CN224103473U

CN224103473U - Heat expansion preventing fin temperature guiding structure of cooling system of mold temperature machine

Info

Publication number: CN224103473U
Application number: CN202520961347.6U
Authority: CN
Inventors: 刘云; 何水祥; 张佳; 毛江波
Original assignee: Changzhou Xuao Machinery Co ltd
Current assignee: Changzhou Xuao Machinery Co ltd
Priority date: 2025-05-15
Filing date: 2025-05-15
Publication date: 2026-04-10
Anticipated expiration: 2035-05-15

Abstract

The utility model belongs to the technical field of mold temperature machines, in particular to a heat expansion preventing fin temperature conducting structure of a cooling system of a mold temperature machine, which comprises a heat conducting plate, a heat conducting plate and a heat conducting plate, wherein the heat conducting plate is arranged on the heat conducting plate; the heat dissipation assembly is arranged at the upper end of the heat conduction plate, the mounting assembly is arranged at the front end and the rear end of the heat dissipation assembly, and the shunting assembly is arranged at the left side of the heat conduction plate. The heat radiation component provided by the utility model uniformly divides the interior of the heat conduction plate into a plurality of spaces through the fins, so that a subsequent cooling medium is convenient to uniformly contact with the fins, the uniformity of the overall heat radiation of the heat radiation plate is improved, meanwhile, the stabilizing block is matched with the mounting block, the damaged fins are convenient to replace, the integral replacement of the heat radiation component due to the damage of the fins is avoided, and the resource waste is reduced.

Description

Heat expansion preventing fin temperature guiding structure of cooling system of mold temperature machine

Technical Field

The utility model belongs to the technical field of mold temperature machines, and particularly relates to a heat expansion preventing fin temperature guiding structure of a cooling system of a mold temperature machine.

Background

The mold temperature machine is also called a mold temperature controller, and is initially applied to the temperature control industry of injection molds. Later along with the development and the application of the mechanical industry, the conventional mold temperature machine is generally a water temperature machine and an oil temperature machine, the temperature control precision is high, and the heat dissipation of the mold is realized through the fin heat conduction structure.

In the prior art, most of fins are fixedly arranged in a cooling system, after a heat conducting structure is used for a long time, certain impurities are attached to the surfaces of the fins, so that the contact between the fins and a heat dissipation medium is influenced, the heat dissipation capacity of the fins is influenced, and meanwhile, when a certain fin is damaged, the whole heat conducting structure needs to be replaced, so that resource waste is caused.

Disclosure of utility model

In order to make up for the defects of the prior art, a heat expansion preventing fin temperature guiding structure of a cooling system of a mold temperature machine is provided.

The utility model solves the technical problems by adopting the technical scheme that the heat expansion preventing fin temperature guiding structure of the cooling system of the mold temperature machine comprises:

A heat conductive plate;

The heat dissipation assembly is arranged at the upper end of the heat conduction plate and used for dissipating heat of the die;

The heat dissipation assembly includes:

The heat dissipation plate is lapped at the upper end of the heat conduction plate, the embedded plate is fixedly arranged at the lower end of the heat dissipation plate, the stabilizing blocks are fixedly arranged at the lower end of the embedded plate, the mounting blocks are connected between the stabilizing blocks in a sliding manner, and the fins are fixedly arranged at the lower end of the mounting blocks;

The clamping groove is formed in the lower end of the inner portion of the heat conducting plate, the limiting block is connected with the inner portion of the stabilizing block in a sliding mode, a spring is arranged between the limiting block and the stabilizing block, and the limiting groove is formed in the lower end of the mounting block.

Preferably, the method further comprises:

And the installation component is installed at the front end and the rear end of the heat dissipation component and used for locking the heat dissipation component.

Preferably, the mounting assembly comprises:

The locking piece of fixed mounting in heating panel front and back end, locking piece lower extreme fixed mounting has the screw thread post, the fixed plate is fixed with to the front and back end of heat conduction board, the sealing washer has been bonded in the heating panel lower extreme outside.

Preferably, the method further comprises:

and the flow distribution assembly is arranged on the left side of the heat conducting plate and used for distributing cooling medium.

Preferably, the shunt assembly comprises:

The shunt block is fixedly arranged on the left side of the heat conducting plate, a shunt groove is formed in the shunt block, and a shunt tube is fixedly arranged on the right side of the shunt block.

Preferably, the left side of the flow dividing block is fixedly provided with a liquid inlet pipe, the right side of the inside of the heat conducting plate is fixedly provided with a guide plate, and the right side of the heat conducting plate is fixedly provided with a liquid outlet pipe.

The utility model has the beneficial effects that:

the heat radiation component provided by the utility model uniformly divides the interior of the heat conduction plate into a plurality of spaces through the fins, so that a subsequent cooling medium is convenient to uniformly contact with the fins, the uniformity of the overall heat radiation of the heat radiation plate is improved, meanwhile, the stabilizing block is matched with the mounting block, the damaged fins are convenient to replace, the integral replacement of the heat radiation component due to the damage of the fins is avoided, and the resource waste is reduced.

The installation component is matched with the fixed block through the locking block, so that the heat dissipation component is convenient to detach, the heat conduction plate and the heat dissipation component are convenient to clean, a large amount of impurities are prevented from adhering to the inner parts of the fins and the heat conduction plate, the heat dissipation capacity is influenced, and meanwhile, the flow distribution component is matched with the flow distribution grooves through the flow distribution pipes, so that the cooling medium is ensured to be uniformly contacted with each fin, and uneven heat and cold in the heat dissipation plate caused by uneven heat dissipation of the fins is avoided, and heat expansion and cold contraction stress is avoided.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a right side cross-sectional view of the heat transfer plate of the present utility model;

FIG. 3 is a cross-sectional view of a diverter block in accordance with the present utility model;

fig. 4 is a front cross-sectional view of a heat conductive plate in the present utility model;

FIG. 5 is a perspective view of a heat dissipating assembly according to the present utility model;

FIG. 6 is a cross-sectional view of a stabilization block and a mounting block in accordance with the present utility model;

fig. 7 is an enlarged schematic view of the structure of fig. 6 a according to the present utility model.

Legend description:

1. A heat conductive plate;

2. The heat dissipation assembly comprises a heat dissipation assembly, a heat dissipation plate, a 202, a jogged plate, a 203, a stabilizing block, a 204, a mounting block, a 205, fins, a 206, a clamping groove, a 207, a limiting block, a 208, a spring, a 209 and a limiting groove;

3. A mounting assembly; 301, locking blocks, 302, threaded columns, 303, fixing plates, 304 and sealing rings;

4. The device comprises a flow dividing assembly, a flow dividing block, a flow dividing groove, a flow dividing pipe, a liquid inlet pipe, a flow dividing plate and a liquid outlet pipe.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Specific examples are given below.

Example 1:

Referring to fig. 1 to 7, the present utility model provides a heat expansion preventing fin heat conduction structure of a cooling system of a mold temperature machine, which comprises a heat conduction plate 1, a heat dissipation assembly 2, a mounting assembly 3 and a shunt assembly 4.

In this embodiment, install radiator unit 2 on heat-conducting plate 1 through installation component 3, be convenient for dismantle and the installation to radiator unit 2, be convenient for clear up the inside and radiator unit 2 of heat-conducting plate 1, be convenient for simultaneously to the change of part on the radiator unit 2, radiator unit 2 compensates thermal expansion effectively, prevent the production of thermal expansion shrinkage stress to ensure the safe and reliable of mould temperature machine structure, the reposition of redundant personnel subassembly 4 shunts the cooling medium of input heat-conducting plate 1, improves the inside radiating degree of consistency of heat-conducting plate 1.

Example 2:

On the basis of embodiment 1, further disclose radiator assembly 2, radiator assembly 2 installs in heat conduction board 1 upper end for dispel the heat to the mould.

As shown in fig. 1, 2, 4, 5, 6 and 7, the heat dissipation assembly 2 comprises a heat dissipation plate 201 overlapped at the upper end of the heat conduction plate 1, an embedded plate 202 is fixedly arranged at the lower end of the heat dissipation plate 201, a stabilizing block 203 is fixedly arranged at the lower end of the embedded plate 202, a mounting block 204 is slidably connected between the stabilizing blocks 203, a fin 205 is fixedly arranged at the lower end of the mounting block 204, a clamping groove 206 is formed at the lower end of the inner part of the heat conduction plate 1, a limiting block 207 is slidably connected inside the stabilizing block 203, a spring 208 is arranged between the limiting block 207 and the stabilizing block 203, and a limiting groove 209 is formed at the lower end of the mounting block 204.

In this embodiment, when the heat dissipation component 2 is installed, the embedding plate 202 is inserted into the heat conduction plate 1, the heat dissipation plate 201 is lapped on the heat conduction plate 1, and the fin 205 is inserted into the clamping groove 206 in the heat conduction plate 1, so as to ensure the stability of the fin 205 after installation, and simultaneously, the heat conduction plate 1 is uniformly divided into a plurality of spaces, so that the subsequent cooling medium is uniformly contacted with the fin 205, the upper end of the heat dissipation plate 201 is jointed with the mold, the heat on the heat dissipation plate 201 is transferred to the fin 205, the generation of thermal expansion and contraction stress is prevented, thereby ensuring the safety and reliability of the mold temperature machine structure, when the fin 205 is damaged or needs to be cleaned, the heat dissipation component 2 is detached from the heat conduction plate 1, then the fin 205 is drawn with force, the fin 205 drives the installation block 204 to slide, one end of the fin 207 is semicircular, along with the sliding of the installation block 204, the limit block 207 is extruded in the limit groove 209, and the spring 208 is extruded, so that the new fin 205 is installed, the installation block 204 is inserted between the stabilizing blocks 203, then the installation block 204 is slid, and after the installation block 204 is slid to the designated position, so that the heat expansion and contraction stress is prevented, when the fin 205 is damaged or needs to be cleaned, and the heat dissipation component 205 is further damaged, and the heat dissipation component is further damaged, and the heat dissipation is prevented when the heat dissipation component is further, and the heat dissipation component is damaged, and the heat dissipation component is mounted in the heat dissipation device, and the heat dissipation device and can be and the heat dissipation device.

Example 3:

On the basis of embodiment 1, further disclosed is a mounting assembly 3, wherein the mounting assembly 3 is mounted at the front and rear ends of the heat dissipation assembly 2 for locking the heat dissipation assembly 2.

As shown in fig. 1 and 2, the mounting assembly 3 comprises a locking block 301 fixedly mounted at the front and rear ends of the heat dissipation plate 201, a threaded column 302 fixedly mounted at the lower end of the locking block 301, a fixing plate 303 fixedly mounted at the front and rear ends of the heat conduction plate 1, and a sealing ring 304 bonded at the outer side of the lower end of the heat dissipation plate 201.

In this embodiment, when the heat dissipation assembly 2 is installed, the embedding plate 202 is inserted into the heat conduction plate 1, so that the heat dissipation plate 201 is lapped on the heat conduction plate 1, and the threaded post 302 on the locking block 301 penetrates through the fixing plate 303, then the nut is screwed on the threaded post 302, and the locking block 301 is driven to slide downwards along with the screwing of the nut, so as to drive the heat dissipation plate 201 to slide downwards, so that the heat dissipation plate 201 is tightly attached to the upper end of the heat conduction plate 1, the tightness of connection between the heat dissipation assembly 2 and the heat conduction plate 1 is ensured, the outflow of cooling medium is avoided, meanwhile, the sealing ring 304 further improves the tightness of connection between the heat dissipation plate 201 and the heat conduction plate 1, the disassembly of the heat dissipation assembly 2 is facilitated, the heat dissipation plate 1 and the heat dissipation assembly 2 are cleaned, and a large amount of impurities adhered to the inside of the heat dissipation plate 1 are avoided, and the heat dissipation capacity is affected.

Example 4:

on the basis of embodiment 1, a flow dividing assembly 4 is further disclosed, and the flow dividing assembly 4 is mounted on the left side of the heat conducting plate 1 for dividing the cooling medium.

