DE3482013D1 - Verfahren zum herstellen einer integrierten hybridschaltung. - Google Patents

Verfahren zum herstellen einer integrierten hybridschaltung.

Info

Publication number
DE3482013D1
DE3482013D1 DE8484113495T DE3482013T DE3482013D1 DE 3482013 D1 DE3482013 D1 DE 3482013D1 DE 8484113495 T DE8484113495 T DE 8484113495T DE 3482013 T DE3482013 T DE 3482013T DE 3482013 D1 DE3482013 D1 DE 3482013D1
Authority
DE
Germany
Prior art keywords
producing
hybrid circuit
integrated hybrid
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484113495T
Other languages
English (en)
Inventor
Kazuhiro C O Patent Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58210987A external-priority patent/JPS6054994B2/ja
Priority claimed from JP58210988A external-priority patent/JPS60103693A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3482013D1 publication Critical patent/DE3482013D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE8484113495T 1983-11-11 1984-11-08 Verfahren zum herstellen einer integrierten hybridschaltung. Expired - Lifetime DE3482013D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58210987A JPS6054994B2 (ja) 1983-11-11 1983-11-11 接着剤
JP58210988A JPS60103693A (ja) 1983-11-11 1983-11-11 混成集積回路の製造方法

Publications (1)

Publication Number Publication Date
DE3482013D1 true DE3482013D1 (de) 1990-05-23

Family

ID=26518369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484113495T Expired - Lifetime DE3482013D1 (de) 1983-11-11 1984-11-08 Verfahren zum herstellen einer integrierten hybridschaltung.

Country Status (3)

Country Link
US (1) US4635346A (de)
EP (1) EP0142783B1 (de)
DE (1) DE3482013D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3517965A1 (de) * 1985-05-18 1986-11-20 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung einer elektrischen schaltung in hybridtechnik
DE3787680T2 (de) * 1986-07-09 1994-03-10 Lintec Corp Klebestreifen zum Kleben von Plättchen.
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
DE3923023A1 (de) * 1989-07-12 1991-01-24 Siemens Ag Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren
US4928387A (en) * 1989-09-07 1990-05-29 Rockwell International Corp. Temporary soldering aid for manufacture of printed wiring assemblies
FR2685159B1 (fr) * 1991-12-17 1996-11-22 Matra Sep Imagerie Inf Procede de fabrication de circuits electroniques a micro-composants nus et circuit encapsule realisable par ce procede.
US5608261A (en) * 1994-12-28 1997-03-04 Intel Corporation High performance and high capacitance package with improved thermal dissipation
US5766975A (en) * 1995-01-09 1998-06-16 Integrated Device Technology, Inc. Packaged integrated circuit having thermal enhancement and reduced footprint size
US6505665B1 (en) * 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
US8231692B2 (en) * 2008-11-06 2012-07-31 International Business Machines Corporation Method for manufacturing an electronic device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1065965B (de) * 1956-12-04 1959-09-24
US3644252A (en) * 1969-05-13 1972-02-22 Velsicol Chemical Corp Adhesive compositions containing styrene/isobutylene copolymer
GB1370782A (en) * 1970-11-11 1974-10-16 Ciba Geigy Ag Adhesive compositions
JPS5232370B2 (de) * 1972-08-09 1977-08-20
US3970623A (en) * 1974-11-29 1976-07-20 The Goodyear Tire & Rubber Company Adhesive composition containing a copolymer of butadiene, styrene, and acrylonitrile, plus a tackifying resin
US4007311A (en) * 1975-11-06 1977-02-08 Shell Oil Company Polyacrylate-grafted block copolymer adhesive compositions
US4143005A (en) * 1977-09-19 1979-03-06 Rca Corporation Extrudable, non-flowing and non-aqueous solvent soluble hold down compound for printed wiring board assembly
US4215025A (en) * 1977-12-27 1980-07-29 Rca Corporation Water soluble adhesive coating for mounting components to printed wiring boards
US4251597A (en) * 1978-12-01 1981-02-17 Rohm And Haas Company Coating, impregnating and adhesive compositions curable at ambient temperature, and methods of using them
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US4162997A (en) * 1978-03-02 1979-07-31 Hercules Incorporated Heat-fusible pastes for printing inks, adhesives and moldings
JPS54144203A (en) * 1978-05-01 1979-11-10 Fuji Yakuhin Kogyo Kk Method of making flat printing plate
DE3064555D1 (en) * 1979-02-26 1983-09-22 Nat Res Dev Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US4372475A (en) * 1981-04-29 1983-02-08 Goforth Melvin L Electronic assembly process and apparatus
US4487638A (en) * 1982-11-24 1984-12-11 Burroughs Corporation Semiconductor die-attach technique and composition therefor

Also Published As

Publication number Publication date
EP0142783B1 (de) 1990-04-18
EP0142783A2 (de) 1985-05-29
EP0142783A3 (en) 1987-04-22
US4635346A (en) 1987-01-13

Similar Documents

Publication Publication Date Title
DE3786914D1 (de) Verfahren zum herstellen einer integrierten schaltungspackungsstruktur.
DE3381509D1 (de) Verfahren zum herstellen von halbleiteranordnungen.
DE3483280D1 (de) Verfahren zum herstellen einer mehrschicht-halbleiteranordnung.
DE3586732D1 (de) Verfahren zum herstellen einer dreidimentionaler halbleiteranordung.
DE3578614D1 (de) Verfahren zum herstellen von chip-einfuegungsschichten.
EP0104233A4 (de) Verfahren zur herstellung komplementärer halbleitervorrichtungen.
DE3483444D1 (de) Verfahren zur herstellung eines halbleiterbauelementes.
DE3686600D1 (de) Verfahren zum herstellen einer harzumhuellten halbleiteranordnung.
DE3485880D1 (de) Verfahren zur herstellung von halbleiteranordnungen.
DE3582556D1 (de) Verfahren zum herstellen von kontakten fuer integrierte schaltungen.
DE3483579D1 (de) Verfahren zum herstellen einer leiterbahn.
DE3583934D1 (de) Verfahren zum herstellen einer halbleiterverbundanordnung.
DE3576900D1 (de) Verfahren zum herstellen von gedruckten schaltungen.
DE3483531D1 (de) Verfahren zum herstellen einer integrierten halbleiterschaltkreisanordnung mit einem misfet.
DE3586109D1 (de) Verfahren zum herstellen einer verbindungsstruktur von einer halbleiteranordnung.
DE3784836D1 (de) Verfahren zum herstellen von schichtstoffteilen.
DE3776450D1 (de) Verfahren zum herstellen eines luftschall absorbierenden bauelements.
DE3382563D1 (de) Verfahren zum unterscheiden zwischen komplexen zeichenvorraeten.
DE68918306D1 (de) Verfahren zum Herstellen einer integrierten optoelektronischen Schaltung.
DE3485089D1 (de) Verfahren zur herstellung von halbleitervorrichtungen.
DE3671324D1 (de) Verfahren zum herstellen einer halbleiteranordnung.
DE3483809D1 (de) Verfahren zur herstellung einer dielektrisch isolierten integrierten schaltung.
DE3877282D1 (de) Verfahren zum herstellen einer halbleiter-vorrichtung.
EP0142783A3 (en) Method for producing hybrid integrated circuit
DE3484733D1 (de) Verfahren zur herstellung einer dielektrisch isolierten integrierten schaltungsanordnung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee