CN210837726U - Heat conduction assembly structure - Google Patents
Heat conduction assembly structure Download PDFInfo
- Publication number
- CN210837726U CN210837726U CN201922049941.5U CN201922049941U CN210837726U CN 210837726 U CN210837726 U CN 210837726U CN 201922049941 U CN201922049941 U CN 201922049941U CN 210837726 U CN210837726 U CN 210837726U
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- Prior art keywords
- radiator
- heat conduction
- ceramic
- ceramic gasket
- assembly structure
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- 239000000919 ceramic Substances 0.000 claims abstract description 107
- 238000009413 insulation Methods 0.000 claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat-conduction subassembly structure, including radiator, a plurality of transistor and a plurality of ceramic gasket, the transistor is located ceramic gasket's top surface, ceramic gasket's bottom surface is supported and is pressed the top surface of radiator is still including fixing insulation board on the top surface of radiator, be equipped with a plurality of locating holes on the insulation board, ceramic gasket is located in the locating hole, still be equipped with on the insulation board and support and press the mounting of ceramic gasket's top surface. The surface of the radiator in the heat conduction assembly structure is complete and undamaged, so that the surface of the radiator is high in flatness and good in consistency, the heat conduction assembly structure has excellent heat conduction reliability, a positioning groove does not need to be machined on the radiator, and machining cost is effectively saved; in addition, the fixing piece on the insulating plate can effectively fix the ceramic gasket in the positioning hole, thereby avoiding the accidental separation of the ceramic gasket and improving the structural stability of the heat conduction assembly.
Description
Technical Field
The utility model relates to a transistor heat abstractor technical field especially relates to a heat-conduction subassembly structure.
Background
Some power supply devices have a heat conduction assembly, and a conventional heat conduction assembly includes a transistor (as a heat-generating body), a ceramic pad and a heat sink, the ceramic pad is used for conducting heat and insulating heat to the transistor, specifically, the transistor is disposed on a top surface of the ceramic pad, and a bottom surface of the ceramic pad is connected to the heat sink.
In order to ensure that the ceramic gasket does not deviate on the radiator, the prior art can select a positioning groove for positioning the ceramic gasket to be processed on the radiator, so that the ceramic gasket can be accurately positioned, and the heat radiation performance and the insulation performance of the transistor are ensured.
When the quantity of the ceramic gaskets used in the heat conduction assembly is large, the cost of machining the positioning groove on the radiator is high, the uniformity of the flatness of the positioning groove is difficult to ensure, and the flatness of the positioning groove cannot directly influence the heat conduction performance of the transistor.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: a low-cost heat conduction assembly that conducts heat reliably is provided.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a heat conduction subassembly structure, includes radiator, a plurality of transistor and a plurality of ceramic gasket, the transistor is located the top surface of ceramic gasket, the bottom surface of ceramic gasket supports and presses the top surface of radiator still including fixing insulation board on the top surface of radiator, be equipped with a plurality of locating holes on the insulation board, the ceramic gasket is located in the locating hole, still be equipped with on the insulation board and support and press the mounting of the top surface of ceramic gasket.
Furthermore, the number of the ceramic gaskets is equal to that of the positioning holes, and the ceramic gaskets are arranged in one-to-one correspondence with the positioning holes.
Furthermore, the bottom surface of the ceramic gasket is provided with heat-conducting silica gel.
Furthermore, the insulation board is provided with a breaking groove, and at least two positioning holes are communicated through the breaking groove.
Further, the insulating plate is connected with the radiator in an adhesive manner, in a screw manner or in a fastening manner.
Further, the fixing piece is a screw.
Further, the fixing piece is a buckle, and the buckle is respectively arranged on two opposite sides of the positioning hole.
Further, the buckle comprises a vertical portion and a buckling portion, one end of the vertical portion is connected with the insulating plate, the other end of the vertical portion is connected with the buckling portion, and the bottom surface of the buckling portion abuts against the top surface of the ceramic gasket.
Further, a side surface of the vertical portion abuts against a side surface of the ceramic gasket.
Furthermore, the transistor also comprises a connecting piece penetrating through the ceramic gasket, and the transistor is fixedly connected with the radiator through the connecting piece.
