Disclosure of utility model
Embodiments of the present utility model aim to solve at least one of the technical problems existing in the prior art.
To this end, a first aspect of an embodiment of the utility model provides a heating plate.
A second aspect of embodiments of the present utility model provides a cooking appliance.
In view of the above, according to a first aspect of embodiments of the present utility model, there is provided a heating plate including a heat conductive surface for contacting a cooker, a heating member provided on the heat conductive plate, a heat insulating layer provided on a side of the heat conductive plate away from the heat conductive surface, wherein a porosity of the heat conductive plate is smaller than a porosity of the heat insulating layer.
The heating plate provided by the embodiment of the utility model comprises a heat conducting plate, a heating element and a heat insulating layer, wherein the heat conducting plate comprises a heat conducting surface, and the heat conducting surface is used for contacting with a cooker, namely, heat generated by the heating element can be transferred to the cooker through the heat conducting plate so as to heat and cook food in the cooker. Optionally, the cookware comprises a metal pot, a ceramic pot, or an inner liner of the cooking utensil.
The insulating layer sets up in the heat-conducting plate back of the body one side from the heat-conducting surface, that is to say, set up the insulating layer in the heat-conducting plate back of the body one side from the pan, the heat that the hindrance piece produced is to keeping away from the conduction of one side of pan, realize that the heat gathers to one side that the pan is located, thereby can promote heating dish heating efficiency, when shortening the culinary art duration, reduce the risk that because the heat is to deviating from the transmission of pan one side and arouse the inside electronic component of cooking utensil and take place to damage when high temperature, the inside electronic component of cooking utensil has effectively been protected, and then can reduce the probability that cooking utensil breaks down, be favorable to prolonging cooking utensil's life, promote cooking utensil's reliability. In addition, the problem that heat generated by one side of the heat conducting plate does invalid work when the two sides of the heat conducting plate heat is generated is solved, heat waste is avoided, and the energy efficiency of the cooking utensil is improved.
Because the porosity of the heat-conducting plate is smaller than that of the heat-insulating layer, that is to say, the heat-conducting plate is a compact plate compared with the heat-insulating layer, the heat generated by the heating element can be quickly transferred to the cooker through the heat-conducting plate, the heat transfer efficiency is improved, the cooking efficiency of the cooking appliance can be improved, and the cooking duration is shortened. Compared with the heat conducting plate, the heat insulating layer has a porous structure, so that the heat insulating effect of the heat insulating layer can be ensured, the downward (one side deviating from the cooker) heating of the heating element during working is reduced, the electronic element in the cooking utensil is protected, and the energy efficiency of the cooking utensil is further improved.
In some embodiments, optionally, the thermal plate has a porosity of less than or equal to 0.1%, and/or the thermal insulation layer has a porosity of less than or equal to 10%.
In the technical scheme, the porosity of the heat conducting plate is smaller than or equal to 0.1%, that is, the heat conducting plate is a compact plate compared with the heat insulating layer, so that heat generated by the heating element can be quickly transferred to the cooker through the heat conducting plate, the heat transfer efficiency is improved, the cooking efficiency of the cooking appliance can be improved, and the cooking duration is shortened.
The porosity of the heat insulation layer is less than or equal to 10%, and it can be understood that if the porosity of the heat insulation layer is too large, the strength of the heat insulation layer is insufficient, cracking is easy to cause, even the heat insulation layer falls off from the heat conduction plate, and effective isolation of heat on one side of the heat conduction plate away from the cooker cannot be realized, so that heat is wasted. The heat insulation layer has the advantages that the porosity of the heat insulation layer is smaller than or equal to 10%, the heat insulation layer is made to be of a porous structure, and the structural strength of the heat insulation layer is guaranteed on the premise that the heat insulation effect is guaranteed, so that heat is effectively gathered to one side of the cooker.
In some embodiments, optionally, the interior of the insulating layer includes pores, and the pore diameter of the pores is 1mm or more and 3mm or less.
In this technical solution, the inside of the insulating layer is defined to include air holes, optionally, during the preparation of the heating plate, a foaming agent may be added into the insulating layer, and a plurality of air holes may be formed inside the insulating layer after molding.
Because the inside of insulating layer includes the gas pocket, is favorable to promoting the thermal-insulated effect of insulating layer, further hinders heat to keeping away from the conduction of one side of pan, realizes the gathering of heat to pan place one side better, reduces the high temperature to cooking utensil lateral part and bottom electronic component's temperature interference, promotes cooking utensil's reliability.
It can be understood that if the pore diameter of the air hole is too small, the heat insulation effect of the heat insulation layer can be reduced, so that more heat is dissipated from one side of the heat conduction plate, which is away from the cooker, and the temperature of the electronic element near the heating plate in the cooking appliance is easily increased too high, so that the service life of the cooking appliance is influenced. If the pore diameter of the air hole is too large, the strength of the heat insulation layer is insufficient, cracking is easy to occur, even the heat insulation layer falls off from the heat conduction plate, effective isolation of heat on one side of the heat conduction plate away from the cooker cannot be realized, and heat waste is caused.
Through the aperture with the gas pocket is limited between 1mm to 3mm, can promote the insulating layer to deviating from the thermal isolated effect in pan one side under the prerequisite of guaranteeing insulating layer intensity, realize the heat and effectively gather to the pan one side of place, be favorable to promoting cooking efficiency.
In some embodiments, optionally, the heat-conducting plate, the heat-generating element, and the thermal insulation layer are integrally formed.
In this technical scheme, because the heat-conducting plate, the heating element and the heat-insulating layer are of an integrated structure, that is, the heat-conducting plate, the heating element and the heat-insulating layer are integrally formed. Alternatively, the heat-conducting plate, the heat-generating member and the heat-insulating layer may be integrally formed by an integrated sintering technique. Specifically, inlay the piece that generates heat in the heat conduction board is inside, then get into the kiln with heat-insulating layer after passing through compression molding together and sinter, realize integrated into one piece, when guaranteeing heating plate overall structure intensity, reduce the manufacturing degree of difficulty, be favorable to reducing the manufacturing cost of heating plate.
In some embodiments, optionally, the heat generating element comprises a wire, the wire being located inside the heat conducting plate.
In this technical scheme, it includes the wire to have limited the piece that generates heat, and specifically, the wire is located the inside of heat-conducting plate, that is to say, the wire inlays in the centre of heat-conducting plate, is favorable to shortening the distance between wire and the pan, promotes the efficiency of heat transfer, and then can promote the heating efficiency of heating dish.
In some embodiments, the thermally conductive plate may optionally include a temperature resistant plate, and/or the thermally conductive plate may include an insulating plate, and/or the thermal insulating layer may include an insulating layer.
In the technical scheme, the heat conducting plate is limited to comprise a temperature resistant plate, that is to say, the heat conducting plate has good high temperature resistance, so that compared with an electric heating plate formed by a cast aluminum plate and an electric heating tube in the related art, the risk of melting the plate, which occurs when the heat conducting plate is at high temperature, is effectively avoided, and the reliability of the heating plate is improved. Optionally, the heat conducting plate comprises a high-temperature-resistant inorganic plate, and the melting point of the material is greater than or equal to 1000 ℃, so that the risk of melting the plate can be effectively avoided. Optionally, the material of the insulating layer has a melting point greater than or equal to 1000 ℃ and is prevented from melting at high temperatures.
The heat conducting plate is an insulating plate, that is to say, the heat conducting plate has good insulating property, and the cooker contacted with the heat conducting surface is a metal cooker generally, so that the reliability of the cooking utensil is further improved by arranging the heat conducting plate as the insulating plate.
The insulating layer is the insulating layer, and because the binding post that is connected with the piece electricity that generates heat draws forth from the insulating layer, set up the insulating layer as the insulating layer, be favorable to further promoting the reliability of heating plate.
In some embodiments, the thermally conductive plate may optionally include a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate, or a ceramic plate, the thermally insulating layer may include a silicon carbide layer based on the thermally conductive plate, a silicon nitride plate based on the thermally conductive plate, a silicon nitride layer based on the thermally conductive layer, an alumina plate based on the thermally conductive plate, an alumina layer based on the thermally conductive layer, a glass plate based on the thermally conductive plate, a glass layer based on the thermally conductive plate, and a ceramic layer based on the thermally conductive plate.
In the technical scheme, the heat conducting plate is limited to comprise a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate or a ceramic plate, namely, the heat conducting plate is made of high-temperature-resistant inorganic materials, and has good heat transfer performance and good insulating performance.
The heat-insulating layer comprises a silicon carbide plate, a silicon nitride layer, an aluminum oxide layer, a glass plate and a glass layer, the heat-insulating layer comprises a ceramic plate, and the heat-insulating layer comprises a ceramic layer, namely the heat-insulating plate and the heat-insulating layer are made of the same material, so that after the heat-insulating plate and the heat-insulating layer are integrally sintered and formed, cracking at the interface between the heat-insulating plate and the heat-insulating layer can be reduced, the bonding strength between the heat-insulating plate and the heat-insulating layer is improved, and the heat-insulating effect of the heat-insulating layer is ensured.
In some embodiments, at least a portion of the thermally conductive surface is optionally configured as an arcuate surface that is concave toward the side on which the insulating layer is located.
In the technical scheme, at least one part of the heat conducting surface is an arc-shaped surface, and the arc-shaped surface is recessed towards one side where the heat insulating layer is located, namely, the arc-shaped surface is recessed towards one side away from the cooker. When the cooker is placed on the heat conducting surface, the heat conducting area between the heat conducting surface and the cooker can be increased, so that heat can be transferred to the inside of the cooker through the bottom of the cooker and also can be transferred to the inside of the cooker through the side part of at least part of the cooker, the uniformity of heating food materials in the cooker is improved, the uniform heating of the cooking appliance is realized, and the cooking effect is ensured.
In some technical schemes, optionally, a connecting line of the outer edge of the heat conducting surface and the bottom center of the heating plate is a reference line, and an included angle alpha between the reference line and the horizontal plane meets 0 degrees < alpha less than or equal to 60 degrees.
In the technical scheme, as the connecting line of the outer edge of the heat conducting surface and the bottom center O of the heating plate is the reference line, the included angle between the reference line and the horizontal plane is between 0 and 60 degrees, that is, the heating plate is a large-radian heating plate, that is, the heat conducting surface is made into a large-radian size, when the cooker is placed on the heat conducting surface, the heat conducting area between the heat conducting surface and the cooker can be increased, so that heat can be transferred to the inside of the cooker through the bottom of the cooker and also can be transferred to the inside of the cooker through at least part of the side part of the cooker, the heating uniformity of food materials in the cooker can be improved, and the uniform heating of the cooking appliance can be realized, and the cooking effect can be ensured.
In some embodiments, optionally, the heating plate further includes a connection terminal, and the connection terminal is electrically connected to the heating element and is exposed to the heat insulation layer.
In this technical scheme, it still includes binding post to have limited the heating plate, and concretely speaking, binding post is connected with the piece electricity that generates heat to realize the circular telegram of piece that generates heat. It can be appreciated that the heating element can generate heat under the condition of being electrified, and the heat is transferred to the cooker through the heat conducting plate so as to heat and cook food materials in the cooker.
The wiring terminal is exposed out of the heat insulation layer, that is, the wiring terminal is led out from the lower part (the side away from the cooker), so that the assembly is convenient.
According to a second aspect of the present utility model, a cooking appliance is provided, which includes a heating plate provided by any one of the above technical solutions, so that the heating plate has all the beneficial technical effects, and will not be described herein.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Detailed Description
In order that the above-recited objects, features and advantages of the present utility model will be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced otherwise than as described herein, and therefore the scope of the present utility model is not limited to the specific embodiments disclosed below.
A heating pan 100 and a cooking appliance provided according to some embodiments of the present utility model are described below with reference to fig. 1 to 6.
In an embodiment according to the present application, as shown in fig. 1, 2, 3, 4, 5 and 6, a heating plate 100 is provided, wherein the heating plate 100 comprises a heat conducting plate 110, the heat conducting plate 110 comprises a heat conducting surface 111, the heat conducting surface 111 is used for contacting a cooker, a heating element 120 is arranged on the heat conducting plate 110, a heat insulating layer 130 is arranged on one side of the heat conducting plate 110 away from the heat conducting surface 111, and the porosity of the heat conducting plate 110 is smaller than the porosity of the heat insulating layer 130.
The heating plate 100 provided by the embodiment of the utility model includes a heat conducting plate 110, a heating element 120 and a heat insulating layer 130, specifically, the heat conducting plate 110 includes a heat conducting surface 111, and the heat conducting surface 111 is used for contacting a cooker, that is, heat generated by the heating element 120 can be transferred to the cooker through the heat conducting plate 110, so as to heat and cook food in the cooker. Optionally, the cookware comprises a metal pot, a ceramic pot, or an inner liner of the cooking utensil.
The insulating layer 130 sets up in the heat-conducting plate 110 one side that deviates from heat-conducting surface 111, that is to say, set up insulating layer 130 in the heat-conducting plate 110 one side that deviates from the pan, the heat that the hindrance piece 120 produced is to keeping away from the conduction of one side of pan, realize that the heat gathers to one side that the pan is located, thereby can promote heating dish 100 heating efficiency, when shortening the culinary art duration, reduce the risk that because heat is to deviating from the inside electronic component of cooking utensil and take place to damage when keeping away from pan one side transmission, the inside electronic component of cooking utensil has effectively been protected, and then can reduce the probability that cooking utensil breaks down, be favorable to prolonging cooking utensil's life, the reliability of cooking utensil is promoted.
In addition, the problem that heat generated by one surface of the heat conducting plate 110 does invalid work when the two surfaces of the heat conducting plate generate heat is solved, heat waste is avoided, and the energy efficiency of the cooking utensil is improved.
Because the porosity of the heat-conducting plate 110 is smaller than that of the heat-insulating layer 130, that is, the heat-conducting plate 110 is a dense plate compared with the heat-insulating layer 130, the heat generated by the heating element 120 can be quickly transferred to the cooker through the heat-conducting plate 110, which is beneficial to improving the heat transfer efficiency, further improving the cooking efficiency of the cooking appliance and shortening the cooking time. Compared with the heat conducting plate 110, the heat insulating layer 130 has a porous structure, so that the heat insulating effect of the heat insulating layer 130 can be ensured, the downward (the side away from the cooker) heat generated by the heat generating element 120 during working is reduced, the electronic elements in the cooking appliance are protected, and the energy efficiency of the cooking appliance is improved.
Alternatively, the thermal conductivity of the thermal conductive plate 110 is greater than or equal to 5W/(m.k).
Optionally, the thermal conductivity of the insulating layer 130 is less than or equal to 2W/(m.k).
In some embodiments, optionally, the thermal plate 110 has a porosity of less than or equal to 0.1%, and/or the thermal barrier layer 130 has a porosity of less than or equal to 10%.
In this embodiment, since the porosity of the heat-conducting plate 110 is less than or equal to 0.1%, that is, the heat-conducting plate 110 is a dense plate compared with the heat-insulating layer 130, the heat generated by the heat-generating element 120 can be quickly transferred to the cooker through the heat-conducting plate 110, which is beneficial to improving the heat transfer efficiency, and further improving the cooking efficiency of the cooking appliance and shortening the cooking time.
It will be appreciated that if the porosity of the thermal insulation layer 130 is smaller than or equal to 10%, the thermal insulation layer 130 will have insufficient strength, and is prone to cracking, and even falling off from the heat conducting plate 110, so that the heat on one side of the heat conducting plate 110 away from the cooker cannot be effectively isolated, and heat is wasted. By making the porosity of the heat insulation layer 130 less than or equal to 10%, the heat insulation layer 130 can be made to be of a porous structure, and the structural strength of the heat insulation layer 130 is ensured on the premise of ensuring the heat insulation effect, so that the heat can be effectively gathered to the side where the cooker is located.
As shown in fig. 2, in some embodiments, optionally, the interior of the insulating layer 130 includes air holes 131, the aperture of the air holes 131 being 1mm or more and 3mm or less.
In this embodiment, the inside of the insulating layer 130 is defined to include air holes 131, and optionally, a foaming agent may be added into the insulating layer 130 during the preparation of the heating pan 100, and a plurality of air holes 131 may be formed in the inside of the insulating layer 130 after molding.
Because the inside of insulating layer 130 includes air vent 131, be favorable to promoting insulating layer 130's thermal-insulated effect, further hinder heat to keeping away from the conduction of one side of pan, realize the gathering of heat to one side that the pan is located better, reduce the high temperature to cooking utensil lateral part and bottom electronic component's temperature interference, promote cooking utensil's reliability.
It can be appreciated that if the aperture of the air hole 131 is too small, the heat insulation effect of the heat insulation layer 130 is reduced, so that more heat is dissipated from the side of the heat conduction plate 110 away from the cooker, which easily causes too high temperature rise of the electronic components near the heating plate 100 in the cooking appliance, and affects the service life of the cooking appliance. If the pore diameter of the air hole 131 is too large, the strength of the heat insulation layer 130 is insufficient, which is easy to cause cracking, even falls off from the heat conducting plate 110, and effective insulation of heat on one side of the heat conducting plate 110 away from the cooker cannot be realized, so that heat is wasted.
Through defining the aperture of the air hole 131 between 1mm and 3mm, under the premise of ensuring the strength of the heat insulation layer 130, the heat insulation effect of the heat insulation layer 130 on one side deviating from the cooker is improved, the heat is effectively gathered on one side where the cooker is located, and the cooking efficiency is improved.
Optionally, the number of the air holes 131 is plural, and the plurality of air holes 131 are uniformly distributed in the insulating layer 130.
In some embodiments, optionally, the heat conductive plate 110, the heat generating element 120, and the insulating layer 130 are of unitary construction.
In this embodiment, since the heat conductive plate 110, the heat generating member 120 and the heat insulating layer 130 are integrally formed, that is, the heat conductive plate 110, the heat generating member 120 and the heat insulating layer 130 are integrally formed. Alternatively, the heat conductive plate 110, the heat generating member 120, and the heat insulating layer 130 may be integrally formed by an integrated sintering technique. Specifically, the heating element 120 is embedded in the heat conducting plate 110, and then the heat conducting plate 110 and the heat insulating layer 130 are pressed and formed and then enter a kiln together for sintering, so that integrated forming is realized, the manufacturing difficulty is reduced while the overall structural strength of the heating plate 100 is ensured, and the production cost of the heating plate 100 is reduced.
As shown in fig. 1 and 2, in some embodiments, the heat generating element 120 optionally includes a wire 121, the wire 121 being located inside the heat conductive plate 110.
In this embodiment, the heating element 120 is defined to include the wire 121, specifically, the wire 121 is located inside the heat conducting plate 110, that is, the wire 121 is embedded in the middle of the heat conducting plate 110, which is beneficial to shortening the distance between the wire 121 and the cooker, improving the heat transfer efficiency, and further improving the heating efficiency of the heating plate 100.
Optionally, the wire 121 comprises a nickel chromium wire.
Optionally, the wires 121 are uniformly embedded inside the heat conductive plate 110, which is advantageous for achieving uniform heating of the heating plate 100.
In some embodiments, optionally, the thermally conductive plate 110 comprises a temperature resistant plate, and/or the thermally conductive plate 110 comprises an insulating plate, and/or the insulating layer 130 comprises an insulating layer.
In this embodiment, the heat conducting plate 110 is defined to include a heat resistant plate, that is, the heat conducting plate 110 has good high temperature resistance, so that compared with an electrothermal plate composed of a cast aluminum plate and an electrothermal tube in the related art, the risk of melting the heat conducting plate 110 at high temperature is effectively avoided, and the reliability of the heating plate 100 is improved. Optionally, the heat conducting plate 110 includes a high temperature resistant inorganic plate material, and the melting point of the material is greater than or equal to 1000 ℃, so that the risk of melting the plate can be effectively avoided. Optionally, the material of the insulating layer 130 has a melting point greater than or equal to 1000 ℃ to avoid melting at high temperatures.
The heat conducting plate 110 is an insulating plate, that is, the heat conducting plate 110 has good insulating performance, and since the cooker contacted with the heat conducting surface 111 is generally a metal cooker, the reliability of the cooking appliance is further improved by setting the heat conducting plate 110 as an insulating plate.
The insulating layer 130 is an insulating layer, and since the connection terminal 150 electrically connected to the heating element 120 is led out from the insulating layer 130, the insulating layer 130 is set as an insulating layer, which is beneficial to further improving the reliability of the heating plate 100.
Alternatively, the heat conductive plate 110 includes a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate, a ceramic plate, or an inorganic composite plate.
In some embodiments, optionally, the thermally conductive plate 110 comprises a silicon carbide plate, a silicon nitride plate, an aluminum oxide plate, a glass plate, or a ceramic plate, the thermally insulating layer 130 comprises a silicon carbide layer based on the thermally conductive plate 110, the thermally insulating layer 130 comprises a silicon nitride layer based on the thermally conductive plate 110, the thermally insulating layer 130 comprises an aluminum oxide layer based on the thermally conductive plate 110, the thermally insulating layer 130 comprises a glass plate based on the thermally conductive plate 110, the thermally insulating layer 130 comprises a ceramic plate based on the thermally conductive plate 110, and the thermally insulating layer 130 comprises a ceramic layer.
In this embodiment, it is defined that the heat conductive plate 110 includes a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate or a ceramic plate, that is, the heat conductive plate 110 is made of an inorganic material resistant to high temperature, and has good heat transfer performance and good insulation performance.
The heat-insulating plate 110 comprises a silicon carbide plate, the heat-insulating layer 130 comprises a silicon carbide layer, the heat-insulating plate 110 comprises a silicon nitride plate, the heat-insulating layer 130 comprises a silicon nitride layer, the heat-insulating plate 110 comprises an alumina plate, the heat-insulating layer 130 comprises a glass layer, the heat-insulating plate 110 comprises a ceramic plate, and the heat-insulating layer 130 comprises a ceramic layer, namely, the heat-insulating plate 110 and the heat-insulating layer 130 are made of the same material, so that after the heat-insulating plate 110 and the heat-insulating layer 130 are integrally sintered and formed, cracking at the interface between the heat-insulating plate 110 and the heat-insulating layer 130 can be reduced, the bonding strength between the heat-insulating plate 110 and the heat-insulating layer 130 is improved, and the heat-insulating effect of the heat-insulating layer 130 is ensured.
In some embodiments, at least a portion of thermally conductive surface 111 is optionally configured as an arcuate surface that is concave toward the side on which insulation layer 130 is located.
In this embodiment, since at least a portion of the heat conducting surface 111 is an arc surface, the arc surface is recessed toward the side where the heat insulating layer 130 is located, i.e., the side facing away from the pot. When the cooker is placed on the heat conducting surface 111, the heat conducting area between the heat conducting surface 111 and the cooker can be increased, so that heat can be transferred to the inside of the cooker through the bottom of the cooker and also can be transferred to the inside of the cooker through the side part of at least part of the cooker, the uniformity of heating food materials in the cooker is improved, the uniform heating of the cooking appliance is realized, and the cooking effect is ensured.
As shown in fig. 5, in some embodiments, optionally, a line connecting the outer edge 112 of the heat conducting surface 111 and the bottom center of the heating plate 100 is a reference line 140, and an angle α between the reference line 140 and a horizontal plane satisfies 0 ° < α+≤60°.
