CN206371029U - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN206371029U
CN206371029U CN201590000741.8U CN201590000741U CN206371029U CN 206371029 U CN206371029 U CN 206371029U CN 201590000741 U CN201590000741 U CN 201590000741U CN 206371029 U CN206371029 U CN 206371029U
Authority
CN
China
Prior art keywords
heat dissipation
dissipation region
mentioned
cooling pin
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201590000741.8U
Other languages
English (en)
Chinese (zh)
Inventor
俞昌佑
朴敏植
文昭贤
金惠莲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KMW Inc
Original Assignee
KMW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KMW Inc filed Critical KMW Inc
Application granted granted Critical
Publication of CN206371029U publication Critical patent/CN206371029U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201590000741.8U 2014-06-18 2015-06-18 散热装置 Expired - Lifetime CN206371029U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2014-0074424 2014-06-18
KR1020140074424A KR20150145084A (ko) 2014-06-18 2014-06-18 방열 장치
PCT/KR2015/006216 WO2015194897A1 (ko) 2014-06-18 2015-06-18 방열 장치

Publications (1)

Publication Number Publication Date
CN206371029U true CN206371029U (zh) 2017-08-01

Family

ID=54935805

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201590000741.8U Expired - Lifetime CN206371029U (zh) 2014-06-18 2015-06-18 散热装置

Country Status (5)

Country Link
US (1) US20170097196A1 (ko)
JP (1) JP6526067B2 (ko)
KR (1) KR20150145084A (ko)
CN (1) CN206371029U (ko)
WO (1) WO2015194897A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019227393A1 (zh) * 2018-05-31 2019-12-05 深圳市大疆创新科技有限公司 散热系统及摄影摄像设备
CN112352348A (zh) * 2018-04-11 2021-02-09 株式会社Kmw 多输入输出天线装置
WO2021036249A1 (zh) * 2019-08-30 2021-03-04 华为技术有限公司 一种散热器、电子设备及汽车
CN112602232A (zh) * 2018-05-31 2021-04-02 株式会社Kmw 天线装置的散热装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015157523A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
CN107105595A (zh) * 2016-02-19 2017-08-29 恩佐科技股份有限公司 利用散热体排列达低风压需求、低噪音、高效能的散热器
CN106255384B (zh) * 2016-08-22 2019-06-04 山东久久星新能源车辆科技有限公司 一种散热装置及应用该散热装置的电瓶车
CN108303837B (zh) * 2017-01-12 2020-12-18 中强光电股份有限公司 投影装置、散热模块及散热鳍片组
CN108105088A (zh) * 2018-01-30 2018-06-01 重庆大学 一种无油涡旋压缩机的混合型涡盘散热结构
JP7021013B2 (ja) * 2018-06-25 2022-02-16 トヨタ自動車株式会社 冷却器
JP7118788B2 (ja) * 2018-07-19 2022-08-16 株式会社フジクラ コールドプレート及びコールドプレートの製造方法
CN208834080U (zh) 2018-07-23 2019-05-07 中强光电股份有限公司 投影装置、散热模块及散热鳍片
US11011452B2 (en) * 2018-11-29 2021-05-18 Micron Technology, Inc. Heat spreaders for semiconductor devices, and associated systems and methods
USD971192S1 (en) 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
CN112698541A (zh) * 2019-10-22 2021-04-23 中强光电股份有限公司 散热模块及使用其的投影装置
TWI778875B (zh) * 2021-11-24 2022-09-21 和碩聯合科技股份有限公司 散熱構件
JP7587735B2 (ja) * 2022-02-04 2024-11-21 株式会社カスタム・クール・センター 放熱器

Family Cites Families (16)

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US3313339A (en) * 1965-03-15 1967-04-11 Wakefield Engineering Company Heat transfer apparatus
US4587595A (en) * 1983-09-06 1986-05-06 Digital Equipment Corporation Heat sink arrangement with clip-on portion
JPH0888301A (ja) * 1994-09-19 1996-04-02 Mitsubishi Electric Corp 放熱フィン
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
JP3552559B2 (ja) * 1998-03-11 2004-08-11 株式会社デンソー 発熱体冷却装置
JP3076220U (ja) * 2000-09-08 2001-03-30 奇▲宏▼股▲ふん▼有限公司 ヒートシンクの構造
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
US7046515B1 (en) * 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
CN1578614B (zh) * 2003-06-30 2010-04-21 山洋电气株式会社 轴流风扇装置和发热体冷却装置
KR100719702B1 (ko) * 2005-05-25 2007-05-17 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
US7423877B2 (en) * 2006-09-01 2008-09-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN101516713A (zh) * 2006-09-19 2009-08-26 三菱电机株式会社 移动体用冷却装置
US20080128110A1 (en) * 2006-11-30 2008-06-05 Foxconn Technology Co., Ltd. Heat sink assembly having a fan mounting device
US20090129019A1 (en) * 2007-11-15 2009-05-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with fan holder
TWI334531B (en) * 2007-12-05 2010-12-11 Wistron Corp Heat sink and electronic apparatus using the same
TWM339033U (en) * 2008-04-16 2008-08-21 Asia Vital Components Co Ltd Heat sink

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112352348A (zh) * 2018-04-11 2021-02-09 株式会社Kmw 多输入输出天线装置
WO2019227393A1 (zh) * 2018-05-31 2019-12-05 深圳市大疆创新科技有限公司 散热系统及摄影摄像设备
CN110785701A (zh) * 2018-05-31 2020-02-11 深圳市大疆创新科技有限公司 散热系统及摄影摄像设备
CN112602232A (zh) * 2018-05-31 2021-04-02 株式会社Kmw 天线装置的散热装置
CN112602232B (zh) * 2018-05-31 2024-10-22 株式会社Kmw 天线装置的散热装置
WO2021036249A1 (zh) * 2019-08-30 2021-03-04 华为技术有限公司 一种散热器、电子设备及汽车
CN115175519A (zh) * 2019-08-30 2022-10-11 华为技术有限公司 一种散热器、电子设备及汽车

Also Published As

Publication number Publication date
US20170097196A1 (en) 2017-04-06
WO2015194897A1 (ko) 2015-12-23
JP6526067B2 (ja) 2019-06-05
JP2017521861A (ja) 2017-08-03
KR20150145084A (ko) 2015-12-29

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GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20170801