CN210837726U - Heat conduction assembly structure - Google Patents

Abstract

The utility model discloses a heat-conduction subassembly structure, including radiator, a plurality of transistor and a plurality of ceramic gasket, the transistor is located ceramic gasket's top surface, ceramic gasket's bottom surface is supported and is pressed the top surface of radiator is still including fixing insulation board on the top surface of radiator, be equipped with a plurality of locating holes on the insulation board, ceramic gasket is located in the locating hole, still be equipped with on the insulation board and support and press the mounting of ceramic gasket's top surface. The surface of the radiator in the heat conduction assembly structure is complete and undamaged, so that the surface of the radiator is high in flatness and good in consistency, the heat conduction assembly structure has excellent heat conduction reliability, a positioning groove does not need to be machined on the radiator, and machining cost is effectively saved; in addition, the fixing piece on the insulating plate can effectively fix the ceramic gasket in the positioning hole, thereby avoiding the accidental separation of the ceramic gasket and improving the structural stability of the heat conduction assembly.

Description

A heat conduction assembly structure

technical field

The utility model relates to the technical field of transistor cooling devices, in particular to a heat conduction component structure.

Background technique

Some power supply devices have thermal conduction components. The traditional thermal conduction components include transistors (as heating elements), ceramic gaskets and heat sinks. The ceramic gaskets are used to conduct heat and insulate the transistors. Specifically, the transistors are arranged on the top surface of the ceramic gaskets. , the bottom surface of the ceramic spacer is attached to the heat sink.

In order to ensure that the ceramic gasket does not shift on the radiator, the prior art chooses to process a positioning groove on the radiator for positioning the ceramic gasket, so that the ceramic gasket can be positioned more accurately, thereby ensuring the transistor heat dissipation performance and insulation performance.

When the number of ceramic gaskets used in the heat conduction assembly is large, the cost of machining the positioning grooves on the heat sink is high, and it is difficult to ensure the consistency of the flatness of the positioning grooves. Poor flatness of the positioning grooves will directly affect the Thermal conductivity of transistors.

Utility model content

The technical problem to be solved by the utility model is to provide a low-cost heat conduction component with reliable heat conduction.

In order to solve the above technical problems, the technical solution adopted by the present invention is as follows: a heat conduction component structure includes a heat sink, a plurality of transistors and a plurality of ceramic spacers, the transistors are arranged on the top surface of the ceramic spacer, and the The bottom surface of the ceramic gasket presses against the top surface of the radiator, and also includes an insulating plate fixed on the top surface of the radiator, the insulating plate is provided with a plurality of positioning holes, and the ceramic gasket is positioned In the positioning hole, the insulating plate is further provided with a fixing member pressing against the top surface of the ceramic gasket.

Further, the number of the ceramic spacers is equal to the number of the positioning holes, and the ceramic spacers and the positioning holes are arranged in a one-to-one correspondence.

Further, the bottom surface of the ceramic gasket is provided with thermally conductive silica gel.

Further, a breaking groove is provided on the insulating plate, and at least two of the positioning holes are communicated through the breaking groove.

Further, the insulating plate is connected with the heat sink by adhesive, screw connection or snap connection.

Further, the fixing member is a screw.

Further, the fixing member is a buckle, and the opposite sides of the positioning hole are respectively provided with the buckle.

Further, the buckle includes a vertical part and a buckle part, one end of the vertical part is connected to the insulating plate, the other end of the vertical part is connected to the buckle part, and the other end of the vertical part is connected to the buckle part. The bottom surface presses against the top surface of the ceramic gasket.

Further, one side surface of the vertical portion abuts the side surface of the ceramic gasket.

Further, a connecting piece penetrating through the ceramic gasket is also included, and the transistor is fixedly connected to the heat sink through the connecting piece.

