DD297669A5 - Verfahren zur direkten metallisierung von leiterplatten - Google Patents

Verfahren zur direkten metallisierung von leiterplatten Download PDF

Info

Publication number: DD297669A5
Authority: DD; German Democratic Republic
Prior art keywords: oxidizing agent; permanganate; layer; conductive; oxidizing
Prior art date: 1989-09-14

Application number

DD90343977A

Other languages

German (de)

English (en)

Inventor

Burkhard Bressel

Heinrich Meyer

Walter Meyer

Klaus Gedrat

Original Assignee

��@��k��

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-09-14

Filing date

1990-09-12

Publication date

1992-01-16

1989-09-14 Priority claimed from DE3931003A external-priority patent/DE3931003A1/de

1990-09-12 Application filed by ��@��k�� filed Critical ��@��k��

1992-01-16 Publication of DD297669A5 publication Critical patent/DD297669A5/de

Links

238000000034 method Methods 0.000 title claims abstract description 67
238000001465 metallisation Methods 0.000 title claims abstract description 23
239000007800 oxidant agent Substances 0.000 claims abstract description 25
230000008569 process Effects 0.000 claims abstract description 25
239000000178 monomer Substances 0.000 claims abstract description 17
238000001179 sorption measurement Methods 0.000 claims abstract description 16
229920001940 conductive polymer Polymers 0.000 claims abstract description 15
239000003792 electrolyte Substances 0.000 claims abstract description 10
239000011148 porous material Substances 0.000 claims abstract description 5
238000009713 electroplating Methods 0.000 claims abstract description 3
239000000463 material Substances 0.000 claims description 13
238000004519 manufacturing process Methods 0.000 claims description 12
230000001590 oxidative effect Effects 0.000 claims description 11
239000002253 acid Substances 0.000 claims description 10
238000006243 chemical reaction Methods 0.000 claims description 8
238000007788 roughening Methods 0.000 claims description 4
230000008961 swelling Effects 0.000 claims description 4
230000002378 acidificating effect Effects 0.000 claims description 3
238000005507 spraying Methods 0.000 claims description 3
238000003860 storage Methods 0.000 claims description 3
ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 2
SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 claims description 2
150000004679 hydroxides Chemical class 0.000 claims description 2
239000011572 manganese Substances 0.000 claims description 2
AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 2
PPNAOCWZXJOHFK-UHFFFAOYSA-N manganese(2+);oxygen(2-) Chemical class [O-2].[Mn+2] PPNAOCWZXJOHFK-UHFFFAOYSA-N 0.000 claims description 2
230000006641 stabilisation Effects 0.000 claims description 2
238000011105 stabilization Methods 0.000 claims description 2
239000003153 chemical reaction reagent Substances 0.000 claims 1
238000004140 cleaning Methods 0.000 claims 1
238000009434 installation Methods 0.000 claims 1
239000010410 layer Substances 0.000 description 52
239000010949 copper Substances 0.000 description 28
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
229910052802 copper Inorganic materials 0.000 description 23
239000000243 solution Substances 0.000 description 14
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 12
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
229910052751 metal Inorganic materials 0.000 description 7
239000002184 metal Substances 0.000 description 7
238000007747 plating Methods 0.000 description 6
238000012545 processing Methods 0.000 description 6
239000012190 activator Substances 0.000 description 5
239000007864 aqueous solution Substances 0.000 description 5
230000008901 benefit Effects 0.000 description 5
229920000128 polypyrrole Polymers 0.000 description 5
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
239000004020 conductor Substances 0.000 description 4
239000002243 precursor Substances 0.000 description 4
238000009736 wetting Methods 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
239000002322 conducting polymer Substances 0.000 description 3
238000001035 drying Methods 0.000 description 3
238000005516 engineering process Methods 0.000 description 3
239000003365 glass fiber Substances 0.000 description 3
YZTQKMVBEGUONQ-UHFFFAOYSA-N manganese(4+) Chemical class [Mn+4] YZTQKMVBEGUONQ-UHFFFAOYSA-N 0.000 description 3
239000003960 organic solvent Substances 0.000 description 3
239000011347 resin Substances 0.000 description 3
229920005989 resin Polymers 0.000 description 3
CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 3
PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
229910001128 Sn alloy Inorganic materials 0.000 description 2
230000004913 activation Effects 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
238000000576 coating method Methods 0.000 description 2
238000011109 contamination Methods 0.000 description 2
238000005868 electrolysis reaction Methods 0.000 description 2
230000007613 environmental effect Effects 0.000 description 2
239000011229 interlayer Substances 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
238000012423 maintenance Methods 0.000 description 2
NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
238000012544 monitoring process Methods 0.000 description 2
229910000510 noble metal Inorganic materials 0.000 description 2
230000003647 oxidation Effects 0.000 description 2
238000007254 oxidation reaction Methods 0.000 description 2
238000006116 polymerization reaction Methods 0.000 description 2
239000000126 substance Substances 0.000 description 2
239000000758 substrate Substances 0.000 description 2
238000012546 transfer Methods 0.000 description 2
229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
229910000990 Ni alloy Inorganic materials 0.000 description 1
229910000978 Pb alloy Inorganic materials 0.000 description 1
239000004695 Polyether sulfone Substances 0.000 description 1
239000004697 Polyetherimide Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
238000010306 acid treatment Methods 0.000 description 1
239000003929 acidic solution Substances 0.000 description 1
230000001464 adherent effect Effects 0.000 description 1
239000012790 adhesive layer Substances 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000000969 carrier Substances 0.000 description 1
230000008859 change Effects 0.000 description 1
239000011651 chromium Substances 0.000 description 1
229940117975 chromium trioxide Drugs 0.000 description 1
WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
238000005253 cladding Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
239000000084 colloidal system Substances 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
230000001143 conditioned effect Effects 0.000 description 1
239000011529 conductive interlayer Substances 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
239000013039 cover film Substances 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000006735 deficit Effects 0.000 description 1
230000018044 dehydration Effects 0.000 description 1
238000006297 dehydration reaction Methods 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000013461 design Methods 0.000 description 1
SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
238000007772 electroless plating Methods 0.000 description 1
238000005538 encapsulation Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000011151 fibre-reinforced plastic Substances 0.000 description 1
239000010408 film Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
230000036541 health Effects 0.000 description 1
125000000623 heterocyclic group Chemical group 0.000 description 1
230000002045 lasting effect Effects 0.000 description 1
238000011068 loading method Methods 0.000 description 1
230000007246 mechanism Effects 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
239000000203 mixture Substances 0.000 description 1
235000006408 oxalic acid Nutrition 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
238000005554 pickling Methods 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920006393 polyether sulfone Polymers 0.000 description 1
229920001601 polyetherimide Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
239000010970 precious metal Substances 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000007639 printing Methods 0.000 description 1
238000004886 process control Methods 0.000 description 1
239000010909 process residue Substances 0.000 description 1
230000001737 promoting effect Effects 0.000 description 1
238000010926 purge Methods 0.000 description 1
238000000746 purification Methods 0.000 description 1
125000000168 pyrrolyl group Chemical group 0.000 description 1
239000000376 reactant Substances 0.000 description 1
230000035484 reaction time Effects 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
230000035945 sensitivity Effects 0.000 description 1
238000004904 shortening Methods 0.000 description 1
239000007921 spray Substances 0.000 description 1
238000002604 ultrasonography Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Medicinal Chemistry (AREA)
Health & Medical Sciences (AREA)
Polymers & Plastics (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating Methods And Accessories (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Chemically Coating (AREA)
Laminated Bodies (AREA)
Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

DD90343977A 1989-09-14 1990-09-12 Verfahren zur direkten metallisierung von leiterplatten DD297669A5 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE3931003A DE3931003A1 (de)	1989-09-14	1989-09-14	Verfahren zur direkten metallisierung von leiterplatten
DE3940565		1989-12-05

Publications (1)

Publication Number	Publication Date
DD297669A5 true DD297669A5 (de)	1992-01-16

Family

ID=25885248

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DD90343977A DD297669A5 (de)	1989-09-14	1990-09-12	Verfahren zur direkten metallisierung von leiterplatten

Country Status (9)

Country	Link
EP (1)	EP0417750B1 (fr)
JP (1)	JP2871828B2 (fr)
KR (1)	KR100216328B1 (fr)
CN (1)	CN1021949C (fr)
AT (1)	ATE145313T1 (fr)
CA (1)	CA2025337C (fr)
DD (1)	DD297669A5 (fr)
DE (1)	DE59010565D1 (fr)
ES (1)	ES2095227T3 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4040226C2 (de) *	1990-12-15	1994-09-29	Hoellmueller Maschbau H	Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern)
US5840363A (en) *	1993-04-30	1998-11-24	Grundig Ag	Process for throughplating printed circuit boards using conductive plastics
DE4314259C2 (de) *	1993-04-30	1997-04-10	Grundig Emv	Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung
FR2737507B1 (fr) *	1995-08-04	1997-09-26	Scps	Structures poreuses complexes metallisees ou metalliques, premetallisees par depot d'un polymere conducteur
DE19637018A1 (de) *	1996-09-12	1998-03-19	Bayer Ag	Verfahren zur Herstellung von starren und flexiblen Schaltungen
DE10124631C1 (de) *	2001-05-18	2002-11-21	Atotech Deutschland Gmbh	Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
WO2004098303A1 (fr)	2003-04-16	2004-11-18	Vdf Futureceuticals	Produits de fruits du cafeier a faible teneur en mycotoxines
CN104018196A (zh) *	2013-02-28	2014-09-03	武汉孟鼎电化学技术有限公司	印制线路板无化学镀直接电镀方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0206133B1 (fr) *	1985-06-12	1991-07-31	BASF Aktiengesellschaft	Utilisation de polypyrrole pur déposer de cuivre métallique sur des matériaux non-électriquement conductibles
ATE111294T1 (de) *	1988-03-03	1994-09-15	Blasberg Oberflaechentech	Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.

1990
- 1990-09-12 DD DD90343977A patent/DD297669A5/de not_active IP Right Cessation
- 1990-09-12 DE DE59010565T patent/DE59010565D1/de not_active Expired - Lifetime
- 1990-09-12 EP EP90117529A patent/EP0417750B1/fr not_active Expired - Lifetime
- 1990-09-12 ES ES90117529T patent/ES2095227T3/es not_active Expired - Lifetime
- 1990-09-12 KR KR1019900014344A patent/KR100216328B1/ko not_active Expired - Lifetime
- 1990-09-12 AT AT90117529T patent/ATE145313T1/de not_active IP Right Cessation
- 1990-09-13 CA CA002025337A patent/CA2025337C/fr not_active Expired - Lifetime
- 1990-09-14 JP JP2242865A patent/JP2871828B2/ja not_active Expired - Lifetime
- 1990-09-14 CN CN90108440A patent/CN1021949C/zh not_active Expired - Lifetime

Also Published As

Publication number	Publication date
CA2025337C (fr)	2001-04-17
EP0417750A3 (en)	1991-10-30
CN1021949C (zh)	1993-08-25
JP2871828B2 (ja)	1999-03-17
CA2025337A1 (fr)	1991-03-15
ES2095227T3 (es)	1997-02-16
JPH03175692A (ja)	1991-07-30
EP0417750B1 (fr)	1996-11-13
CN1050965A (zh)	1991-04-24
DE59010565D1 (de)	1996-12-19
KR100216328B1 (ko)	1999-08-16
KR910006516A (ko)	1991-04-29
EP0417750A2 (fr)	1991-03-20
ATE145313T1 (de)	1996-11-15

Legal Events

Date	Code	Title
1994-03-17	RPI	Change in the person, name or address of the patentee (searches according to art. 11 and 12 extension act)
1994-05-05	RPV	Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
1995-04-27	RPV	Change in the person, the name or the address of the representative (searches according to art. 11 and 12 extension act)
1999-02-18	ENJ	Ceased due to non-payment of renewal fee

Publication	Publication Date	Title
DE3928832C2 (de)	1995-04-20	Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
DE68918085T2 (de)	1995-01-26	Gedruckte schaltplatte mit metallisierten löchern und deren herstellung.
DE3341431C3 (de)	1995-06-01	Verfahren zur Vorbereitung der Oberflächen von Kunstharzsubstraten, insbesondere der Bohrungen von gedruckten Schaltungen, für die chemische Metallabscheidung
DE69020796T2 (de)	1996-03-14	Direkt-Elektroplattieren von Durchgangslöchern.
EP0227857B1 (fr)	1990-03-28	Procédé de fabrication de circuits imprimés
DE2265194A1 (de)	1976-09-09	Verfahren zur vorbehandlung fuer das metallisieren von kunststoffen
DE3323476A1 (de)	1984-01-05	Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
DE60203050T2 (de)	2006-02-23	Regenerationsverfahren für eine plattierungslösung
EP1088121A2 (fr)	2001-04-04	Procede pour metalliser des substrats
DE19740431C1 (de)	1998-11-12	Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats
DE3741459C1 (de)	1989-04-13	Verfahren zur Herstellung durchkontaktierter Leiterplatten
EP0160966A2 (fr)	1985-11-13	Procédé de fabrication d'un dessin métallique sur un substrat isolant et substrat isolant comportant un dessin métallique, en particulier circuits imprimés
DD283580A5 (de)	1990-10-17	Verfahren zur herstellung von durchkontaktierten ein- oder mehrlagigen leiterplatten und durchkontaktieren ein-oder mehrlagige leiterplatte
EP0417750B1 (fr)	1996-11-13	Procédé de metallisation directe de plaques à circuits
EP0502023B1 (fr)	2000-01-12	Metallisation de non conducteurs
DE3800682A1 (de)	1989-07-27	Verfahren zur herstellung von elektrischen leiterplatten
DE3931003A1 (de)	1991-03-28	Verfahren zur direkten metallisierung von leiterplatten
DD297194A5 (de)	1992-01-02	Verfahren zur direkten metallisierung eines nicht leitenden substrates
DE1665314B1 (de)	1971-03-04	Basismaterial zur herstellung gedruckter schaltungen
DE4314259C2 (de)	1997-04-10	Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung
DE10220684B4 (de)	2011-12-08	Verwendung eines Verfahrens zur Herstellung leitender Polymere mit hoher Metallisierungsfähigkeit zur Durchmetallisierung von kaschierten Basismaterialien zur Leiterplattenherstellung
EP0581823B1 (fr)	1996-07-31	Agent pour la formation selective d'une couche mince oxydante
DE4113654A1 (de)	1992-10-29	Mittel zur selektiven ausbildung einer duennen oxidierenden schicht
WO1993020263A1 (fr)	1993-10-14	Procede de metallisation de non-conducteurs, notamment de cartes de circuits imprimes