CR9892A - Sistema de alineamiento de tres puntos de vision de una sola camara para un dispositivo manipulador - Google Patents

Sistema de alineamiento de tres puntos de vision de una sola camara para un dispositivo manipulador

Info

Publication number
CR9892A
CR9892A CR9892A CR9892A CR9892A CR 9892 A CR9892 A CR 9892A CR 9892 A CR9892 A CR 9892A CR 9892 A CR9892 A CR 9892A CR 9892 A CR9892 A CR 9892A
Authority
CR
Costa Rica
Prior art keywords
alignment
alignment system
tested
single camera
manipulator device
Prior art date
Application number
CR9892A
Other languages
English (en)
Inventor
Kexiang Ken Ding
Steve Ade
Larry Stuckey
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of CR9892A publication Critical patent/CR9892A/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Eye Examination Apparatus (AREA)

Abstract

Un sistema de alineamiento de vision para alinear un dispositivo que sera puesto a prueba incluye una camara de alineamiento posicionada sobre una porcion de alineamiento del sistema de alineamiento. Un sistema de iluminacion para emitir luz en un dispositivo que va ser puesto a prueba esta ubicado cercano a la camara de alineamiento. Se posicionan tres accionadores en una porcion de prueba del sistema de alineamiento de vision, para corregir una compensacion entre el objetivo de alineamiento y el dispositivo a ser puesto a prueba. Un manipulador de recoger y colocar transporta el objetivo de alineamiento y los dispositivos que van a ser puestos a prueba entre la porcion de prueba y la porcion de alineamiento.
CR9892A 2005-09-23 2008-04-17 Sistema de alineamiento de tres puntos de vision de una sola camara para un dispositivo manipulador CR9892A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71961405P 2005-09-23 2005-09-23

Publications (1)

Publication Number Publication Date
CR9892A true CR9892A (es) 2008-07-31

Family

ID=37527147

Family Applications (1)

Application Number Title Priority Date Filing Date
CR9892A CR9892A (es) 2005-09-23 2008-04-17 Sistema de alineamiento de tres puntos de vision de una sola camara para un dispositivo manipulador

Country Status (7)

Country Link
US (1) US20070185676A1 (es)
JP (1) JP2009509173A (es)
KR (1) KR20080053508A (es)
CR (1) CR9892A (es)
DE (1) DE112006002529T5 (es)
TW (1) TW200739779A (es)
WO (1) WO2007038199A1 (es)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7506451B1 (en) * 2008-05-23 2009-03-24 Delta Design, Inc. Camera based two-point vision alignment for semiconductor device testing handlers
US7842912B2 (en) * 2008-05-23 2010-11-30 Delta Design, Inc. Camera based vision alignment with device group guiding for semiconductor device testing handlers
US8106349B2 (en) * 2008-07-16 2012-01-31 Delta Design, Inc. Vision alignment with multiple cameras and common coordinate at contactor for IC device testing handlers
US20110010122A1 (en) * 2009-07-07 2011-01-13 Delta Design, Inc. Calibrating separately located cameras with a double sided visible calibration target for ic device testing handlers
CN102062578B (zh) * 2010-12-13 2012-11-28 西安交通大学 一种用于视觉坐标测量的手持式光学靶标及其测量方法
CN102543740A (zh) * 2010-12-22 2012-07-04 中芯国际集成电路制造(上海)有限公司 提高多晶硅栅极与接触孔之间叠对均匀性的方法
US9519810B2 (en) 2012-07-31 2016-12-13 Datalogic ADC, Inc. Calibration and self-test in automated data reading systems
US9268979B2 (en) 2013-09-09 2016-02-23 Datalogic ADC, Inc. System and method for aiming and calibrating a data reader
CN106959410B (zh) * 2013-11-11 2019-10-18 伊斯梅卡半导体控股公司 用于处理构件的组件和方法
TWI593968B (zh) * 2016-08-08 2017-08-01 由田新技股份有限公司 用於同時檢測複數個待測料片之移載設備及其單側式／雙側式檢測系統
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US11226390B2 (en) * 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
CN109799780B (zh) * 2018-11-20 2020-09-18 武汉华中数控股份有限公司 一种基于数控机床批量加工的工件尺寸补偿方法
CN112433428B (zh) * 2020-08-18 2022-01-04 深圳市安华光电技术有限公司 Dlp投影仪、光机和led光源装置校准方法
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
US12444633B2 (en) * 2021-08-30 2025-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. Workpiece handling system, method of calibrating workpiece handling system and method of manufacturing semiconductor package
CN121475843B (zh) * 2025-10-23 2026-05-15 北京科技大学 一种材料断裂韧性测试装置及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475805A (en) * 1967-06-26 1969-11-04 Ibm Apparatus for positioning articles on substrates
JPH0713990B2 (ja) * 1985-04-02 1995-02-15 東京エレクトロン株式会社 プローブ針とパッドの位置合わせ方法
JP2662215B2 (ja) * 1986-11-19 1997-10-08 株式会社日立製作所 細胞保持装置
DE4114284C2 (de) * 1991-05-02 1993-10-07 Juergen Dipl Ing Pickenhan Vorrichtung zum Behandeln oder Bearbeiten eines Werkstückes, insbesondere einer Schaltkarte
JPH0782076B2 (ja) * 1992-12-28 1995-09-06 東京電子工業株式会社 プローブコンタクト用ステージ装置
US6356093B2 (en) * 1998-06-02 2002-03-12 Nidec-Read Corporation Printed circuit board testing apparatus
US6825927B2 (en) * 2001-06-15 2004-11-30 Mj Research, Inc. Controller for a fluorometer
US20030188997A1 (en) * 2002-03-29 2003-10-09 Tan Beng Soon Semiconductor inspection system and method
KR100535636B1 (ko) * 2003-02-24 2005-12-08 매그나칩 반도체 유한회사 불량 화소 보상 기능을 갖는 이미지센서
EP1455179A1 (en) * 2003-03-07 2004-09-08 MV Research Limited A machine vision inspection system and method
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features

Also Published As

Publication number Publication date
KR20080053508A (ko) 2008-06-13
JP2009509173A (ja) 2009-03-05
TW200739779A (en) 2007-10-16
US20070185676A1 (en) 2007-08-09
WO2007038199A1 (en) 2007-04-05
DE112006002529T5 (de) 2008-08-14

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Legal Events

Date Code Title Description
FA Abandonment or withdrawal (granting procedure)