The beneficial effect of the utility model is that: the heat conduction assembly structure positions the ceramic gasket by adding an insulating plate with a positioning hole, which effectively ensures the positioning accuracy of the ceramic gasket and thus ensures the heat dissipation performance and insulation performance of the transistor; Compared with the traditional positioning method of machining positioning grooves on the heat sink, the surface of the heat sink in the structure of the heat conduction assembly is complete and undamaged, so the surface of the heat sink has high flatness and good consistency, making the structure of the heat conduction assembly excellent. The heat conduction reliability is high, and there is no need to process the positioning groove on the radiator, which effectively saves the processing cost; in addition, the fixing member on the insulating plate can effectively fix the ceramic gasket located in the positioning hole, avoiding the ceramic gasket. Accidental disengagement improves the structural stability of the thermally conductive assembly.

Description of drawings

FIG. 1 is an assembly diagram of the structure of the heat conduction assembly according to the first embodiment of the present invention;

FIG. 2 is a schematic diagram of the structure of the heat conduction assembly according to the first embodiment of the present invention;

FIG. 3 is a schematic diagram of an insulating plate of the heat conduction assembly structure according to the first embodiment of the present invention.

Label description:

1. Heat sink; 2. Transistor; 3. Ceramic gasket; 4. Insulating plate;

41. Positioning hole; 42. Buckle; 43. Breaking groove; 5. Connecting piece;

6. Screws.

Detailed ways

In order to describe in detail the technical content, achieved objects and effects of the present invention, the following descriptions are given with reference to the embodiments and the accompanying drawings.

The most critical concept of the present invention is that the plurality of ceramic gaskets 3 located on the top surface of the radiator 1 are positioned and fixed through the insulating plate 4 provided with a plurality of positioning holes 41, so as to ensure the flatness of the top surface of the radiator 1. Consistency and reliable thermal conductivity, which greatly saves processing costs.

Please refer to FIGS. 1 to 3 , a thermally conductive component structure includes a heat sink 1 , a plurality of transistors 2 and a plurality of ceramic gaskets 3 , the transistors 2 are arranged on the top surface of the ceramic gasket 3 , and the ceramic The bottom surface of the gasket 3 presses against the top surface of the radiator 1, and further includes an insulating plate 4 fixed on the top surface of the radiator 1. The insulating plate 4 is provided with a plurality of positioning holes 41. The ceramic gasket 3 is positioned in the positioning hole 41 , and the insulating plate 4 is further provided with a fixing member pressing against the top surface of the ceramic gasket 3 .

As can be seen from the above description, the beneficial effect of the present invention is that: the heat conduction assembly structure positions the ceramic gasket by adding an insulating plate with a positioning hole, which effectively ensures the positioning accuracy of the ceramic gasket and thus ensures the heat dissipation of the transistor. Compared with the traditional positioning method of machining positioning grooves on the radiator, the surface of the radiator in the structure of the heat conduction component is complete and undamaged, so the surface of the radiator has high flatness and good consistency, making The structure of the heat conduction assembly has excellent heat conduction reliability, and there is no need to process positioning grooves on the radiator, which effectively saves the processing cost; in addition, the fixing member on the insulating plate can effectively fix the ceramic gasket located in the positioning hole , to avoid the accidental separation of the ceramic gasket, and improve the structural stability of the heat conduction assembly.

Further, the number of the ceramic spacers 3 is equal to the number of the positioning holes 41 , and the ceramic spacers 3 are arranged in a one-to-one correspondence with the positioning holes 41 .

It can be seen from the above description that the number of positioning holes on the insulating plate is equal to the number of ceramic spacers and one-to-one correspondence can be used to position each ceramic spacer independently, which further ensures the accuracy of positioning the ceramic spacer on the top surface of the radiator. .

Further, the bottom surface of the ceramic gasket 3 is provided with thermally conductive silica gel.

It can be seen from the above description that the thermally conductive silica gel can guide the heat accumulated on the ceramic gasket to the heat sink more quickly, thereby improving the thermal conductivity of the heat conduction component.

Further, the insulating plate 4 is provided with a breaking groove 43 , and at least two of the positioning holes 41 are communicated through the breaking groove 43 .

It can be seen from the above description that the setting of the breaking groove can provide convenience for the processing of the positioning hole, and allow multiple positioning blocks to realize continuous processing without raising the knife, which is beneficial to improve the production efficiency.

Further, the insulating plate 4 is connected with the radiator 1 by gluing, connected by screws 6 or buckled.

It can be seen from the above description that the insulating plate 4 and the heat sink 1 can be connected by various connection methods, which can be selected according to requirements, which increases the applicable scope of the structure of the heat conduction assembly.

Further, the fixing member is a screw.

It can be seen from the above description that selecting the screw as the fixing member can better fix the ceramic gasket 3 .

Further, the fixing member is a buckle 42 , and the opposite sides of the positioning hole 41 are respectively provided with the buckle 42 .

As can be seen from the above description, the provision of snaps 42 on opposite sides of the positioning hole 41 can better fix the ceramic gasket 3 .

Further, the buckle 42 includes a vertical portion and a buckle portion, one end of the vertical portion is connected to the insulating plate 4, the other end of the vertical portion is connected to the buckle portion, and the buckle The bottom surface of the part is pressed against the top surface of the ceramic gasket 3 .

As can be seen from the above description, the buckling portion presses against the top surface of the ceramic gasket 3 so that the ceramic gasket 3 can better fit on the top surface of the heat sink 1, thereby ensuring the stability of heat conduction.

Further, one side surface of the vertical portion abuts the side surface of the ceramic gasket 3 .

It can be seen from the above description that the vertical portion abutting the side surface of the ceramic gasket 3 can better prevent the ceramic gasket 3 from being offset.

Further, a connector 5 extending through the ceramic gasket 3 is also included, and the transistor 2 is fixedly connected to the heat sink 1 through the connector 5 .

It can be seen from the above description that the transistor 2 can be better fixed on the heat sink 1 by providing the connecting member 5, and the ceramic gasket 3 is further fixed at the same time.

Example 1

Referring to FIGS. 1 to 3 , a first embodiment of the present invention is a thermally conductive component structure including a heat sink 1 , a plurality of transistors 2 and a plurality of ceramic pads 3 , the transistors 2 are disposed on the ceramic pads The top surface of the sheet 3, the bottom surface of the ceramic gasket 3 is pressed against the top surface of the radiator 1, and also includes an insulating plate 4 fixed on the top surface of the radiator 1. There are a plurality of positioning holes 41 , the ceramic gasket 3 is positioned in the positioning holes 41 , and the insulating plate 4 is further provided with a fixing member pressing against the top surface of the ceramic gasket 3 . In this embodiment, the number of the transistors 2 , the ceramic spacers 3 and the positioning holes 41 is two respectively, one of the transistors 2 is mounted on one of the ceramic spacers 3 correspondingly, and one of the ceramic spacers 3 is correspondingly positioned on the In one positioning hole 41 , that is, using the thermal conduction assembly structure of this embodiment, two transistors 2 and the respectively connected ceramic gaskets 3 can be simultaneously positioned in the positioning hole 41 and fixedly connected to the heat sink 1 . In other embodiments, the number of transistors 2 , ceramic spacers 3 , and positioning holes 41 may also be larger.

The number of the ceramic spacers 3 is equal to the number of the positioning holes 41 , the ceramic spacers 3 are arranged in a one-to-one correspondence with the positioning holes 41 , and the insulating plate 4 has an equal number of the ceramic spacers 3 and one space. A corresponding positioning hole 41 can be used to position each ceramic gasket 3 independently, which further ensures the stability of the ceramic gasket 3 on the top surface of the heat sink 1 . The shape of the ceramic gasket 3 can be arbitrary. Correspondingly, the shape of the positioning hole 41 matches the shape of the ceramic gasket 3. In this embodiment, the shape of the ceramic gasket 3 is The shape of the corresponding positioning hole 41 is also a rectangle.

The bottom surface of the ceramic gasket 3 is provided with thermally conductive silica gel, which has good thermal conductivity and adhesiveness, and can further fix the ceramic gasket 3 .

The insulating plate 4 is provided with a breaking groove 43, and at least two of the positioning holes 41 are communicated through the breaking groove 43. The breaking groove 43 finely adjusts the position of the ceramic gasket 3 .

The insulating plate 4 and the radiator 1 are glued, screwed or buckled; in this embodiment, screws 6 are selected to connect the insulating plate 4 and the radiator 1, and the screws 6 can be selected from plastic screws.

In other embodiments, the fixing member is a screw. After the positioning plate is installed, the ceramic gasket 3 can be placed in the positioning hole 41, and after the position of the ceramic gasket 3 is adjusted, the ceramic gasket The positioning of the ceramic gasket 3 can be completed by pressing the top surface of the sheet 3 . However, in this embodiment, the fixing member is a buckle 42 , and the buckles 42 are respectively provided on opposite sides of the positioning hole 41 ; first place the ceramic gasket 3 on the top of the heat sink 1 The positioning of the ceramic gasket 3 can be completed by fixing the positioning plate to the corresponding position on the top surface of the heat sink 1 .

The buckle 42 includes a vertical portion and a buckle portion, one end of the vertical portion is connected to the insulating plate 4, the other end of the vertical portion is connected to the buckle portion, and the bottom surface of the buckle portion is Pressing the top surface of the ceramic gasket 3, the buckling portion presses against the top surface of the ceramic gasket 3, so that the ceramic gasket 3 can better fit on the top surface of the radiator 1, ensuring the stability of heat conduction.

One side surface of the vertical portion is in contact with the side surface of the ceramic gasket 3 , and the vertical portion abutting the side surface of the ceramic gasket 3 can better prevent the ceramic gasket 3 from being offset.

It also includes a connecting piece 5 penetrating the ceramic gasket 3 , the transistor 2 is fixedly connected to the heat sink 1 through the connecting piece 5 , and the transistor 2 can be better fixed on the heat sink by setting the connecting piece 5 . At the same time, the ceramic gasket 3 is further fixed, and the connecting piece 5 can be optionally connected with screws.

To sum up, the structure of the heat conduction component provided by the present invention has the characteristics of reliable heat conduction, low processing cost, simple structure and wide application range.

The above are only the embodiments of the present utility model, and are not intended to limit the scope of the present utility model patent. All equivalent transformations made by using the contents of the present utility model description and accompanying drawings, or directly or indirectly applied in related technical fields, are the same as The principles are included in the scope of patent protection of the present invention.

Claims (10)

1. A heat conduction assembly structure, comprising a heat sink, a plurality of transistors and a plurality of ceramic spacers, the transistors are arranged on the top surface of the ceramic spacer, and the bottom surface of the ceramic spacer presses against the heat sink. The top surface is characterized in that: it further comprises an insulating plate fixed on the top surface of the radiator, the insulating plate is provided with a plurality of positioning holes, the ceramic gasket is positioned in the positioning holes, and the The insulating plate is also provided with a fixing member that presses against the top surface of the ceramic gasket. 2 . The heat conduction assembly structure according to claim 1 , wherein the number of the ceramic spacers is equal to the number of the positioning holes, and the ceramic spacers and the positioning holes are arranged in a one-to-one correspondence. 3 . 3. The structure of claim 1, wherein the bottom surface of the ceramic gasket is provided with thermally conductive silica gel. 4 . The heat conduction assembly structure according to claim 1 , wherein a breaking groove is provided on the insulating plate, and at least two of the positioning holes communicate with each other through the breaking groove. 5 . 5 . The heat conduction assembly structure according to claim 1 , wherein the insulating plate and the heat sink are connected by glue, screw or buckle. 6 . 6 . The heat conduction assembly structure according to claim 1 , wherein the fixing member is a screw. 7 . 7 . The heat conduction assembly structure according to claim 1 , wherein the fixing member is a buckle, and the opposite sides of the positioning hole are respectively provided with the buckle. 8 . 8 . The heat conduction assembly structure according to claim 7 , wherein the buckle comprises a vertical portion and a snap-fit portion, one end of the vertical portion is connected to the insulating plate, and the other end of the vertical portion is connected to the insulating plate. 9 . One end is connected to the buckling portion, and the bottom surface of the buckling portion presses against the top surface of the ceramic gasket. 9 . The heat conduction assembly structure according to claim 8 , wherein a side surface of the vertical portion abuts a side surface of the ceramic gasket. 10 . 10 . The thermal conduction assembly structure according to claim 1 , further comprising a connecting piece penetrating the ceramic gasket, and the transistor is fixedly connected to the heat sink through the connecting piece. 11 .

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