DE68915519D1 - Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind. - Google Patents

Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind.

Info

Publication number
DE68915519D1
DE68915519D1 DE68915519T DE68915519T DE68915519D1 DE 68915519 D1 DE68915519 D1 DE 68915519D1 DE 68915519 T DE68915519 T DE 68915519T DE 68915519 T DE68915519 T DE 68915519T DE 68915519 D1 DE68915519 D1 DE 68915519D1
Authority
DE
Germany
Prior art keywords
metals
difficult
plate
copper plating
plating process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68915519T
Other languages
English (en)
Other versions
DE68915519T2 (de
Inventor
Issa Said Mahmoud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68915519D1 publication Critical patent/DE68915519D1/de
Application granted granted Critical
Publication of DE68915519T2 publication Critical patent/DE68915519T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE1989615519 1988-12-21 1989-11-29 Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind. Expired - Fee Related DE68915519T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28999388A 1988-12-21 1988-12-21

Publications (2)

Publication Number Publication Date
DE68915519D1 true DE68915519D1 (de) 1994-06-30
DE68915519T2 DE68915519T2 (de) 1994-12-01

Family

ID=23114070

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989615519 Expired - Fee Related DE68915519T2 (de) 1988-12-21 1989-11-29 Kupfer-Plattierungsverfahren für Metalle, die schwer zu plattieren sind.

Country Status (3)

Country Link
EP (1) EP0375179B1 (de)
JP (1) JPH02232390A (de)
DE (1) DE68915519T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818294A1 (fr) * 2000-12-15 2002-06-21 Thomson Csf Revetement metallique conducteur anticorrosion, procede de fabrication dudit revetement, et produit utilise dans ledit procede
RU2194098C1 (ru) * 2001-06-29 2002-12-10 Калининградский государственный университет Электролит блестящего меднения
JP2010150622A (ja) * 2008-12-26 2010-07-08 Hitachi Ltd めっき液，凸状金属構造体を有する導電体基板、及び、その製造方法
CN103668355B (zh) * 2013-12-06 2016-05-11 南京三乐电子信息产业集团有限公司 一种行波管钨螺旋线表面的镀铜方法
FR3053352A1 (fr) 2016-07-04 2018-01-05 Airbus Safran Launchers Sas Composition de protection anticorrosion
DE102016113641A1 (de) 2016-07-25 2018-01-25 Christian-Albrechts-Universität Zu Kiel Aluminium-Kupfer-Konnektor aufweisend eine Heterostruktur und Verfahren zur Herstellung der Heterostruktur
CN107447239B (zh) * 2017-08-21 2018-08-28 安徽省含山县兴建铸造厂 一种耐腐蚀防振锤的制备方法

Also Published As

Publication number Publication date
JPH0317913B2 (de) 1991-03-11
JPH02232390A (ja) 1990-09-14
DE68915519T2 (de) 1994-12-01
EP0375179B1 (de) 1994-05-25
EP0375179A2 (de) 1990-06-27
EP0375179A3 (de) 1991-01-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee