KR20150145084A - 방열 장치 - Google Patents
방열 장치 Download PDFInfo
- Publication number
- KR20150145084A KR20150145084A KR1020140074424A KR20140074424A KR20150145084A KR 20150145084 A KR20150145084 A KR 20150145084A KR 1020140074424 A KR1020140074424 A KR 1020140074424A KR 20140074424 A KR20140074424 A KR 20140074424A KR 20150145084 A KR20150145084 A KR 20150145084A
- Authority
- KR
- South Korea
- Prior art keywords
- heat
- heat dissipation
- inset
- fins
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
- B29C70/885—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding with incorporated metallic wires, nets, films or plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
도 2는 본 발명의 다양한 실시 예들 중 제1실시 예에 따른 방열 장치의 사시도이다.
도 3은 본 발명의 다양한 실시 예들 중 제1실시 예에 따른 방열 장치의 평면도이다.
도 4는 본 발명의 다양한 실시 예들 중 제2실시 예에 따른 방열 장치의 사시도이다.
도 5는 본 발명의 다양한 실시 예들 중 제2실시 예에 따른 방열 장치의 평면도이다.
도 6은 본 발명의 다양한 실시 예들 중 제3실시 예에 따른 방열 장치의 사시도이다.
도 7은 본 발명의 다양한 실시 예들 중 제3실시 예에 따른 방열 장치의 평면도이다.
도 8은 본 발명의 다양한 실시 예들 중 하나의 실시 예에 따른 방열 장치에서, 방열 핀들의 다양한 형상을 나타내는 도면이다.
도 9는 본 발명의 다양한 실시 예들 중 하나의 실시 예에 따른 방열 장치에서, 인셋부의 다양한 형상을 나타내는 도면이다.
도 10은 본 발명의 다양한 실시 예들 중 제1실시 예 및 제2실시 예의 방열 장치에서, 발열모듈에서 발열된 온도의 분포를 나타내는 도면이다.
도 11은 본 발명의 다양한 실시 예들 중 제1실시 예 및 제2실시 예의 방열 장치에서 방열 핀에 따른 방열되는 온도 분포를 나타내는 데이터이다.
121, 122, 123, 124: 방열 핀 131, 132, 133, 134: 방열 영역부
140: 인셋부 170: 발열 모듈
Claims (10)
- 방열 장치에 있어서,
방열 플레이트; 및
상기 방열 플레이트에 구비되고 서로 다른 각도의 방열 핀들이 구비되는 방열 영역부(heat radiating area portion)를 포함하는 방열 장치.
- 제1항에 있어서,
상기 방열 영역부와, 상기 방열 영역부와 이웃한 방열 영역부 사이에는 인셋부(inset portion)가 구비되는 방열 장치.
- 제2항에 있어서,
상기 방열 영역부에 형성되는 상기 방열 핀들과, 상기 방열 영역부와 이웃한 방열 영역부에 제공되는 상기 방열 핀들은 상기 인셋부를 중심으로'V'자 형상을 가지게 구비되는 방열 장치.
- 제2항에 있어서,
상기 인셋부는 적어도 두 개의 인셋 라인을 포함하며,
상기 인셋 라인은 서로 교차되거나, 절곡되게 형성되는 방열 장치.
- 제4항에 있어서,
상기 인셋부는 상기 방열 플레이트 상에 '+' 형상으로 교차 형성되며,
상기 방열 영역부는 상기 인셋 라인을 중심으로 제1,2,3,4 방열 영역으로 구획되는 방열 장치.
- 제5항에 있어서,
상기 제1,2,3,4 방열 영역 상의 제1,2,3,4 방열 핀들은 상기 인셋 라인의 중앙부를 중심으로 'X'자 형상의 서로 다른 각도를 가지는 방열 장치.
- 제5항에 있어서,
상기 제1,2,3,4 방열 영역 상의 제1,2,3,4 방열 핀들은 상기 인셋 라인의 중앙부를 중심으로 마름모 형상의 서로 다른 각도를 가지는 방열 장치.
