CR20160441A - Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje - Google Patents

Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje

Info

Publication number
CR20160441A
CR20160441A CR20160441A CR20160441A CR20160441A CR 20160441 A CR20160441 A CR 20160441A CR 20160441 A CR20160441 A CR 20160441A CR 20160441 A CR20160441 A CR 20160441A CR 20160441 A CR20160441 A CR 20160441A
Authority
CR
Costa Rica
Prior art keywords
assembly structure
procedure
manufacture
circuit
hollow space
Prior art date
Application number
CR20160441A
Other languages
English (en)
Inventor
Takayuki; Hashimoto
Takuya; Ishibashi
Masatoshi; Fujimoto
Original Assignee
Nagase Chemtex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase Chemtex Corp filed Critical Nagase Chemtex Corp
Publication of CR20160441A publication Critical patent/CR20160441A/es

Links

Classifications

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    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Ceramic Engineering (AREA)
  • Textile Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)

Abstract

Un miembro de circuito que incluye: un elemento que tiene una región funcional; una cubierta de tabla dispuesta opuesta a la región funcional; y una nervadura formada para rodear la región funcional, para proporcionar un espacio entre la región funcional y la cubierta. L a cubierta incluye una lámina S que tiene un espesor de 100 micras o menos. La lámina S tiene un módulo de tracción elástica Es a 175° C de la lámina S es preferiblemente 20GPa o más.
CR20160441A 2014-03-31 2015-03-31 Miembro de circuito y estructura de montaje que tiene espacio hueco, y procedimiento para la fabricación de la estructura de montaje CR20160441A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014073326 2014-03-31
PCT/JP2015/001860 WO2015151514A1 (ja) 2014-03-31 2015-03-31 中空部を有する回路部材および実装構造体、ならびに実装構造体の製造方法

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CR20160441A true CR20160441A (es) 2016-12-01

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EP (1) EP3128545A4 (es)
JP (1) JPWO2015151514A1 (es)
KR (1) KR20160140744A (es)
CN (1) CN106170854A (es)
CR (1) CR20160441A (es)
TW (1) TW201601260A (es)
WO (1) WO2015151514A1 (es)

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Publication number Publication date
TW201601260A (zh) 2016-01-01
JPWO2015151514A1 (ja) 2017-04-13
CN106170854A (zh) 2016-11-30
KR20160140744A (ko) 2016-12-07
US20170117874A1 (en) 2017-04-27
EP3128545A4 (en) 2018-02-28
WO2015151514A1 (ja) 2015-10-08
EP3128545A1 (en) 2017-02-08

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