DD300087A5 - Geschützte leitende Folie und Verfahren zum Schutz einer galvanischen Metallfolie während der weiteren Bearbeitung - Google Patents

Geschützte leitende Folie und Verfahren zum Schutz einer galvanischen Metallfolie während der weiteren Bearbeitung Download PDF

Info

Publication number: DD300087A5
Authority: DD; German Democratic Republic
Prior art keywords: film; layer; plastic film; protected; plastic
Prior art date: 1989-05-05

Application number

DD340392A

Other languages

German (de)

English (en)

Original Assignee

Gould Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-05-05

Filing date

1990-05-04

Publication date

1992-05-21

1990-05-04 Application filed by Gould Inc filed Critical Gould Inc

1992-05-21 Publication of DD300087A5 publication Critical patent/DD300087A5/de

Links

239000011888 foil Substances 0.000 title claims abstract description 50
238000012545 processing Methods 0.000 title claims abstract description 16
238000000034 method Methods 0.000 title claims description 68
229910052751 metal Inorganic materials 0.000 title claims description 28
239000002184 metal Substances 0.000 title claims description 28
239000002985 plastic film Substances 0.000 claims abstract description 132
229920006255 plastic film Polymers 0.000 claims abstract description 131
238000010030 laminating Methods 0.000 claims abstract description 43
239000011248 coating agent Substances 0.000 claims abstract description 33
238000000576 coating method Methods 0.000 claims abstract description 33
239000000853 adhesive Substances 0.000 claims abstract description 32
230000001070 adhesive effect Effects 0.000 claims abstract description 32
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
239000011889 copper foil Substances 0.000 claims abstract description 17
-1 polyethylene Polymers 0.000 claims abstract description 11
238000010276 construction Methods 0.000 claims description 55
230000008569 process Effects 0.000 claims description 30
238000011282 treatment Methods 0.000 claims description 24
239000004033 plastic Substances 0.000 claims description 15
229920003023 plastic Polymers 0.000 claims description 15
238000003475 lamination Methods 0.000 claims description 14
229920000728 polyester Polymers 0.000 claims description 14
229910052802 copper Inorganic materials 0.000 claims description 11
239000010949 copper Substances 0.000 claims description 11
239000000126 substance Substances 0.000 claims description 11
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
229920005989 resin Polymers 0.000 claims description 10
239000011347 resin Substances 0.000 claims description 10
229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
239000005020 polyethylene terephthalate Substances 0.000 claims description 8
238000011179 visual inspection Methods 0.000 claims description 7
238000003825 pressing Methods 0.000 claims description 6
229910052759 nickel Inorganic materials 0.000 claims description 5
230000002093 peripheral effect Effects 0.000 claims description 5
229920006267 polyester film Polymers 0.000 claims description 3
238000007747 plating Methods 0.000 claims description 2
239000010410 layer Substances 0.000 claims 55
230000000007 visual effect Effects 0.000 claims 2
239000011229 interlayer Substances 0.000 claims 1
230000001681 protective effect Effects 0.000 claims 1
238000004804 winding Methods 0.000 claims 1
239000000463 material Substances 0.000 abstract description 35
238000004519 manufacturing process Methods 0.000 abstract description 18
238000013517 stratification Methods 0.000 abstract description 9
238000003860 storage Methods 0.000 abstract description 4
239000004698 Polyethylene Substances 0.000 abstract 2
229920000573 polyethylene Polymers 0.000 abstract 2
230000006870 function Effects 0.000 description 14
238000011109 contamination Methods 0.000 description 11
238000004140 cleaning Methods 0.000 description 4
230000009993 protective function Effects 0.000 description 4
238000005530 etching Methods 0.000 description 3
230000003647 oxidation Effects 0.000 description 3
238000007254 oxidation reaction Methods 0.000 description 3
239000007858 starting material Substances 0.000 description 3
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
238000002144 chemical decomposition reaction Methods 0.000 description 2
229910052804 chromium Inorganic materials 0.000 description 2
239000011651 chromium Substances 0.000 description 2
239000004020 conductor Substances 0.000 description 2
230000009977 dual effect Effects 0.000 description 2
239000003365 glass fiber Substances 0.000 description 2
239000012535 impurity Substances 0.000 description 2
238000002844 melting Methods 0.000 description 2
230000008018 melting Effects 0.000 description 2
239000002245 particle Substances 0.000 description 2
238000007788 roughening Methods 0.000 description 2
230000006641 stabilisation Effects 0.000 description 2
238000011105 stabilization Methods 0.000 description 2
239000000758 substrate Substances 0.000 description 2
229920002799 BoPET Polymers 0.000 description 1
229910001369 Brass Inorganic materials 0.000 description 1
239000005751 Copper oxide Substances 0.000 description 1
239000004831 Hot glue Substances 0.000 description 1
239000005041 Mylar™ Substances 0.000 description 1
238000000137 annealing Methods 0.000 description 1
230000004888 barrier function Effects 0.000 description 1
239000010951 brass Substances 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
230000006835 compression Effects 0.000 description 1
238000007906 compression Methods 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
229910000431 copper oxide Inorganic materials 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
238000004132 cross linking Methods 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000007423 decrease Effects 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
238000013461 design Methods 0.000 description 1
238000010586 diagram Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
230000008030 elimination Effects 0.000 description 1
238000003379 elimination reaction Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000004744 fabric Substances 0.000 description 1
238000001914 filtration Methods 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000003754 machining Methods 0.000 description 1
229920003986 novolac Polymers 0.000 description 1
239000005416 organic matter Substances 0.000 description 1
238000010525 oxidative degradation reaction Methods 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
230000002265 prevention Effects 0.000 description 1
238000004537 pulping Methods 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
238000005096 rolling process Methods 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
238000010998 test method Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
- B32B2310/025—Electrostatic charges
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Quality & Reliability (AREA)
Laminated Bodies (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Manufacturing Of Printed Wiring (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Wrappers (AREA)

DD340392A 1989-05-05 1990-05-04 Geschützte leitende Folie und Verfahren zum Schutz einer galvanischen Metallfolie während der weiteren Bearbeitung DD300087A5 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US34784189A	1989-05-05	1989-05-05

Publications (1)

Publication Number	Publication Date
DD300087A5 true DD300087A5 (de)	1992-05-21

Family

ID=23365507

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DD340392A DD300087A5 (de)	1989-05-05	1990-05-04	Geschützte leitende Folie und Verfahren zum Schutz einer galvanischen Metallfolie während der weiteren Bearbeitung

Country Status (11)

Country	Link
EP (1)	EP0395871A3 (fr)
JP (1)	JP2790708B2 (fr)
KR (1)	KR900019550A (fr)
CN (1)	CN1047049A (fr)
AU (1)	AU631872B2 (fr)
BR (1)	BR9002105A (fr)
CA (1)	CA2016105A1 (fr)
DD (1)	DD300087A5 (fr)
IL (1)	IL94190A0 (fr)
MX (1)	MX171790B (fr)
MY (1)	MY105514A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5167997A (en) *	1989-05-05	1992-12-01	Gould Inc.	Protected conductive foil assemblage and procedure for preparing same using static electrical forces
JPH04369290A (ja) *	1991-06-18	1992-12-22	Furukawa Saakitsuto Foil Kk	保護フィルム付き両面粗化処理銅箔及びその製法
US5153050A (en) *	1991-08-27	1992-10-06	Johnston James A	Component of printed circuit boards
AU2527292A (en) *	1991-10-01	1993-04-08	Gould Electronics Inc	Improved protected conductive foil assemblage and procedure for preparing same using static electrical forces
US5399239A (en) *	1992-12-18	1995-03-21	Ceridian Corporation	Method of fabricating conductive structures on substrates
SG66765A1 (en) *	1993-12-02	2001-01-16	Heraeus Gmbh W C	Process and apparatus for producing a laminate
DE69933356T2 (de) *	1999-02-10	2007-05-10	Amc Centurion Ab	Verfahren und Vorrichtung zur Herstellung einer Rolle von Antennenelementen und zur Ausgabe derartiger Antennenelemente
CN1104328C (zh) *	1999-04-08	2003-04-02	孟庆连	半连续周期式生产金属复合带卷的方法
CN1081128C (zh) *	1999-08-18	2002-03-20	湖北省化学研究所	软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法
CN101437367B (zh) *	2007-11-14	2011-03-02	比亚迪股份有限公司	一种印刷线路板的制作方法
CN101987522B (zh) *	2009-08-06	2013-01-30	烟台万泰通信科技有限公司	双层塑料薄膜复合带制作方法
WO2011077764A1 (fr) *	2009-12-22	2011-06-30	Jx日鉱日石金属株式会社	Procédé de fabrication de stratifié, et stratifié
JP5190553B1 (ja) *	2012-03-06	2013-04-24	フリージア・マクロス株式会社	キャリア付き金属箔
CN106658952A (zh) *	2017-03-01	2017-05-10	苏州思诺林电子有限公司	一种线路板铜箔表面保护结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1246220B (de) *	1965-10-15	1967-08-03	Licentia Gmbh	Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw. Schichtpressstoffen
DE1778825A1 (de) *	1968-06-10	1971-08-26	Licentia Gmbh	Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen
US3655496A (en) *	1969-09-25	1972-04-11	Vitta Corp	Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates
JPS5517507B2 (fr) *	1972-06-29	1980-05-12
GB2091634B (en) *	1981-01-22	1984-12-05	Gen Electric	Transfer lamination of vapour deposited copper thin sheets and films
JPS588637A (ja) *	1981-07-08	1983-01-18	旭化成株式会社	ロ−ル状に巻取られた光重合性エレメント
JPS588636A (ja) *	1981-07-08	1983-01-18	旭化成株式会社	ロ−ル状に巻取られた光重合性エレメント
US4568413A (en) *	1983-07-25	1986-02-04	James J. Toth	Metallized and plated laminates

1990
- 1990-03-22 EP EP19900105400 patent/EP0395871A3/fr not_active Withdrawn
- 1990-03-22 MY MYPI90000454A patent/MY105514A/en unknown
- 1990-04-24 IL IL94190A patent/IL94190A0/xx unknown
- 1990-04-26 MX MX020487A patent/MX171790B/es unknown
- 1990-05-01 AU AU54611/90A patent/AU631872B2/en not_active Ceased
- 1990-05-04 DD DD340392A patent/DD300087A5/de unknown
- 1990-05-04 CN CN90102585A patent/CN1047049A/zh active Pending
- 1990-05-04 BR BR909002105A patent/BR9002105A/pt unknown
- 1990-05-04 CA CA002016105A patent/CA2016105A1/fr not_active Abandoned
- 1990-05-04 KR KR1019900006360A patent/KR900019550A/ko not_active Withdrawn
- 1990-05-07 JP JP2117309A patent/JP2790708B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
AU631872B2 (en)	1992-12-10
CA2016105A1 (fr)	1990-11-05
MX171790B (es)	1993-11-15
AU5461190A (en)	1990-11-08
JPH02307296A (ja)	1990-12-20
EP0395871A2 (fr)	1990-11-07
BR9002105A (pt)	1991-08-13
KR900019550A (ko)	1990-12-24
JP2790708B2 (ja)	1998-08-27
IL94190A0 (en)	1991-01-31
MY105514A (en)	1994-10-31
EP0395871A3 (fr)	1991-09-18
CN1047049A (zh)	1990-11-21

Publication	Publication Date	Title
DE69216839T2 (de)	1997-05-07	Komponente einer leiterplatte
DE4003344C1 (fr)	1991-06-13
DE69938322T2 (de)	2009-03-12	Mit Harz beschichtete Verbundfolie, ihre Herstellung und Verwendung
DE69031216T2 (de)	1998-02-05	Mehrschichtiger film und laminat zur verwendung bei der herstellung von gedru- ckten schaltungsplatten
DE69211693T2 (de)	1997-01-23	Verfahren zur herstellung einer mehrschichtigen leiterplatte
DE60120454T2 (de)	2006-12-07	Folie mit mehrschichtigem metall und verfahren zur herstellung derselben
DD300087A5 (de)	1992-05-21	Geschützte leitende Folie und Verfahren zum Schutz einer galvanischen Metallfolie während der weiteren Bearbeitung
DE69012019T2 (de)	1995-01-05	Aussenschichtmaterial von einer gedruckten mehrschichtleiterplatte und verfahren zu deren herstellung.
DE19851105C2 (de)	2002-07-18	Verfahren zum Herstellen eines mehrschichtigen Coextrudates
DE112008001439B4 (de)	2021-09-02	Verfahren zum Beschichten einer Verdrahtungsplatte, sowie Verdrahtungsplatte
DE10361046A1 (de)	2004-07-22	Vorrichtung und Verfahren zur Herstellung einer kontinuierlichen laminierten Thermoplastharz-Bahn
US5167997A (en)	1992-12-01	Protected conductive foil assemblage and procedure for preparing same using static electrical forces
DE69433411T2 (de)	2004-10-14	Herstellung einer mehrschichtigen kombinierten starr-flexiblen leiterplatte
DE60220107T2 (de)	2007-11-22	Verfahren zur Herstellung eines Metalllaminats
DE3711403A1 (de)	1988-10-20	Verfahren zur herstellung gedruckter schaltungen
EP0535868A1 (fr)	1993-04-07	Assemblage à feuille conductrice protégée et procédé pour préparer celui-ci en utilisant des forces électriques statiques
DE19643129A1 (de)	1997-04-30	Flexible gedruckte Schaltung
EP0299454B1 (fr)	1992-03-25	Méthode de fabrication de plaques à circuits imprimés à technique multicouche rigide ou rigide-flexible
DE69424535T2 (de)	2001-01-18	Trommelseite-behandelte metallfolie und laminat zur verwendung in leiterplatten und verfahren zur herstellung
DE2337032B2 (de)	1978-09-28	Verfahren zum Herstellen eines Basismaterials
DE3302857A1 (de)	1984-08-02	Verfahren zum herstellen von vorlaminaten fuer starrflexible leiterplatten
DE69312073T2 (de)	1998-01-15	Herstellungsverfahren einer vielschicht-leiterplatte
DE19653621A1 (de)	1997-07-03	Vielschichtstrukturen und Verfahren zu deren Herstellung
DE69123403T2 (de)	1997-04-24	Matter Film
DE2659625C3 (de)	1981-07-02	Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen