ja) 2005-06-02 2009-10-07 エプソントヨコム株式会社 メサ型水晶振動子
JP4857886B2 (ja) 2005-06-24 2012-01-18 セイコーエプソン株式会社 圧電アクチュエータの耐衝撃装置、これを備えた電子機器
US20090051252A1 (en) * 2005-06-30 2009-02-26 Takashi Shirai Piezoelectric Resonator Plate And Piezolectric Resonator Device
JP4541983B2 (ja) * 2005-06-30 2010-09-08 京セラキンセキ株式会社 圧電振動子
JP4572807B2 (ja) 2005-10-31 2010-11-04 エプソントヨコム株式会社 メサ型圧電振動片
CN101292422B (zh) 2005-11-04 2013-01-16 株式会社村田制作所 压电谐振器、滤波器、以及双模滤波器
JP2007181185A (ja) * 2005-12-01 2007-07-12 Sony Corp 音響共振器およびその製造方法
JP2007189492A (ja) 2006-01-13 2007-07-26 Epson Toyocom Corp 圧電基板の製造方法、圧電基板、圧電振動子、及び圧電発振器
US7608986B2 (en) 2006-10-02 2009-10-27 Seiko Epson Corporation Quartz crystal resonator
JP4341671B2 (ja) 2006-11-30 2009-10-07 エプソントヨコム株式会社 メサ型水晶振動子
JP4954748B2 (ja) * 2007-02-23 2012-06-20 株式会社藤商事 弾球遊技機
JP2008236439A (ja) 2007-03-21 2008-10-02 Epson Toyocom Corp 水晶振動片
JP2008263387A (ja) 2007-04-11 2008-10-30 Epson Toyocom Corp メサ型圧電振動片
JP4936221B2 (ja) 2007-06-08 2012-05-23 セイコーエプソン株式会社 メサ型圧電振動片、メサ型圧電振動デバイス、発振器、及び電子機器
JP5046012B2 (ja) 2007-09-04 2012-10-10 セイコーエプソン株式会社 振動片、振動デバイス、発振器及び電子機器
JP5088686B2 (ja) * 2007-11-21 2012-12-05 セイコーエプソン株式会社 振動片および振動デバイス
JP5035750B2 (ja) 2007-11-22 2012-09-26 セイコーエプソン株式会社 水晶振動片、水晶振動子、及び水晶発振器
JP5103297B2 (ja) * 2008-06-24 2012-12-19 セイコーインスツル株式会社 圧電振動子の製造方法
JP5151823B2 (ja) 2008-09-02 2013-02-27 セイコーエプソン株式会社 圧電振動片、圧電振動子及び発振器
JP2010098340A (ja) * 2008-10-14 2010-04-30 Nippon Dempa Kogyo Co Ltd 圧電振動子、圧電発振器及び圧電発振器の製造方法
JP5239748B2 (ja) * 2008-10-29 2013-07-17 セイコーエプソン株式会社 水晶振動片
JP5245731B2 (ja) 2008-11-06 2013-07-24 セイコーエプソン株式会社 圧電素子製造方法
JP4737726B2 (ja) * 2009-05-01 2011-08-03 セイコーエプソン株式会社 振動子、振動子アレイ、及び電子機器
JP5319491B2 (ja) * 2009-10-22 2013-10-16 太陽誘電株式会社 圧電薄膜共振子
JP5471303B2 (ja) 2009-10-27 2014-04-16 セイコーエプソン株式会社 振動片及び振動子
EP2495334B1 (en) 2009-10-29 2018-04-18 NGK Insulators, Ltd. Method for detection of target nucleic acid
JP5059897B2 (ja) 2010-02-24 2012-10-31 日本電波工業株式会社 圧電振動片の製造方法
JP5624410B2 (ja) 2010-09-02 2014-11-12 日本電波工業株式会社 メサ型のatカット水晶振動片及び水晶デバイス
CN102386871A (zh) * 2010-09-02 2012-03-21 日本电波工业株式会社 台面型at切割水晶振动片及水晶装置
JP5589167B2 (ja) 2010-11-19 2014-09-17 セイコーエプソン株式会社 圧電振動片および圧電振動子
JP5505647B2 (ja) 2010-11-19 2014-05-28 セイコーエプソン株式会社 圧電振動片および圧電振動子
CN202535316U (zh) * 2011-03-09 2012-11-14 精工爱普生株式会社 振动元件、振子、振荡器以及电子设备
JP5708089B2 (ja) 2011-03-18 2015-04-30 セイコーエプソン株式会社 圧電振動素子、圧電振動子、圧電発振器及び電子デバイス
KR101219106B1 (ko) 2011-08-01 2013-01-11 삼성전자주식회사 발광소자 패키지 및 그 제조방법
JP2013062578A (ja) * 2011-09-12 2013-04-04 Nippon Dempa Kogyo Co Ltd 水晶振動片及び水晶デバイス
JP2013098814A (ja) * 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
US9035538B2 (en) 2011-11-02 2015-05-19 Nihon Dempa Kogyo Co., Ltd. Piezoelectric vibrating piece and piezoelectric device
JP2013098813A (ja) 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP5883665B2 (ja) 2012-01-31 2016-03-15 日本電波工業株式会社 水晶振動片及び水晶デバイス
JP5982898B2 (ja) 2012-03-14 2016-08-31 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、発振器、及び電子機器
JP5943186B2 (ja) 2012-03-19 2016-06-29 セイコーエプソン株式会社 振動片、振動子、電子デバイス、および電子機器
JP5943187B2 (ja) * 2012-03-21 2016-06-29 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、および電子機器
JP5957997B2 (ja) 2012-03-21 2016-07-27 セイコーエプソン株式会社 振動素子、振動子、電子デバイス、発振器、及び電子機器
JP6175743B2 (ja) 2012-06-06 2017-08-09 セイコーエプソン株式会社 振動素子の製造方法
JP2014080050A (ja) 2012-10-12 2014-05-08 Bridgestone Corp タイヤ
JP5569616B2 (ja) 2013-03-29 2014-08-13 セイコーエプソン株式会社 振動素子の製造方法
JP5741876B2 (ja) 2014-03-19 2015-07-01 セイコーエプソン株式会社 圧電振動片および圧電振動子
JP6390836B2 (ja) * 2014-07-31 2018-09-19 セイコーエプソン株式会社 振動片、振動子、振動デバイス、発振器、電子機器、および移動体
US9503045B2 (en) * 2015-01-19 2016-11-22 Seiko Epson Corporation Resonator element, resonator, oscillator, electronic apparatus, and moving object

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US20140015380A1 (en) 2014-01-16
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