The beneficial effects of the utility model reside in that: the heat conduction assembly structure positions the ceramic gasket by additionally arranging the insulating plate with the positioning hole, so that the positioning precision of the ceramic gasket is effectively ensured, and the heat dissipation performance and the insulating performance of the transistor are further ensured; compared with the traditional positioning mode of processing the positioning groove on the radiator, the surface of the radiator in the heat conduction assembly structure is complete and is not damaged, so that the surface flatness and the consistency of the radiator are high, the heat conduction assembly structure has excellent heat conduction reliability, the positioning groove does not need to be processed on the radiator, and the processing cost is effectively saved; in addition, the fixing piece on the insulating plate can effectively fix the ceramic gasket in the positioning hole, thereby avoiding the accidental separation of the ceramic gasket and improving the structural stability of the heat conduction assembly.
Drawings
Fig. 1 is an assembly view of a heat conduction assembly according to a first embodiment of the present invention;
fig. 2 is a schematic view of a heat conduction assembly according to a first embodiment of the present invention;
fig. 3 is a schematic view of an insulating plate of a heat conduction assembly structure according to a first embodiment of the present invention.
Description of reference numerals:
1. a heat sink; 2. a transistor; 3. a ceramic gasket; 4. an insulating plate;
41. positioning holes; 42. buckling; 43. breaking the groove; 5. a connecting member;
6. and (4) screws.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The utility model discloses the most crucial design lies in: the insulating plate 4 with the positioning holes 41 is used for positioning and fixing the ceramic gaskets 3 on the top surface of the radiator 1, so that the consistency of the flatness of the top surface of the radiator 1 is ensured, the heat conducting performance is reliable, and the processing cost is greatly saved.
Referring to fig. 1 to 3, a heat conduction assembly structure includes a heat sink 1, a plurality of transistors 2, a plurality of ceramic pads 3, the transistors 2 being disposed on top surfaces of the ceramic pads 3, bottom surfaces of the ceramic pads 3 abutting against top surfaces of the heat sink 1, and an insulating plate 4 fixed on the top surface of the heat sink 1, the insulating plate 4 being provided with a plurality of positioning holes 41, the ceramic pads 3 being positioned in the positioning holes 41, the insulating plate 4 being further provided with fixing members abutting against top surfaces of the ceramic pads 3.
From the above description, the beneficial effects of the present invention are: the heat conduction assembly structure positions the ceramic gasket by additionally arranging the insulating plate with the positioning hole, so that the positioning precision of the ceramic gasket is effectively ensured, and the heat dissipation performance and the insulating performance of the transistor are further ensured; compared with the traditional positioning mode of processing the positioning groove on the radiator, the surface of the radiator in the heat conduction assembly structure is complete and is not damaged, so that the surface flatness and the consistency of the radiator are high, the heat conduction assembly structure has excellent heat conduction reliability, the positioning groove does not need to be processed on the radiator, and the processing cost is effectively saved; in addition, the fixing piece on the insulating plate can effectively fix the ceramic gasket in the positioning hole, thereby avoiding the accidental separation of the ceramic gasket and improving the structural stability of the heat conduction assembly.
Further, the number of the ceramic spacers 3 is equal to the number of the positioning holes 41, and the ceramic spacers 3 are arranged in one-to-one correspondence with the positioning holes 41.
According to the description, the positioning holes which are equal to the ceramic gaskets in number and correspond to the ceramic gaskets in one-to-one mode are formed in the insulating plate, so that each ceramic gasket can be independently positioned, and the positioning accuracy of the ceramic gaskets on the top surface of the radiator is further ensured.
Further, the bottom surface of the ceramic gasket 3 is provided with heat-conducting silica gel.
From the above description, it can be known that the heat conducting silica gel can guide the heat accumulated on the ceramic gasket to the radiator more quickly, and the heat conducting performance of the heat conducting assembly is improved.
Furthermore, the insulating plate 4 is provided with a breaking groove 43, and at least two positioning holes 41 are communicated through the breaking groove 43.
According to the above description, the arrangement of the breaking groove can provide convenience for processing the positioning holes, and the plurality of positioning blocks can be processed continuously without lifting a cutter, so that the production efficiency is improved.
Further, the insulating plate 4 is connected with the heat sink 1 by gluing, screws 6 or fastening.
As can be seen from the above description, the insulating plate 4 and the heat sink 1 can be connected by various connection methods, which can be selected according to the requirement, and the application range of the heat conduction assembly structure is increased.
Further, the fixing piece is a screw.
As can be seen from the above description, the ceramic washer 3 can be better fixed by using screws as the fixing members.
Further, the fixing member is a buckle 42, and the buckles 42 are respectively disposed on two opposite sides of the positioning hole 41.
As can be seen from the above description, the ceramic washer 3 can be better fixed by providing the snaps 42 on the opposite sides of the positioning hole 41.
Further, the buckle 42 includes a vertical portion and a buckling portion, one end of the vertical portion is connected to the insulating plate 4, the other end of the vertical portion is connected to the buckling portion, and the bottom surface of the buckling portion abuts against the top surface of the ceramic gasket 3.
From the above description, the buckling part is pressed against the top surface of the ceramic gasket 3, so that the ceramic gasket 3 can be better attached to the top surface of the heat sink 1, and the stability of heat conduction is ensured.
Further, a side surface of the vertical portion abuts against a side surface of the ceramic gasket 3.
As can be seen from the above description, the vertical portion abutting against the side surface of the ceramic gasket 3 can better prevent the ceramic gasket 3 from being deviated.
Furthermore, the device also comprises a connecting piece 5 penetrating through the ceramic gasket 3, and the transistor 2 is fixedly connected with the heat radiator 1 through the connecting piece 5.
As can be seen from the above description, the transistor 2 can be better fixed to the heat sink 1 by providing the connection piece 5, while the ceramic pad 3 is further fixed.
Example one
Referring to fig. 1 to fig. 3, a first embodiment of the present invention is: the utility model provides a heat conduction assembly structure, includes radiator 1, a plurality of transistor 2 and a plurality of ceramic gasket 3, transistor 2 locates the top surface of ceramic gasket 3, the bottom surface of ceramic gasket 3 supports and presses the top surface of radiator 1 still including fixing insulation board 4 on the top surface of radiator 1, be equipped with a plurality of locating holes 41 on the insulation board 4, ceramic gasket 3 is located in the locating hole 41, still be equipped with on the insulation board 4 and support the mounting of pressing the top surface of ceramic gasket 3. In this embodiment, the number of the transistors 2, the number of the ceramic pads 3, and the number of the positioning holes 41 are two, one transistor 2 is correspondingly mounted on one ceramic pad 3, and one ceramic pad 3 is correspondingly positioned in one positioning hole 41, that is, the heat conduction assembly structure of this embodiment can simultaneously position two transistors 2 and the ceramic pads 3 connected respectively in the positioning holes 41 and fixedly connect with the heat sink 1. In other embodiments, the number of transistors 2, ceramic spacers 3, and positioning holes 41 may be increased.
The number of the ceramic gaskets 3 is equal to that of the positioning holes 41, the ceramic gaskets 3 are arranged in one-to-one correspondence with the positioning holes 41, the positioning holes 41 which are equal to the number of the ceramic gaskets 3 and in one-to-one correspondence with the ceramic gaskets 3 are formed in the insulating plate 4, so that each ceramic gasket 3 can be positioned independently, and the stability of the ceramic gaskets 3 on the top surface of the radiator 1 is further ensured. The shape of the ceramic gasket 3 may be any shape, and correspondingly, the shape of the positioning hole 41 matches with the shape of the ceramic gasket 3, in this embodiment, the shape of the ceramic gasket 3 is rectangular, and the shape of the positioning hole 41 corresponding to the ceramic gasket is also rectangular.
The bottom surface of ceramic pad 3 is equipped with heat conduction silica gel, and heat conduction silica gel has good heat conductivity and glues viscidity, can further fix ceramic pad 3.
The insulating plate 4 is provided with breaking grooves 43, at least two positioning holes 41 are communicated through the breaking grooves 43, the breaking grooves 43 enable the ceramic gasket 3 to conduct heat better, and meanwhile, the positions of the ceramic gasket 3 can be finely adjusted through the breaking grooves 43.
The insulating plate 4 is connected with the radiator 1 by gluing, screws or fastening; in the present embodiment, the insulating plate 4 and the heat sink 1 are connected by using screws 6, and the screws 6 may be plastic screws.
