CN217536165U - Micro-etching equipment for pretreatment of circuit board metallization - Google Patents

Micro-etching equipment for pretreatment of circuit board metallization Download PDF

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Publication number
CN217536165U
CN217536165U CN202221699794.1U CN202221699794U CN217536165U CN 217536165 U CN217536165 U CN 217536165U CN 202221699794 U CN202221699794 U CN 202221699794U CN 217536165 U CN217536165 U CN 217536165U
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CN
China
Prior art keywords
shell
circuit board
spraying
moving block
fixedly connected
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Expired - Fee Related
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CN202221699794.1U
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Chinese (zh)
Inventor
王建新
雷洪高
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Chongqing Xinyefeng Electronic Technology Co ltd
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Chongqing Xinyefeng Electronic Technology Co ltd
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Publication of CN217536165U publication Critical patent/CN217536165U/en
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Abstract

The utility model relates to the technical field of circuit board microetching, in particular to a microetching device for the pretreatment of circuit board metallization; comprises a spraying device, and a rotating device and a conveying carrier roller which are arranged on the front side and the rear side of the spraying device in sequence; a pushing cylinder is arranged at the bottom of the conveying carrier roller at the front side, the rotating device can be aligned to the pushing cylinder, and a slat is vertically and fixedly connected to a piston of the pushing cylinder; the spraying device comprises a shell, conveying mechanisms and spraying pipelines, wherein the conveying mechanisms are symmetrically arranged in the shell up and down; a return air cylinder is arranged at the top of the spraying device, the return air cylinder can be aligned to the rotating device on the right side, and a push plate is fixedly connected to a return air cylinder piston; the utility model provides a two sides inhomogeneous problem of spraying about the circuit board.

Description

Micro-etching equipment for pretreatment of circuit board metallization
Technical Field
The application relates to the technical field of circuit board microetching, and particularly discloses microetching equipment for pretreatment of circuit board metallization.
Background
Copper on the circuit board is mainly red copper, and copper welding points are easily oxidized in the air, so poor tin soldering or poor contact can be caused, and the performance of the circuit board is reduced; the method comprises the following steps of performing circuit board chemical plating, namely performing chemical deposition on a circuit board, wherein a metal coating is generated on the surface of the circuit board through a chemical oxidation-reduction reaction by adopting a chemical deposition method; the gold immersion is to plate gold on the gold immersion, and the gold can effectively prevent the copper metal and air from generating oxidation reaction; the microetching process is a key step of processing the circuit board, namely, the microetching process adopts chemical liquid to etch a required circuit; the circuit board etching machine is a common device in a circuit board etching treatment process, a carrier roller in the etching machine transports a circuit board, and when the circuit board passes through the etching machine, an upper nozzle and a lower nozzle arranged in the etching machine spray micro-etching liquid on the circuit board; the lower nozzle is arranged below the carrier roller, and the upper surface and the lower surface of the circuit board are not uniformly sprayed due to the blocking of the carrier roller; the spraying amount of the nozzles on the upper surface and the lower surface of the circuit board is different, and the spraying pressure of the upper nozzle and the lower nozzle needs to be adjusted to achieve the purpose of uniformly spraying the two surfaces of the circuit board; the difference between the liquid ejection pressures of the upper and lower nozzles is adjusted according to the actual operation result.
In view of the above, the present invention provides a microetching apparatus for pretreatment of metallization on a circuit board, so as to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board gold processing is with declining equipment that loses to the inhomogeneous problem of two sides spraying about solving the circuit board.
In order to achieve the purpose, the basic scheme of the utility model provides a microetching device for the pretreatment of the circuit board chemical gold, which comprises a spraying device, a rotating device and a conveying carrier roller, wherein the rotating device and the conveying carrier roller are sequentially arranged on the front side and the rear side of the spraying device; the bottom of the conveying carrier roller at the front side is provided with a material pushing cylinder, the rotating device can be aligned to the material pushing cylinder, and a batten is vertically and fixedly connected to a piston of the material pushing cylinder; the spraying device comprises a shell, conveying mechanisms which are symmetrically arranged in the shell up and down, and spraying pipelines which are symmetrically arranged in the shell; the conveying mechanism comprises a supporting shell, a guide wheel, a supporting shaft and a transmission shaft; the front end and the rear end of the support shell are fixedly connected in the shell, the support shaft is rotatably connected to two sides of the support shell, the guide wheel is fixedly connected to the bottom of the support shaft, and the top end of the support shaft penetrates through the support shell and is sequentially provided with a first gear and a first bevel gear; the inner side of the supporting shell is rotatably connected with a bearing wheel; the transmission shaft is rotatably arranged on the shell above the supporting shaft, and second bevel gears are uniformly arranged on the transmission shaft and meshed with the first bevel gears; the first bevel gears arranged on the support shafts on the two sides of the support shell are meshed with each other; the top of the shell is provided with a feed back cylinder, the feed back cylinder can be aligned to the rotating device on the right side, and a push plate is fixedly connected to a piston of the feed back cylinder.
By adopting the technical scheme, the method has the advantages that: the circuit board enters a spraying device, a transmission shaft rotates, a second bevel gear drives a first bevel gear to rotate, the first bevel gears arranged on support shafts on two sides of a support shell are meshed with each other, guide wheels on two sides of the support shell rotate oppositely, and the circuit board is conveyed to the right side; the bearing wheels are contacted with the top and bottom ends of the circuit board and rotate along with the circuit board, so that dry friction is avoided; the spraying pipeline uniformly sprays micro-etching liquid on two surfaces of the circuit board; the circuit board is vertical to pass through spray set, and the circuit board two sides shelter from fewly, and the spraying is even, has solved the inhomogeneous problem of two sides spraying about the circuit board.
Further, the rotating device comprises a base, a swinging plate, a pushing cylinder and a clamping mechanism; the top end of the base is rotatably connected with a rotating shaft, and the right end of the oscillating rod is fixedly connected to the rotating shaft; a swing cylinder is arranged on the rear side of the top end of the base and is connected with a rotating shaft through a bolt; the clamping mechanism comprises clamping units which are symmetrically arranged, and each clamping unit comprises a shell and a moving block; the moving block comprises a first moving block and a second moving block; the shell is fixedly connected to the swinging plate, a second moving block in the clamping unit on the right side is connected with the shell in a sliding mode, and a pushing cylinder piston penetrates through the shell and is fixedly connected with the second moving block; the first moving block in the clamping unit on the left side is fixedly connected with the shell.