As shown in fig. 1 and 3, the flow dividing assembly 4 comprises a flow dividing block 401 fixedly mounted on the left side of the heat conducting plate 1, a flow dividing groove 402 is formed in the flow dividing block 401, a flow dividing pipe 403 is fixedly mounted on the right side of the flow dividing block 401, a liquid inlet pipe 404 is fixedly mounted on the left side of the flow dividing block 401, a flow guiding plate 405 is fixedly mounted on the right side of the inside of the heat conducting plate 1, and a liquid outlet pipe 406 is fixedly mounted on the right side of the heat conducting plate 1.

In this embodiment, cooling medium is input into the shunt block 401 through the liquid inlet pipe 404, meanwhile, the shunt groove 402 shunts and conveys the cooling medium into the shunt pipe 403, the shunt pipe 403 is inserted into the heat conducting plate 1, the fins 205 divide the inside of the heat conducting plate 1 equally into a plurality of spaces, the shunt pipe 403 evenly conveys the cooling medium into each of the separated spaces, the cooling medium is guaranteed to be evenly contacted with each fin 205, uneven cooling and uneven cooling inside the heat dissipating plate 201 caused by uneven heat dissipation of the fins 205 are avoided, thermal expansion and contraction stress occurs, meanwhile, the cooling medium flows rightwards to be contacted with the guide plate 405, the guide plate 405 guides the cooling medium to be discharged from the liquid outlet pipe 406, the cooling medium backflow is avoided to cause oscillation of the internal cooling medium, and stability of the fins 205 is prevented from being affected.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims

1. A finned thermal conductivity structure for preventing thermal expansion in a mold temperature controller cooling system, characterized in that it comprises:

Heat-conducting plate (1);

Heat dissipation component (2), which is installed on the upper end of heat conduction plate (1) and is used to dissipate heat from the mold;

The heat dissipation component (2) includes:

A heat dissipation plate (201) is attached to the upper end of the heat conduction plate (1). A fitting plate (202) is fixedly installed at the lower end of the heat dissipation plate (201). A stabilizing block (203) is fixedly installed at the lower end of the fitting plate (202). An installation block (204) is slidably connected between the stabilizing blocks (203). A fin (205) is fixedly installed at the lower end of the installation block (204).

The heat-conducting plate (1) has a slot (206) at its lower end, the stabilizing block (203) has a slidable limit block (207) inside, a spring (208) is provided between the limit block (207) and the stabilizing block (203), and the mounting block (204) has a limit groove (209) at its lower end.

2. The anti-thermal expansion fin thermal conductivity structure of a mold temperature controller cooling system according to claim 1, characterized in that it further comprises:

The mounting component (3) is installed at the front and rear ends of the heat dissipation component (2) and is used to lock the heat dissipation component (2).

3. The anti-thermal expansion fin thermal conductivity structure of a mold temperature controller cooling system according to claim 2, characterized in that the mounting assembly (3) comprises:

A locking block (301) is fixedly installed at the front and rear ends of the heat sink (201). A threaded post (302) is fixedly installed at the lower end of the locking block (301). A fixing plate (303) is fixedly installed at the front and rear ends of the heat conduction plate (1). A sealing ring (304) is bonded to the outer side of the lower end of the heat sink (201).

4. The anti-thermal expansion fin thermal conductivity structure of a mold temperature controller cooling system according to claim 1, characterized in that it further comprises:

The flow distribution assembly (4) is installed on the left side of the heat conduction plate (1) and is used to distribute the cooling medium.

5. The anti-thermal expansion fin thermal conductivity structure of a mold temperature controller cooling system according to claim 4, characterized in that the flow distribution component (4) comprises:

A flow divider block (401) is fixedly installed on the left side of the heat-conducting plate (1). A flow divider groove (402) is opened inside the flow divider block (401). A flow divider pipe (403) is fixedly installed on the right side of the flow divider block (401).

6. The anti-thermal expansion fin thermal conduction structure of the mold temperature controller cooling system according to claim 5, characterized in that: an inlet pipe (404) is fixedly installed on the left side of the flow divider (401), a flow guide plate (405) is fixedly installed on the right side inside the heat conduction plate (1), and an outlet pipe (406) is fixedly installed on the right side of the heat conduction plate (1).