In other embodiments, the fixing element is a screw, the ceramic gasket 3 can be placed in the positioning hole 41 after the positioning plate is installed, and after the position of the ceramic gasket 3 is adjusted, the top surface of the ceramic gasket 3 is pressed by the screw, so that the ceramic gasket 3 can be positioned. However, in this embodiment, the fixing element is a buckle 42, and the buckles 42 are respectively disposed on two opposite sides of the positioning hole 41; firstly, the ceramic gasket 3 is placed at the corresponding position of the top surface of the radiator 1, and then the positioning plate is fixed at the corresponding position of the top surface of the radiator 1, so that the positioning of the ceramic gasket 3 can be completed.
The buckle 42 comprises a vertical portion and a buckling portion, one end of the vertical portion is connected with the insulating plate 4, the other end of the vertical portion is connected with the buckling portion, the bottom surface of the buckling portion is abutted against the top surface of the ceramic gasket 3, and the buckling portion is abutted against the top surface of the ceramic gasket 3 so that the ceramic gasket 3 can be better attached to the top surface of the radiator 1, and the stability of heat conduction is ensured.
A side of vertical portion is contradicted the side of ceramic pad 3, and the side that ceramic pad 3 was contradicted to vertical portion can avoid ceramic pad 3 to take place the skew better.
Still including running through ceramic pad 3's connecting piece 5, transistor 2 pass through connecting piece 5 with radiator 1 fixed connection, through setting up connecting piece 5 can fix transistor 2 on radiator 1 better, has carried out further fixed to ceramic pad 3 simultaneously, connecting piece 5 optional connection screw.
To sum up, the utility model provides a pair of heat-conduction subassembly structure has the characteristics that the heat conduction is reliable, the processing cost is low, simple structure, application scope are wide.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a heat-conduction subassembly structure, includes radiator, a plurality of transistor and a plurality of ceramic gasket, the transistor is located the top surface of ceramic gasket, the bottom surface of ceramic gasket supports and presses the top surface of radiator, its characterized in that: the radiator is characterized by further comprising an insulating plate fixed on the top surface of the radiator, a plurality of positioning holes are formed in the insulating plate, the ceramic gasket is positioned in the positioning holes, and a fixing piece abutting against the top surface of the ceramic gasket is further arranged on the insulating plate.
2. The heat conduction assembly structure of claim 1, wherein: the number of the ceramic gaskets is equal to that of the positioning holes, and the ceramic gaskets are arranged in one-to-one correspondence with the positioning holes.
3. The heat conduction assembly structure of claim 1, wherein: and the bottom surface of the ceramic gasket is provided with heat-conducting silica gel.
4. The heat conduction assembly structure of claim 1, wherein: the insulation board is provided with a breaking groove, and at least two positioning holes are communicated through the breaking groove.
5. The heat conduction assembly structure of claim 1, wherein: the insulating plate is connected with the radiator in an adhesive manner, in a screw connection manner or in a fastening manner.
6. The heat conduction assembly structure of claim 1, wherein: the fixing piece is a screw.
7. The heat conduction assembly structure of claim 1, wherein: the fixing piece is a buckle, and the buckle is respectively arranged on two opposite sides of the positioning hole.
8. The heat conduction assembly structure of claim 7, wherein: the buckle comprises a vertical portion and a buckling portion, one end of the vertical portion is connected with the insulating plate, the other end of the vertical portion is connected with the buckling portion, and the bottom surface of the buckling portion abuts against the top surface of the ceramic gasket.
9. The heat conduction assembly structure of claim 8, wherein: a side surface of the vertical portion abuts against a side surface of the ceramic gasket.
10. The heat conduction assembly structure of claim 1, wherein: the transistor is fixedly connected with the radiator through the connecting piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922049941.5U CN210837726U (en) | 2019-11-22 | 2019-11-22 | Heat conduction assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922049941.5U CN210837726U (en) | 2019-11-22 | 2019-11-22 | Heat conduction assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210837726U true CN210837726U (en) | 2020-06-23 |
Family
ID=71279566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922049941.5U Active CN210837726U (en) | 2019-11-22 | 2019-11-22 | Heat conduction assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210837726U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025130180A1 (en) * | 2023-12-19 | 2025-06-26 | 广东美的暖通设备有限公司 | Insulating thermally-conductive gasket, electric control device and air conditioner |
-
2019
- 2019-11-22 CN CN201922049941.5U patent/CN210837726U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025130180A1 (en) * | 2023-12-19 | 2025-06-26 | 广东美的暖通设备有限公司 | Insulating thermally-conductive gasket, electric control device and air conditioner |
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