By adopting the technical scheme, the method has the advantages that: the conveying carrier roller conveys the circuit board to the left rotating device, so that the circuit board enters a space between the first moving block and the second moving block, and the pushing cylinder drives the second moving block to clamp the circuit board; the swing cylinder rotates downwards, the swing rod is aligned with the spraying device, and the swing cylinder is pushed to move back to loosen the circuit board; the pushing cylinder acts on the pushing cylinder piston to drive the batten to push the circuit board into the spraying device, the circuit board vertically passes through the spraying device, micro-etching liquid is uniformly sprayed on two sides of the circuit board, and the problem of non-uniform spraying on the upper side and the lower side of the circuit board is solved; after the circuit board passes through the spraying device, the rotating device on the right side acts, and the swinging cylinder drives the swinging rod to rotate upwards to level the circuit board; the feed back cylinder acts to push the cylinder piston to drive the batten to push the circuit board out of the rotating device on the right side, and the circuit board enters the conveying carrier roller on the right side.
Further, the device also comprises a small belt wheel, a large belt wheel and a motor; a large belt wheel is fixedly connected with the rear end of a transmission shaft on the right side of the supporting shell, a motor is arranged on the outer wall of the left side of the shell, a small belt wheel is connected with a key on a motor shaft, and a belt is wound between the small belt wheel and the large belt wheel; waterproof partition boards are arranged between the outer walls of the two sides of the supporting shell and the shell.
By adopting the technical scheme, the method has the advantages that: when the spraying device works, a motor shaft rotates, and the small belt pulley drives the large belt pulley to rotate, so that the transmission shaft is driven to rotate, and the guide wheel is driven to rotate; the waterproof partition plate prevents the micro-etching liquid from entering the transmission mechanism on the supporting shell.
Furthermore, the upper side and the lower side in the moving block are rotatably connected with driven wheels, and the middle part of the inner side of the moving block is provided with an anti-collision wheel.
By adopting the technical scheme, the method has the advantages that: when the circuit board is in the moving block, the driven wheel clamps the side surface of the top and the bottom of the circuit board, and the anti-collision wheel is contacted with the two ends of the top and the bottom of the circuit board; the circuit board is separated from the swing plate type, the driven wheel and the anti-collision wheel rotate along with the circuit board, and dry friction is avoided.
Further, the spraying pipeline comprises a plurality of rows of spraying pipes, the spraying pipes are sequentially arranged in the shell along the front-back direction of the supporting shell, and a plurality of spraying heads are arranged on the spraying pipes.
By adopting the technical scheme, the method has the advantages that: in the process that the circuit board passes through the spraying device, the two sides of the circuit board can be uniformly sprayed by the multiple rows of spraying pipes.
Furthermore, the bearing wheel and the guide wheel are mutually staggered.
By adopting the technical scheme, the method has the advantages that: the bearing wheel and the guide wheel are staggered with each other, and the arrangement positions of the bearing wheel shaft and the guide wheel shaft are reserved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a microetching apparatus for pretreatment of metallization of a circuit board according to an embodiment of the present disclosure;
FIG. 2 showsbase:Sub>A cross-sectional view taken along plane A-A of FIG. 1;
FIG. 3 shows a cross-sectional view taken along the plane B-B in FIG. 1;
FIG. 4 shows a partial cross-sectional view through plane C-C of FIG. 3;
FIG. 5 shows a partial cross-sectional view of the plane D-D of FIG. 3;
FIG. 6 shows a partial cross-sectional view through plane E-E of FIG. 3;
fig. 7 shows a partially enlarged view of portion F of fig. 2.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The following is further detailed by the specific embodiments:
reference numerals in the drawings of the specification include: the device comprises a conveying carrier roller 1, a pushing cylinder 2, a batten 3, a base 4, a swing plate 5, a rotating shaft 6, a swing cylinder 7, a shell 8, a material returning cylinder 9, a push plate 10, a pushing cylinder 11, a shell 12, a second moving block 13, a first moving block 14, an anti-collision wheel 15, a driven wheel 16, a supporting shell 17, a supporting shaft 18, a guide wheel 19, a first bevel gear 20, a transmission shaft 21, a second bevel gear 22, a first gear 23, a waterproof partition plate 24, a large belt wheel 25, a small belt wheel 26, a motor 27, a belt 28, a spray pipe 29, a spray head 30 and a bearing wheel 31.
Example 1:
as shown in FIGS. 1 to 7, the embodiment of the present invention discloses a microetching equipment for the pretreatment of circuit board to be metallized,
comprises a spraying device, and a rotating device and a conveying carrier roller 1 which are arranged on the front side and the rear side of the spraying device in sequence; the bottom of the left conveying carrier roller 1 is provided with a material pushing cylinder 2, the rotating device can be aligned to the material pushing cylinder 2, and a batten 3 is vertically and fixedly connected to a piston of the material pushing cylinder 2; the spraying device comprises a shell 8, conveying mechanisms which are symmetrically arranged in the shell 8 up and down, and 29 spraying pipes which are symmetrically arranged in the shell 8; the conveying mechanism comprises a supporting shell 17, a guide wheel 19, a supporting shaft 18 and a transmission shaft 21; the front end and the rear end of the supporting shell 17 are fixedly connected in the shell body 8, the supporting shaft 18 is rotatably connected to two sides of the supporting shell 17, the guide wheel 19 is fixedly connected to the bottom of the supporting shaft 18, and the top end of the supporting shaft 18 penetrates through the supporting shell 17 and is sequentially provided with a first gear 23 and a first bevel gear 20; the bearing wheel 31 is rotatably connected to the inner side of the supporting shell 17; the transmission shaft 21 is rotatably arranged on the shell 8 above the supporting shaft 18, the transmission shaft 21 is uniformly provided with second bevel gears 22, and the second bevel gears 22 are meshed with the first bevel gears 20; first bevel gears 20 provided on the support shafts 18 at both sides of the support housing 17 are engaged with each other; a feed back cylinder 9 is arranged at the top of the shell 8, the feed back cylinder 9 can be aligned to a rotating device on the right side, and a push plate 10 is fixedly connected to a piston of the feed back cylinder 9.