In this embodiment, since the connection line between the outer edge 112 of the heat conducting surface 111 and the bottom center O of the heating plate 100 is the reference line 140, the included angle between the reference line 140 and the horizontal plane is between 0 ° and 60 °, that is, the heating plate 100 is a large arc-shaped heat plate, that is, the heat conducting surface 111 is made into a large arc-shaped size, when the cooker is placed on the heat conducting surface 111, the heat conducting area between the heat conducting surface 111 and the cooker can be increased, so that heat can be transferred to the inside of the cooker through the bottom of the cooker, and can also be transferred to the inside of the cooker through at least part of the side of the cooker, thereby being beneficial to improving the uniformity of heating food in the cooker, so as to realize uniform heating of the cooking appliance and ensure the cooking effect.
Optionally, the reference line 140 is at an angle of 20 °, 30 °, 40 °, 50 °, or 60 ° to the horizontal.
As shown in fig. 1, 2, 4, 5, and 6, in some embodiments, the heating plate 100 optionally further includes a connection terminal 150, where the connection terminal 150 is electrically connected to the heat generating element 120 and is exposed to the heat insulating layer 130.
In this embodiment, it is defined that the heating plate 100 further includes a connection terminal 150, specifically, the connection terminal 150 is electrically connected with the heat generating member 120, thereby achieving energization of the heat generating member 120. It is understood that the heating element 120 can generate heat when being electrified, and the heat is transferred to the cooker through the heat conducting plate 110 to heat and cook food materials in the cooker.
Since the connection terminal 150 is exposed to the heat insulation layer 130, that is, the connection terminal 150 is led out from the lower side (the side facing away from the pot), the assembly is convenient.
In a specific embodiment, as shown in fig. 2, an integrated electric heating plate (heating plate 100) has a large arc heating surface (heat conducting surface 111), the heating plate 100 is divided into an upper part and a lower part, the upper part is an arc heating plate (heat conducting plate 110) with an integrated structure, the lower part is a porous heat insulating layer (heat insulating layer 130), and a connecting terminal 150 with an exposed bottom is formed by sintering the two parts in an integrated manner, and the whole (pot) is heated during heating.
An arc heating plate (heat conducting plate 110) of an upper part integrated structure is internally embedded with a heating wire (metal wire 121), and after the electric conduction, heat is quickly transferred to a cooking utensil (cooker) through an insulating packaging layer (heat conducting plate 110), so that uniform heating is realized. The porous heat-insulating layer (heat-insulating layer 130) at the lower part is a light-weight insulating inorganic heat-insulating layer, and the temperature interference of high temperature to the side wall and the electronic components (electronic components) at the bottom is reduced through heat insulation. The connection terminal 150 is led out from the lower side through the insulation layer (insulation layer 130) at the lower part, so that the assembly is convenient.
The working principle is that the electric heating wire (metal wire 121) and the inorganic insulating plate (heat conducting plate 110) are integrally molded and sintered by an integral molding sintering technology, so that the resistor wire is embedded in the inorganic insulating plate (heat conducting plate 110).
An insulating layer (a heat insulation layer 130) is arranged below the integrated heating plate (the heating plate 100), so that heat is gathered upwards, and the risk of damage to electronic elements caused by downward conduction of heat at high temperature is isolated. In use, the upper dense portion (heat conductive plate 110) can rapidly transfer heat to a cooking appliance (pot). The bottom is a heat preservation layer (heat insulation layer 130) with a porous structure, so that downward heating during working is reduced, namely, the heat preservation layer is insulated from the bottom, circuit components (electronic elements) are protected, and energy efficiency is improved.
As shown in fig. 5, the highest position (the outer edge 112 of the heat conducting surface 111) of the disc and the bottom (the center O of the bottom of the heating disc 100) can reach an included angle of 0 ° -60 °, so as to realize the heating of the large-radian heating disc.
According to a second aspect of the present utility model, a cooking appliance is provided, which includes the heating plate 100 provided in any of the foregoing embodiments, so that all the beneficial technical effects of the heating plate 100 are provided, and are not described herein.
Optionally, the cooking appliance comprises an electric rice cooker or an electric steamer.
In the description of the present specification, the terms "connected," "mounted," "fixed," and the like are to be construed broadly, and "connected" may be, for example, a fixed connection, a detachable connection, or an integral connection, and may be directly connected or indirectly connected through an intermediary. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.