- 제4항에 있어서,
상기 인셋부는 상기 방열 플레이트 상에 'X'자 형상으로 교차 형성되며,
상기 방열 영역부는 상기 인셋 라인을 중심으로 제1,2,3,4 방열 영역으로 구획되고,
상기 제1,2,3,4 방열 영역 상의 제1,2,3,4 방열 핀들은 상기 인셋 라인의 중앙부를 중심으로 '+'자 형상의 서로 다른 각도를 가지는 방열 장치.
- 제1항에 있어서,
상기 방열 핀들에는 난류를 형성하게 주름부, 절곡부, 돌출부, 개구부 들 중 적어도 하나가 더 포함되는 방열 장치.
- 제1항에 있어서,
서로 이웃한 상기 방열 영역부는 상기 인셋부를 중심으로 대칭으로 구비되는 방열 장치.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140074424A KR20150145084A (ko) | 2014-06-18 | 2014-06-18 | 방열 장치 |
| PCT/KR2015/006216 WO2015194897A1 (ko) | 2014-06-18 | 2015-06-18 | 방열 장치 |
| JP2016574121A JP6526067B2 (ja) | 2014-06-18 | 2015-06-18 | 放熱装置 |
| CN201590000741.8U CN206371029U (zh) | 2014-06-18 | 2015-06-18 | 散热装置 |
| US15/383,476 US20170097196A1 (en) | 2014-06-18 | 2016-12-19 | Heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140074424A KR20150145084A (ko) | 2014-06-18 | 2014-06-18 | 방열 장치 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160130605A Division KR102098802B1 (ko) | 2016-10-10 | 2016-10-10 | 방열 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150145084A true KR20150145084A (ko) | 2015-12-29 |
Family
ID=54935805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140074424A Ceased KR20150145084A (ko) | 2014-06-18 | 2014-06-18 | 방열 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20170097196A1 (ko) |
| JP (1) | JP6526067B2 (ko) |
| KR (1) | KR20150145084A (ko) |
| CN (1) | CN206371029U (ko) |
| WO (1) | WO2015194897A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230076749A (ko) * | 2021-11-24 | 2023-05-31 | 페가트론 코포레이션 | 방열 부품 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015157523A1 (en) * | 2014-04-10 | 2015-10-15 | Advanced Thermal Solutions, Inc. | Multiple flow entrance heat sink |
| CN107105595A (zh) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | 利用散热体排列达低风压需求、低噪音、高效能的散热器 |
| CN106255384B (zh) * | 2016-08-22 | 2019-06-04 | 山东久久星新能源车辆科技有限公司 | 一种散热装置及应用该散热装置的电瓶车 |
| CN108303837B (zh) * | 2017-01-12 | 2020-12-18 | 中强光电股份有限公司 | 投影装置、散热模块及散热鳍片组 |
| CN108105088A (zh) * | 2018-01-30 | 2018-06-01 | 重庆大学 | 一种无油涡旋压缩机的混合型涡盘散热结构 |
| CN112352348B (zh) * | 2018-04-11 | 2024-07-02 | 株式会社Kmw | 多输入输出天线装置 |
| KR102528197B1 (ko) * | 2018-05-31 | 2023-05-04 | 주식회사 케이엠더블유 | 안테나 장치의 방열 기구 |
| WO2019227393A1 (zh) * | 2018-05-31 | 2019-12-05 | 深圳市大疆创新科技有限公司 | 散热系统及摄影摄像设备 |
| JP7021013B2 (ja) * | 2018-06-25 | 2022-02-16 | トヨタ自動車株式会社 | 冷却器 |
| JP7118788B2 (ja) * | 2018-07-19 | 2022-08-16 | 株式会社フジクラ | コールドプレート及びコールドプレートの製造方法 |
| CN208834080U (zh) | 2018-07-23 | 2019-05-07 | 中强光电股份有限公司 | 投影装置、散热模块及散热鳍片 |
| US11011452B2 (en) * | 2018-11-29 | 2021-05-18 | Micron Technology, Inc. | Heat spreaders for semiconductor devices, and associated systems and methods |
| USD971192S1 (en) | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD971900S1 (en) | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
| CN115175519A (zh) * | 2019-08-30 | 2022-10-11 | 华为技术有限公司 | 一种散热器、电子设备及汽车 |
| CN112698541A (zh) * | 2019-10-22 | 2021-04-23 | 中强光电股份有限公司 | 散热模块及使用其的投影装置 |
| JP7587735B2 (ja) * | 2022-02-04 | 2024-11-21 | 株式会社カスタム・クール・センター | 放熱器 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3313339A (en) * | 1965-03-15 | 1967-04-11 | Wakefield Engineering Company | Heat transfer apparatus |
| US4587595A (en) * | 1983-09-06 | 1986-05-06 | Digital Equipment Corporation | Heat sink arrangement with clip-on portion |
| JPH0888301A (ja) * | 1994-09-19 | 1996-04-02 | Mitsubishi Electric Corp | 放熱フィン |
| US5582240A (en) * | 1994-09-19 | 1996-12-10 | Motorola, Inc. | Pneumatically coupled heat sink assembly |
| JP3552559B2 (ja) * | 1998-03-11 | 2004-08-11 | 株式会社デンソー | 発熱体冷却装置 |
| JP3076220U (ja) * | 2000-09-08 | 2001-03-30 | 奇▲宏▼股▲ふん▼有限公司 | ヒートシンクの構造 |
| US6418020B1 (en) * | 2001-03-30 | 2002-07-09 | Advanced Thermal Technologies | Heat dissipation device with ribbed fin plates |
| US7046515B1 (en) * | 2002-06-06 | 2006-05-16 | Raytheon Company | Method and apparatus for cooling a circuit component |
| CN1578614B (zh) * | 2003-06-30 | 2010-04-21 | 山洋电气株式会社 | 轴流风扇装置和发热体冷却装置 |
| KR100719702B1 (ko) * | 2005-05-25 | 2007-05-17 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
| US7423877B2 (en) * | 2006-09-01 | 2008-09-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| CN101516713A (zh) * | 2006-09-19 | 2009-08-26 | 三菱电机株式会社 | 移动体用冷却装置 |
| US20080128110A1 (en) * | 2006-11-30 | 2008-06-05 | Foxconn Technology Co., Ltd. | Heat sink assembly having a fan mounting device |
| US20090129019A1 (en) * | 2007-11-15 | 2009-05-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with fan holder |
| TWI334531B (en) * | 2007-12-05 | 2010-12-11 | Wistron Corp | Heat sink and electronic apparatus using the same |
| TWM339033U (en) * | 2008-04-16 | 2008-08-21 | Asia Vital Components Co Ltd | Heat sink |
-
2014
- 2014-06-18 KR KR1020140074424A patent/KR20150145084A/ko not_active Ceased
-
2015
- 2015-06-18 WO PCT/KR2015/006216 patent/WO2015194897A1/ko not_active Ceased
- 2015-06-18 CN CN201590000741.8U patent/CN206371029U/zh not_active Expired - Lifetime
- 2015-06-18 JP JP2016574121A patent/JP6526067B2/ja not_active Expired - Fee Related
-
2016
- 2016-12-19 US US15/383,476 patent/US20170097196A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230076749A (ko) * | 2021-11-24 | 2023-05-31 | 페가트론 코포레이션 | 방열 부품 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20170097196A1 (en) | 2017-04-06 |
| WO2015194897A1 (ko) | 2015-12-23 |
| JP6526067B2 (ja) | 2019-06-05 |
| JP2017521861A (ja) | 2017-08-03 |
| CN206371029U (zh) | 2017-08-01 |
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