By adopting the technical scheme, the device has the advantages that: the circuit board enters a spraying device, a transmission shaft 21 rotates, a second bevel gear 22 drives a first bevel gear 20 to rotate, the first bevel gears 20 arranged on the support shafts 18 on the two sides of the support shell 17 are meshed with each other, and guide wheels 19 on the two sides of the support shell 17 rotate oppositely to convey the circuit board to the right side; the bearing wheels 31 contact the top and bottom ends of the circuit board and rotate along with the circuit board, so that dry friction is avoided; spraying micro-etching liquid on two sides of the circuit board uniformly by 29 paths of spraying pipes; the circuit board is vertical to pass through spray set, and the circuit board both sides shelter from fewly, and the spraying is even, has solved the inhomogeneous problem of circuit board upper and lower two-sided spraying.
As shown in fig. 1, 2 and 7: the rotating device comprises a base 4, a swinging plate 5, a pushing cylinder 11 and a clamping mechanism; the top end of the base 4 is rotatably connected with a rotating shaft 6, and the right end of the swinging rod is fixedly connected to the rotating shaft 6; a swing cylinder 7 is arranged on the rear side of the top end of the base 4, and the swing cylinder 7 is connected with the rotating shaft 6 through a bolt; the clamping mechanism comprises clamping units which are symmetrically arranged, and each clamping unit comprises a shell 12 and a moving block; the moving block comprises a first moving block 14 and a second moving block 13; the shell 12 is fixedly connected to the swinging plate 5, a second moving block 13 in the clamping unit on the right side is connected with the shell 12 in a sliding mode, and a piston of the pushing cylinder 11 penetrates through the shell 12 and is fixedly connected with the second moving block 13; the first moving block 14 of the left clamping unit is fixedly connected to the housing 12.
By adopting the technical scheme, the device has the advantages that: the conveying carrier roller 1 conveys the circuit board to a left rotating device, so that the circuit board enters a space between a first moving block 14 and a second moving block 13, and a pushing cylinder 11 drives the second moving block 13 to clamp the circuit board; the swing cylinder 7 rotates downwards, the swing rod is aligned with the spraying device, and the pushing cylinder 11 retracts to release the circuit board; the material pushing cylinder 2 acts on the material pushing cylinder 2 and the piston drives the batten 3 to push the circuit board into the spraying device, the circuit board vertically passes through the spraying device, micro-etching liquid is uniformly sprayed on two surfaces of the circuit board, and the problem of non-uniform spraying on the upper surface and the lower surface of the circuit board is solved; after the circuit board passes through the spraying device, the rotating device on the right side acts, and the swinging cylinder 7 drives the swinging rod to rotate upwards to level the circuit board; the material returning cylinder 9 acts, the piston of the pushing cylinder 11 drives the batten 3 to push the circuit board out of the rotating device on the right side, and the circuit board enters the conveying carrier roller 1 on the right side.
As shown in fig. 3 and 6: also comprises a small belt wheel 26, a large belt wheel 25 and a motor 27; the motor 27 is a horizontal motor 27 with a speed reducer; the rear end of a transmission shaft 21 on the right side of the supporting shell 17 is fixedly connected with a large belt wheel 25, a motor 27 is arranged on the outer wall of the left side of the shell 8, a small belt wheel 26 is connected with a shaft of the motor 27 through a key, and a belt 28 is wound between the small belt wheel 26 and the large belt wheel 25; waterproof partition boards 24 are arranged between the outer walls of the two sides of the supporting shell 17 and the shell body 8.
By adopting the technical scheme, the method has the advantages that: when the spraying device works, the motor 27 rotates, the small belt wheel 26 drives the large belt wheel 25 to rotate, so that the transmission shaft 21 is driven to rotate, and the guide wheel 19 is driven to rotate; the waterproof partition 24 prevents the entry of micro-etching liquid into the transmission mechanism on the support housing 17.
As shown in fig. 7: the upper and lower sides in the moving block are rotatably connected with driven wheels 16, and the middle part of the inner side of the moving block is provided with an anti-collision wheel 15.
By adopting the technical scheme, the method has the advantages that: when the circuit board is in the moving block, the driven wheel 16 clamps the side surface of the top and the bottom of the circuit board, and the anti-collision wheel 15 is contacted with the two ends of the top and the bottom of the circuit board; when the circuit board leaves the swinging plate 5, the driven wheel 16 and the anti-collision wheel 15 rotate along with the circuit board, so that dry friction is avoided.
As shown in fig. 3: the 29 ways of the spray pipes comprise a plurality of rows of spray pipes 29, the spray pipes 29 are sequentially arranged in the shell body 8 along the front and back directions of the supporting shell 17, and a plurality of spray heads are arranged on the spray pipes 29.
By adopting the technical scheme, the method has the advantages that: in the process of passing the circuit board through the spraying device, the multiple rows of spraying pipes 29 can uniformly spray two sides of the circuit board.
As shown in fig. 4: the bearing wheel 31 and the guide wheel 19 are staggered.
By adopting the technical scheme, the method has the advantages that: the bearing wheel 31 and the guide wheel 19 are mutually staggered, and the arrangement positions of the shaft of the bearing wheel 31 and the shaft of the guide wheel 19 are reserved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (6)

