CZ310213B8 - Výkonový modul pro polovodičový jistič - Google Patents

Výkonový modul pro polovodičový jistič

Info

Publication number
CZ310213B8
CZ310213B8 CZ2023-41A CZ202341A CZ310213B8 CZ 310213 B8 CZ310213 B8 CZ 310213B8 CZ 202341 A CZ202341 A CZ 202341A CZ 310213 B8 CZ310213 B8 CZ 310213B8
Authority
CZ
Czechia
Prior art keywords
electrically conductive
power
cooler
auxiliary
circuit breaker
Prior art date
Application number
CZ2023-41A
Other languages
English (en)
Other versions
CZ310213B6 (cs
CZ202341A3 (cs
Inventor
Zdeněk PEROUTKA
Martin Jára
Jan Řeboun
Original Assignee
Západočeská Univerzita V Plzni
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Západočeská Univerzita V Plzni filed Critical Západočeská Univerzita V Plzni
Priority to CZ2023-41A priority Critical patent/CZ310213B8/cs
Priority to EP24713379.6A priority patent/EP4490780B1/en
Priority to PCT/CZ2024/050005 priority patent/WO2024160308A1/en
Publication of CZ202341A3 publication Critical patent/CZ202341A3/cs
Publication of CZ310213B6 publication Critical patent/CZ310213B6/cs
Publication of CZ310213B8 publication Critical patent/CZ310213B8/cs

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/25—Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques
    • G01R19/2513—Arrangements for monitoring electric power systems, e.g. power lines or loads; Logging
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current
    • H02H3/087—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current for DC applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Výkonový modul pro polovodičový jistič obsahuje chladič (1) z dielektrického materiálu s tepelnou vodivostí vyšší než 20 W/m/K, který je na svém povrchu opatřen výkonovým elektricky vodivým motivem (3). Na výkonovém elektricky vodivém motivu (3) je uložen a výkonovým elektricky vodivým spojem (2) připojen obousměrný polovodičový spínač (5). Elektricky vodivý motiv (3) je propojen s pomocnými dielektrickými substráty (9), na nichž jsou umístěny nevýkonové elektricky vodivé motivy (18) propojující nevýkonové obvody (7). Alespoň chladič (1), polovodičový spínač (5), pomocné dielektrické substráty (9) a nevýkonové obvody (7) jsou společně obsaženy v monolitické vícevrstvé struktuře, jejíž prvky jsou spojeny celými svými styčnými plochami. Chladič (1) může být mechanicky a teplovodivě spojen s pomocným chladičem (14) z elektricky vodivého materiálu s tepelnou vodivostí vyšší než 180 W/m/K. Spojení je provedeno kontaktní vrstvou (20) pro kompenzaci rozdílné tepelné roztažnosti chladiče (1) a pomocného chladiče (14).
CZ2023-41A 2023-01-31 2023-01-31 Výkonový modul pro polovodičový jistič CZ310213B8 (cs)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CZ2023-41A CZ310213B8 (cs) 2023-01-31 2023-01-31 Výkonový modul pro polovodičový jistič
EP24713379.6A EP4490780B1 (en) 2023-01-31 2024-01-31 Power module for solid-state circuit breaker
PCT/CZ2024/050005 WO2024160308A1 (en) 2023-01-31 2024-01-31 Power module for solid-state circuit breaker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CZ2023-41A CZ310213B8 (cs) 2023-01-31 2023-01-31 Výkonový modul pro polovodičový jistič

Publications (3)

Publication Number Publication Date
CZ202341A3 CZ202341A3 (cs) 2024-08-07
CZ310213B6 CZ310213B6 (cs) 2024-11-27
CZ310213B8 true CZ310213B8 (cs) 2025-02-05

Family

ID=90417433

Family Applications (1)

Application Number Title Priority Date Filing Date
CZ2023-41A CZ310213B8 (cs) 2023-01-31 2023-01-31 Výkonový modul pro polovodičový jistič

Country Status (3)

Country Link
EP (1) EP4490780B1 (cs)
CZ (1) CZ310213B8 (cs)
WO (1) WO2024160308A1 (cs)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018056B2 (en) * 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices
JP2011254387A (ja) * 2010-06-03 2011-12-15 Rohm Co Ltd 交流スイッチ
US9095054B1 (en) * 2012-10-12 2015-07-28 Arkansas Power Electronics International, Inc. High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devices
DE102014111931B4 (de) * 2014-08-20 2021-07-08 Infineon Technologies Ag Niederinduktive Schaltungsanordnung mit Laststromsammelleiterbahn
US9839146B2 (en) * 2015-10-20 2017-12-05 Cree, Inc. High voltage power module
US11342151B2 (en) * 2019-05-18 2022-05-24 Amber Solutions, Inc. Intelligent circuit breakers with visual indicators to provide operational status
CN115461629A (zh) * 2020-01-21 2022-12-09 安泊半导体公司 智能电路中断
WO2022005134A1 (ko) * 2020-07-03 2022-01-06 주식회사 아모센스 파워모듈
EP4203010B1 (en) * 2020-09-15 2025-07-30 Huawei Technologies Co., Ltd. Power module, converter, and electronic device
DE102021202197A1 (de) * 2021-03-08 2022-09-08 Robert Bosch Gesellschaft mit beschränkter Haftung Leistungsmodul mit einem keramischen Schaltungsträger, einer flexiblen Leiterplatte und einem Temperatursensor

Also Published As

Publication number Publication date
EP4490780A1 (en) 2025-01-15
EP4490780C0 (en) 2025-05-14
WO2024160308A1 (en) 2024-08-08
EP4490780B1 (en) 2025-05-14
CZ310213B6 (cs) 2024-11-27
CZ202341A3 (cs) 2024-08-07

Similar Documents

Publication Publication Date Title
US3686533A (en) Heat sink mounting arrangement for integrated circuits
GB1365374A (en) Power supply module
WO2008123766A3 (en) High thermal-efficient metal core printed circuit board with selective electrical and thermal circuitry connectivity
MY133518A (en) Electronic package with high density interconnect layer
CA2002213A1 (en) High Performance Integrated Circuit Chip Package and Method of Making Same
US11652091B2 (en) Solid state switching device including nested control electronics
ATE368301T1 (de) Leistungshalbleitermodul
CZ310213B8 (cs) Výkonový modul pro polovodičový jistič
US7042730B2 (en) Non-isolated heatsink(s) for power modules
ATE271259T1 (de) Elektronisches leistungselement mit kühlvorrichtung
US11297727B2 (en) Power electronic module
CN113691165B (zh) 一种工业用集成式热电发电装置
CN116435273A (zh) 一种覆铜陶瓷基板散热器及其制备方法
US20240260470A1 (en) Thermoelectric module
CN110349862A (zh) 一种ic芯片自控温机构及其制备方法
KR100663117B1 (ko) 열전 모듈
KR930022170A (ko) 휴대형 전자계산기
KR102638854B1 (ko) 고전압, 고발열에 특화된 led 조명장치용 기판, 그를 가지는 led 조명장치
WO2023059519A3 (en) Thermal management techniques for high power integrated circuits operating in dry cryogenic environments
Semenyuk et al. Novel thermoelectric modules for cooling powerful LEDs: Experimental results
SE9702593D0 (sv) Anordning vid ett kretskort
WO2018215409A1 (en) Power switch
WO2011035620A1 (zh) 电容补偿投切开关
CN106659071A (zh) 一种散热底板及具有该底板的电源模块及无人机
CN222706923U (zh) 一种铝基板制冷片