CS269761B1 - Soldering/or brazing/compound - Google Patents

Soldering/or brazing/compound Download PDF

Info

Publication number
CS269761B1
CS269761B1 CS848469A CS846984A CS269761B1 CS 269761 B1 CS269761 B1 CS 269761B1 CS 848469 A CS848469 A CS 848469A CS 846984 A CS846984 A CS 846984A CS 269761 B1 CS269761 B1 CS 269761B1
Authority
CS
Czechoslovakia
Prior art keywords
activity
flux
temperature
boric
blend
Prior art date
Application number
CS848469A
Other languages
Czech (cs)
English (en)
Other versions
CS846984A1 (en
Inventor
Alexej A Rossosinskij
Alexej G Bolsecenko
Anatolij K Gajdusenko
Vadim D Pirog
Jevgenij I Frumin
Mark A Pascenko
Vjaceslav A Beleckij
Original Assignee
Alexej A Rossosinskij
Alexej G Bolsecenko
Anatolij K Gajdusenko
Vadim D Pirog
Jevgenij I Frumin
Mark A Pascenko
Vjaceslav A Beleckij
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alexej A Rossosinskij, Alexej G Bolsecenko, Anatolij K Gajdusenko, Vadim D Pirog, Jevgenij I Frumin, Mark A Pascenko, Vjaceslav A Beleckij filed Critical Alexej A Rossosinskij
Publication of CS846984A1 publication Critical patent/CS846984A1/cs
Publication of CS269761B1 publication Critical patent/CS269761B1/cs

Links

Landscapes

  • Nonmetallic Welding Materials (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
CS848469A 1983-11-09 1984-11-07 Soldering/or brazing/compound CS269761B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU833671192A SU1104758A1 (ru) 1983-11-09 1983-11-09 Па льна смесь

Publications (2)

Publication Number Publication Date
CS846984A1 CS846984A1 (en) 1987-10-15
CS269761B1 true CS269761B1 (en) 1990-05-14

Family

ID=21092374

Family Applications (1)

Application Number Title Priority Date Filing Date
CS848469A CS269761B1 (en) 1983-11-09 1984-11-07 Soldering/or brazing/compound

Country Status (4)

Country Link
BG (1) BG50079A1 (de)
CS (1) CS269761B1 (de)
DD (1) DD263655A3 (de)
SU (1) SU1104758A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19921332A1 (de) * 1999-05-08 2000-11-16 Degussa Flußmittel für das Hartlöten von schwerbenetzbaren metallischen Werkstoffen

Also Published As

Publication number Publication date
CS846984A1 (en) 1987-10-15
SU1104758A1 (ru) 1985-12-07
BG50079A1 (en) 1992-05-15
DD263655A3 (de) 1989-01-11

Similar Documents

Publication Publication Date Title
US7488445B2 (en) Lead-free solder and soldered article
US4020987A (en) Solder preform for use in hermetically sealing a container
US20050100474A1 (en) Anti-tombstoning lead free alloys for surface mount reflow soldering
KR19980068127A (ko) 납땜용 무연 합금
GB688172A (en) An improved soldering device
KR20010112627A (ko) Ｐｂ를 함유하지 않은 솔더 조성물 및 솔더링된 물품
CA2295558A1 (en) Solder braze alloy
PL194822B1 (pl) Bezkadmowe stopy lutów twardych, ich zastosowanie, sposób lutowania metali twardych i sposób lutowania elementów z metali twardych
TW201342403A (zh) 線圈零件
MY190755A (en) Soldered joint and method for forming soldered joint
KR101203534B1 (ko) 구리계 브레이징 솔더 합금, 이의 제품 및 브레이징 방법
CS269761B1 (en) Soldering/or brazing/compound
USRE30348E (en) Solder preform
EP0103805B1 (de) Homogene niedrigschmelzende Kupferbasislegierung
US4460658A (en) Homogeneous low melting point copper based alloys
CA1216441A (en) Homogeneous low melting point copper based alloys
ATE112705T1 (de) Schweiss- und/oder lötmaterial.
GB2036794A (en) Solder Preform
US4448851A (en) Homogeneous low melting point copper based alloys
US4497430A (en) Brazing method using homogeneous low melting point copper based alloys
JPS55103298A (en) Gold braze alloy for dental
US4497429A (en) Process for joining together two or more metal parts using a homogeneous low melting point copper based alloys
CN102862000B (zh) 含Nd、Ga和Te的Sn-Zn无铅钎料
JPS63207494A (ja) Ｚｎ系ろう材用フラツクス
SU956202A1 (ru) Припой дл пайки керамики с керамикой и металлом