1. The microetching equipment for the pretreatment of the circuit board metallization is characterized in that: comprises a spraying device, and a rotating device and a conveying carrier roller which are arranged on the front side and the rear side of the spraying device in sequence; a pushing cylinder is arranged at the bottom of the conveying carrier roller at the front side, the rotating device can be aligned to the pushing cylinder, and a slat is vertically and fixedly connected to a piston of the pushing cylinder; the spraying device comprises a shell, conveying mechanisms which are symmetrically arranged in the shell up and down, and spraying pipelines which are symmetrically arranged in the shell; the conveying mechanism comprises a supporting shell, a guide wheel, a supporting shaft and a transmission shaft; the front end and the rear end of the supporting shell are fixedly connected in the shell, the supporting shaft is rotatably connected to two sides of the supporting shell, the guide wheel is fixedly connected to the bottom of the supporting shaft, and the top end of the supporting shaft penetrates through the supporting shell and is sequentially provided with a first gear and a first bevel gear; the inner side of the supporting shell is rotatably connected with a bearing wheel; the transmission shaft is rotatably arranged on the shell above the supporting shaft, and second bevel gears are uniformly arranged on the transmission shaft and meshed with the first bevel gears; the first bevel gears arranged on the support shafts on the two sides of the support shell are meshed with each other; the top of the shell is provided with a feed back cylinder, the feed back cylinder can be aligned to the rotating device on the right side, and a push plate is fixedly connected to a piston of the feed back cylinder.
2. The microetching apparatus for pretreatment of metallizing a circuit board according to claim 1, wherein: the rotating device comprises a base, a swinging plate, a pushing cylinder and a clamping mechanism; the top end of the base is rotatably connected with a rotating shaft, and the right end of the oscillating rod is fixedly connected to the rotating shaft; a swing cylinder is arranged on the rear side of the top end of the base and is connected with the rotating shaft through a bolt; the clamping mechanism comprises clamping units which are symmetrically arranged, and each clamping unit comprises a shell and a moving block; the moving block comprises a first moving block and a second moving block; the shell is fixedly connected to the swinging plate, a second moving block in the clamping unit on the right side is connected with the shell in a sliding mode, and a pushing cylinder piston penetrates through the shell and is fixedly connected with the second moving block; the first moving block in the clamping unit on the left side is fixedly connected with the shell.
3. The microetching apparatus for pretreatment of metallizing a circuit board according to claim 2, wherein: the belt conveyor also comprises a small belt wheel, a large belt wheel and a motor; the rear end of a transmission shaft on the right side of the supporting shell is fixedly connected with a large belt wheel, the motor is arranged on the outer wall on the left side of the shell, a motor shaft is connected with a small belt wheel through a key, and a belt is wound between the small belt wheel and the large belt wheel; waterproof partition boards are arranged between the outer walls of the two sides of the supporting shell and the shell.
4. The microetching apparatus for pretreatment of metallizing a circuit board according to claim 3, wherein: the upper side and the lower side in the moving block are rotatably connected with driven wheels, and the middle part of the inner side of the moving block is provided with an anti-collision wheel.
5. The microetching apparatus for pretreatment of metallizing a circuit board according to claim 4, wherein: the spraying pipeline comprises a plurality of rows of spraying pipes, the spraying pipes are sequentially arranged in the shell along the front-back direction of the supporting shell, and a plurality of spraying heads are arranged on the spraying pipes.
6. The microetching apparatus for pretreatment of metallizing a circuit board according to claim 5, wherein: the bearing wheel and the guide wheel are staggered.
CN202221699794.1U 2022-06-29 2022-06-29 Micro-etching equipment for pretreatment of circuit board metallization Expired - Fee Related CN217536165U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221699794.1U CN217536165U (en) 2022-06-29 2022-06-29 Micro-etching equipment for pretreatment of circuit board metallization

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221699794.1U CN217536165U (en) 2022-06-29 2022-06-29 Micro-etching equipment for pretreatment of circuit board metallization

Publications (1)

Publication Number Publication Date
CN217536165U true CN217536165U (en) 2022-10-04

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ID=83422356

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221699794.1U Expired - Fee Related CN217536165U (en) 2022-06-29 2022-06-29 Micro-etching equipment for pretreatment of circuit board metallization

Country Status (1)

Country Link
CN (1) CN217536165U (en)

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Granted publication date: 20221004

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