DE69733115D1 - Millimeter-Hohlleiter und Schaltungsanordnung mit diesem Hohlleiter - Google Patents

Millimeter-Hohlleiter und Schaltungsanordnung mit diesem Hohlleiter

Info

Publication number
DE69733115D1
DE69733115D1 DE69733115T DE69733115T DE69733115D1 DE 69733115 D1 DE69733115 D1 DE 69733115D1 DE 69733115 T DE69733115 T DE 69733115T DE 69733115 T DE69733115 T DE 69733115T DE 69733115 D1 DE69733115 D1 DE 69733115D1
Authority
DE
Germany
Prior art keywords
waveguide
circuit arrangement
millimeter
millimeter waveguide
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69733115T
Other languages
English (en)
Other versions
DE69733115T2 (de
Inventor
Kazuaki Takahashi
Mitsuo Makimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69733115D1 publication Critical patent/DE69733115D1/de
Publication of DE69733115T2 publication Critical patent/DE69733115T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/084—Suspended microstriplines
DE69733115T 1996-11-28 1997-11-26 Millimeter-Hohlleiter und Schaltungsanordnung mit diesem Hohlleiter Expired - Fee Related DE69733115T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31736296A JP3218996B2 (ja) 1996-11-28 1996-11-28 ミリ波導波路
JP31736296 1996-11-28

Publications (2)

Publication Number Publication Date
DE69733115D1 true DE69733115D1 (de) 2005-06-02
DE69733115T2 DE69733115T2 (de) 2006-03-02

Family

ID=18087402

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733115T Expired - Fee Related DE69733115T2 (de) 1996-11-28 1997-11-26 Millimeter-Hohlleiter und Schaltungsanordnung mit diesem Hohlleiter

Country Status (4)

Country Link
US (1) US5990768A (de)
EP (1) EP0845831B1 (de)
JP (1) JP3218996B2 (de)
DE (1) DE69733115T2 (de)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6549105B2 (en) 1998-06-02 2003-04-15 Matsushita Electric Industrial Co., Ltd. Millimeter wave module and radio apparatus
US6778041B2 (en) * 1998-06-02 2004-08-17 Matsushita Electric Industrial Co., Ltd. Millimeter wave module and radio apparatus
JP3331967B2 (ja) 1998-06-02 2002-10-07 松下電器産業株式会社 ミリ波モジュール
US6483406B1 (en) * 1998-07-31 2002-11-19 Kyocera Corporation High-frequency module using slot coupling
KR100308871B1 (ko) * 1998-12-28 2001-11-03 윤덕용 동축 구조의 신호선 및 그의 제조 방법
JP3282608B2 (ja) * 1999-03-23 2002-05-20 日本電気株式会社 多層基板
FI113580B (fi) * 1999-03-31 2004-05-14 Nokia Corp Invertoitu mikroliuska-siirtolinja monikerrosrakenteeseen integroituna
KR100513709B1 (ko) * 1999-03-31 2005-09-07 삼성전자주식회사 전압제어발진기의 위상 잡음 감소용 공동공진기 및 그 제작방법
KR20010077106A (ko) * 2000-01-31 2001-08-17 김용권 코플래나 웨이브 가이드
KR100379440B1 (ko) * 2000-02-16 2003-04-10 엘지전자 주식회사 마이크로웨이브 공진기 제조방법
USRE44438E1 (en) 2001-02-27 2013-08-13 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US8143108B2 (en) 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US6512431B2 (en) 2001-02-28 2003-01-28 Lockheed Martin Corporation Millimeterwave module compact interconnect
KR100382765B1 (ko) * 2001-06-15 2003-05-09 삼성전자주식회사 송수신용 수동소자와 그 집적모듈 및 그 제조방법
US6882762B2 (en) * 2001-09-27 2005-04-19 Intel Corporation Waveguide in a printed circuit board and method of forming the same
JP4159378B2 (ja) 2002-04-25 2008-10-01 三菱電機株式会社 高周波装置とその製造方法
JP2004207625A (ja) * 2002-12-26 2004-07-22 Sony Corp 多層構造体およびその製造方法ならびに機能構造体およびその製造方法ならびに電子線露光用マスクおよびその製造方法
DE10304835A1 (de) * 2003-02-06 2004-08-05 Robert Bosch Gmbh Mikroelektromechanisches Bauelement
ATE475999T1 (de) * 2003-03-04 2010-08-15 Rohm & Haas Elect Mat Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
KR100538470B1 (ko) * 2003-09-15 2005-12-23 한국과학기술원 유전체 박막을 이용한 동축선 구조의 전송선 시스템, 그제조 방법 및 그를 이용한 패키지 방법
US7298234B2 (en) * 2003-11-25 2007-11-20 Banpil Photonics, Inc. High speed electrical interconnects and method of manufacturing
CN1293667C (zh) * 2003-12-19 2007-01-03 上海交通大学 基于微机电系统的倒置微带传输线及其制造方法
DE102004022177B4 (de) * 2004-05-05 2008-06-19 Atmel Germany Gmbh Verfahren zur Herstellung eines Koplanarleitungssystem auf einem Substrat und nach einem derartigen Verfahren hergestelltes Bauelement zur Übertragung von elektromagnetischen Wellen
DE102004022178B4 (de) * 2004-05-05 2008-03-20 Atmel Germany Gmbh Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn
JP2006222609A (ja) * 2005-02-09 2006-08-24 Sony Corp 高周波信号伝送回路の製造方法及び高周波信号伝送回路装置
JP4823541B2 (ja) * 2005-03-18 2011-11-24 富士通セミコンダクター株式会社 高周波伝送線路
FR2885735B1 (fr) 2005-05-10 2007-08-03 St Microelectronics Sa Circuit integre guide d'ondes
FI20055511A7 (fi) * 2005-09-27 2007-03-28 Filtronic Comtek Oy Siirtojohtorakenne
JP2008188755A (ja) 2006-12-30 2008-08-21 Rohm & Haas Electronic Materials Llc 三次元微細構造体およびその形成方法
JP2008188754A (ja) 2006-12-30 2008-08-21 Rohm & Haas Electronic Materials Llc 三次元微細構造体およびその形成方法
EP1973189B1 (de) 2007-03-20 2012-12-05 Nuvotronics, LLC Mikrostrukturen einer koaxialen Übertragungsleitung und Herstellungsverfahren dafür
EP1973190A1 (de) * 2007-03-20 2008-09-24 Rohm and Haas Electronic Materials LLC Integrierte elektronische Komponenten und Herstellungsverfahren dafür
US8324728B2 (en) * 2007-11-30 2012-12-04 Skyworks Solutions, Inc. Wafer level packaging using flip chip mounting
EP2343774A4 (de) * 2008-10-29 2013-11-27 Panasonic Corp Hochfrequenzwellenleiter und phasenverschieber damit, heizkörper, elektronische vorrichtung mit besagtem phasenverschieber und dem heizkörper, antennenvorrichtung sowie elektronische vorrichtung damit
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
KR101917052B1 (ko) 2010-01-22 2019-01-30 누보트로닉스, 인크. 열관리
FR2976120A1 (fr) 2011-06-01 2012-12-07 St Microelectronics Sa Procede de fabrication d'un circuit integre comprenant au moins un guide d'ondes coplanaire
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
JP6335782B2 (ja) 2011-07-13 2018-05-30 ヌボトロニクス、インク． 電子的および機械的な構造を製作する方法
CN102513393A (zh) * 2011-12-23 2012-06-27 成都泰格微波技术股份有限公司 微小型毫米波波导器件的制造方法
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9219298B2 (en) 2013-03-15 2015-12-22 International Business Machines Corporation Removal of spurious microwave modes via flip-chip crossover
US9520547B2 (en) 2013-03-15 2016-12-13 International Business Machines Corporation Chip mode isolation and cross-talk reduction through buried metal layers and through-vias
WO2015109208A2 (en) 2014-01-17 2015-07-23 Nuvotronics, Llc Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
CN104377415A (zh) * 2014-10-08 2015-02-25 石以瑄 用于微波传输的共面波导及其制作方法
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US9941560B2 (en) * 2014-12-22 2018-04-10 The Regents Of The University Of Michigan Non-contact on-wafer S-parameter measurements of devices at millimeter-wave to terahertz frequencies
WO2016120254A1 (en) * 2015-01-27 2016-08-04 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna structure
US10068181B1 (en) 2015-04-27 2018-09-04 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafer and methods for making the same
CN208608339U (zh) * 2016-01-27 2019-03-15 株式会社村田制作所 信号传输线路
EP3449532B1 (de) 2016-04-28 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit integrierter antennenanordnung, elektronische vorrichtung, funkkommunikationsverfahren
WO2018038707A1 (en) * 2016-08-23 2018-03-01 Intel Corporation Inverted microstrip transmission lines for qubits
US11276727B1 (en) 2017-06-19 2022-03-15 Rigetti & Co, Llc Superconducting vias for routing electrical signals through substrates and their methods of manufacture
US11121301B1 (en) 2017-06-19 2021-09-14 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafers and their methods of manufacture
US11527696B2 (en) * 2017-10-05 2022-12-13 Google Llc Low footprint resonator in flip chip geometry
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN108601204A (zh) * 2018-05-25 2018-09-28 上海安费诺永亿通讯电子有限公司 一种低损耗扁平传输线
US10998638B2 (en) 2019-01-31 2021-05-04 Toyota Motor Engineering & Manufacturing North America, Inc. Nickel-chromium particles and multilayer structures comprising nickel chromium core layers
US11963911B2 (en) 2020-02-13 2024-04-23 Bone Foam, Inc. Anterior cervical positioning system
US11339495B2 (en) 2020-05-20 2022-05-24 Toyota Motor Engineering & Manufacturing North America, Inc. Coated discrete metallic particles and multilayer structures comprising reflective core layers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012319A (en) * 1990-05-14 1991-04-30 At&T Bell Laboratories Integrated electronic assembly comprising a transmission line
JPH04115604A (ja) * 1990-08-31 1992-04-16 Matsushita Electric Ind Co Ltd マイクロ波回路
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
US5303419A (en) * 1992-05-29 1994-04-12 Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Communications Aperture-coupled line Magic-Tee and mixer formed therefrom
JP3161068B2 (ja) * 1992-08-28 2001-04-25 日産自動車株式会社 半導体ミリ波装置
US5471181A (en) * 1994-03-08 1995-11-28 Hughes Missile Systems Company Interconnection between layers of striplines or microstrip through cavity backed slot
FR2738395B1 (fr) * 1995-08-31 1997-10-10 Commissariat Energie Atomique Dispositif autoporte pour la propagation d'ondes hyperfrequences et procedes de realisation d'un tel dispositif

Also Published As

Publication number Publication date
EP0845831A2 (de) 1998-06-03
EP0845831A3 (de) 1999-03-10
JP3218996B2 (ja) 2001-10-15
DE69733115T2 (de) 2006-03-02
JPH10163711A (ja) 1998-06-19
US5990768A (en) 1999-11-23
EP0845831B1 (de) 2005-04-27

Similar Documents

Publication Publication Date Title
DE69733115D1 (de) Millimeter-Hohlleiter und Schaltungsanordnung mit diesem Hohlleiter
DE69812570T2 (de) Gerät mit Leiterplatte und dessen Zusammenbauverfahren
DE69826825D1 (de) Schaltungsanordnung und zugehörige signalleuchte
DE69816958D1 (de) Schaltungsanordnung mit dabei passender signalleuchte
DE69830883D1 (de) Halbleiterbauelement und mit diesem Bauelement bestückte Leiterplatte
DE69932672D1 (de) Tastschalter und Eingabegerät mit Tastschalter
DE69731341D1 (de) Optisches Bauelement und optisches System mit diesem
DE69714686D1 (de) Passivstrahler und system mit diesem passivstrahler
DE69931204D1 (de) Mikrowellen und Millimeterwellen-Anordnung
DE69524349D1 (de) Mikrowellenresonator
DE69836302D1 (de) Dielektrischer Wellenleiter und dessen Abzweigstruktur
DE69521180D1 (de) Streifenleiterantenne
DE69515263D1 (de) Hohlleiterkoaxialübergang
DE69511272D1 (de) Mikrowellenschalter
DE69734092T2 (de) Schaltungsanordnung mit rückkopplungsschleife
DE59708005D1 (de) Schaltungsanordnung mit einem Oszillator
DE59813473D1 (de) Integrierte Schaltung mit programmierbarer Verriegelungsschaltung
KR970063309U (ko) 전자레인지의 도파관 구조
DE69724722D1 (de) Mikrowellenmischerschaltung und diesen verwendender Abwärtsumsetzer
KR970052740U (ko) 전자렌지의 스위치 구조
KR950025470U (ko) 전자렌지
KR960015083U (ko) 전자렌지의 전자파 분산장치
KR950033848U (ko) 전자렌지의 고주파 분산장치
KR980006016U (ko) 전자레인지
KR980004269U (ko) 전자 렌지

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee