DK0439258T3 - Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale - Google Patents

Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale

Info

Publication number
DK0439258T3
DK0439258T3 DK91300202.8T DK91300202T DK0439258T3 DK 0439258 T3 DK0439258 T3 DK 0439258T3 DK 91300202 T DK91300202 T DK 91300202T DK 0439258 T3 DK0439258 T3 DK 0439258T3
Authority
DK
Denmark
Prior art keywords
actinic radiation
sensitive adhesive
pressure
adhesive material
reactive
Prior art date
Application number
DK91300202.8T
Other languages
English (en)
Inventor
Kazuo Ohkawa
Seiichi Saito
Original Assignee
Asahi Denka Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo Kk filed Critical Asahi Denka Kogyo Kk
Application granted granted Critical
Publication of DK0439258T3 publication Critical patent/DK0439258T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
DK91300202.8T 1990-01-12 1991-01-11 Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale DK0439258T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00493690A JP3181284B2 (ja) 1990-01-12 1990-01-12 エネルギー線反応性粘着剤組成物

Publications (1)

Publication Number Publication Date
DK0439258T3 true DK0439258T3 (da) 1995-07-17

Family

ID=11597465

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91300202.8T DK0439258T3 (da) 1990-01-12 1991-01-11 Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale

Country Status (7)

Country Link
US (2) US5278199A (da)
EP (1) EP0439258B1 (da)
JP (1) JP3181284B2 (da)
AT (1) ATE122088T1 (da)
DE (1) DE69109309T2 (da)
DK (1) DK0439258T3 (da)
ES (1) ES2073113T3 (da)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW230830B (da) * 1991-11-01 1994-09-21 Furukawa Electric Co Ltd
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5616670A (en) * 1993-11-10 1997-04-01 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good oily surface adhesion
US5602221A (en) * 1993-11-10 1997-02-11 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good low energy surface adhesion
US5654387A (en) * 1993-11-10 1997-08-05 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives
US5683798A (en) * 1993-11-10 1997-11-04 Minnesota Mining And Manufacturing Company Tackified pressure sensitive adhesives
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JPH08267668A (ja) * 1995-03-29 1996-10-15 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
US6008296A (en) 1995-04-19 1999-12-28 Optima, Inc. Optical terpolymer of polyisocyanate, polythiol and polyene monomers
EP1249479B1 (en) * 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
JP3300610B2 (ja) * 1996-08-14 2002-07-08 旭光学工業株式会社 紫外線硬化性組成物
US5902678A (en) * 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
US5777024A (en) * 1997-04-30 1998-07-07 The Valspar Corporation Urethane resins and coating compositions and methods for their use
US5872158A (en) * 1997-06-12 1999-02-16 International Business Machines Corporation Cleavable diacrylate for removable acrylate compositions
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
US6174578B1 (en) * 1997-10-24 2001-01-16 Rexam Industries Corp. Radiation deactivatable adhesive tape
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US7105226B2 (en) * 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof
US6342122B1 (en) * 2000-08-07 2002-01-29 Ashland Chemical, Inc. UV post curable pressure sensitive adhesives for membrane switch applications and their Production
WO2002074686A2 (en) * 2000-12-05 2002-09-26 Analog Devices, Inc. A method and device for protecting micro electromechanical systems structures during dicing of a wafer
US6641627B2 (en) * 2001-05-22 2003-11-04 3M Innovative Properties Company Abrasive articles
US6645263B2 (en) 2001-05-22 2003-11-11 3M Innovative Properties Company Cellular abrasive article
US20050006336A1 (en) * 2001-11-30 2005-01-13 Hiroaki Takahata Information medium master manufacturing method information medium stamper manufacturing method information medium master manufacturing apparatus and information medium stamper manufacturing apparatus
EP1492093A4 (en) * 2002-03-11 2009-06-03 Tdk Corp PROCESSING METHOD FOR A PHOTORESIST MASTER, METHOD FOR MANUFACTURING A RECORDING MEDIUM USER MASTER, METHOD FOR PRODUCING A RECORDING MEDIUM, PHOTORESIST MASTER, RECORDING MEDIA USE MASTER AND RECORDING MEDIUM
US7166182B2 (en) * 2002-09-04 2007-01-23 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
TW575646B (en) * 2002-09-04 2004-02-11 Sipix Imaging Inc Novel adhesive and sealing layers for electrophoretic displays
US7616374B2 (en) * 2002-09-23 2009-11-10 Sipix Imaging, Inc. Electrophoretic displays with improved high temperature performance
US6887917B2 (en) * 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7572491B2 (en) * 2003-01-24 2009-08-11 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
TWI230832B (en) * 2003-01-24 2005-04-11 Sipix Imaging Inc Novel adhesive and sealing layers for electrophoretic displays
US9346987B2 (en) * 2003-01-24 2016-05-24 E Ink California, Llc Adhesive and sealing layers for electrophoretic displays
WO2004096483A1 (ja) * 2003-04-25 2004-11-11 Nitto Denko Corporation レーザー加工品の製造方法、およびそれに用いるレーザー加工用粘着シート
MXPA06001812A (es) * 2003-08-20 2006-05-17 Koninkl Philips Electronics Nv Sistema adhesivo sin lixiviacion y su uso en un objetivo de inmersion liquido.
EP1680774B9 (en) * 2003-11-05 2018-05-16 E Ink Corporation Electrophoretic medium for electro-optic displays
WO2005063435A1 (ja) * 2003-12-25 2005-07-14 Nitto Denko Corporation レーザー加工用保護シート及びレーザー加工品の製造方法
WO2005085309A2 (de) * 2004-03-05 2005-09-15 Crylas Gmbh Verfahren zum aushärten eines photosensitiven füllmaterials und aushärtevorrichtung
US20060052540A1 (en) 2004-09-09 2006-03-09 Maria Ellul Thermoplastic vulcanizates
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP2006309114A (ja) * 2005-03-30 2006-11-09 Lintec Corp 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
US7678529B2 (en) * 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
JP4881208B2 (ja) * 2007-03-30 2012-02-22 リンテック株式会社 日射遮蔽フィルム用粘着剤及び日射遮蔽フィルム
JP5356661B2 (ja) * 2007-06-21 2013-12-04 日本化薬株式会社 光硬化型透明接着剤組成物
US8092921B2 (en) * 2007-08-17 2012-01-10 Ppg Industries Ohio, Inc Clearcoat composition for use in waterborne basecoat-clearcoat composite coatings
CN101382668B (zh) * 2007-09-04 2010-09-08 成都博深高技术材料开发有限公司 热敏调光材料及其制备方法和由其构成的光学器件
JP5464810B2 (ja) * 2008-03-13 2014-04-09 日本合成化学工業株式会社 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法
JP5503357B2 (ja) * 2009-03-23 2014-05-28 古河電気工業株式会社 ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法
JP5068793B2 (ja) * 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
JP5762781B2 (ja) * 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
US20120261066A1 (en) * 2011-04-15 2012-10-18 Covidien Ag Sealed Device and Method of Sealing
CN103946274B (zh) * 2011-11-17 2016-06-22 三键精密化学有限公司 丙烯酸树脂组合物
JP5820306B2 (ja) * 2012-03-01 2015-11-24 株式会社イノアック技術研究所 粘着組成物および粘着組成物の製造方法
US11809100B2 (en) 2012-03-05 2023-11-07 Landa Corporation Ltd. Intermediate transfer members for use with indirect printing systems and protonatable intermediate transfer members for use with indirect printing systems
CN104284850B (zh) 2012-03-15 2018-09-11 兰达公司 打印系统的环形柔性皮带
JP5991833B2 (ja) * 2012-03-26 2016-09-14 日本合成化学工業株式会社 アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物
JP6261914B2 (ja) * 2013-08-30 2018-01-17 株式会社イノアック技術研究所 粘着性接着剤、積層体および積層体の製造方法
US11806997B2 (en) 2015-04-14 2023-11-07 Landa Corporation Ltd. Indirect printing system and related apparatus
EP3337843B1 (en) 2015-08-18 2022-09-28 3M Innovative Properties Company Polyester compositions
JP6800215B2 (ja) 2015-08-18 2020-12-16 スリーエム イノベイティブ プロパティズ カンパニー 耐衝撃性ポリエステル感圧接着剤
WO2017031042A1 (en) 2015-08-18 2017-02-23 3M Innovative Properties Company Chemical-resistant polyester pressure-sensitive adhesive
WO2017189389A1 (en) 2016-04-29 2017-11-02 3M Innovative Properties Company Adhesive and damping film
CN114148098B (zh) 2016-05-30 2025-03-07 兰达公司 数字印刷方法
GB201609463D0 (en) 2016-05-30 2016-07-13 Landa Labs 2012 Ltd Method of manufacturing a multi-layer article
EP3651991B1 (en) * 2017-07-14 2025-04-09 Landa Corporation Ltd. Intermediate transfer member
JP7083069B2 (ja) * 2018-09-18 2022-06-09 アイセンス，インコーポレーテッド 遷移金属複合体を含む酸化－還元高分子およびこれを利用した電気化学的バイオセンサ
JP7246496B2 (ja) 2018-10-08 2023-03-27 ランダ コーポレイション リミテッド 印刷システムおよび方法に関する摩擦低減手段
EP3946953A4 (en) 2019-03-31 2022-12-14 Landa Corporation Ltd. SYSTEMS AND METHODS FOR PREVENTING OR MINIMIZING PRINT DEFECTS IN PRINTING PROCESSES
CN114650912B (zh) 2019-11-15 2023-09-01 3M创新有限公司 基于聚酯的离聚物压敏粘合剂
WO2021105806A1 (en) 2019-11-25 2021-06-03 Landa Corporation Ltd. Drying ink in digital printing using infrared radiation absorbed by particles embedded inside itm

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920877A (en) * 1971-07-01 1975-11-18 Grace W R & Co Fully cured crosslinkable pressure sensitive adhesive materials and method of making same
US3925320A (en) * 1972-05-05 1975-12-09 Grace W R & Co Solid curable polyene compositions containing liquid polythiols and solid styrene-allyl alcohol copolymer based polyenes
US3908039A (en) * 1973-10-25 1975-09-23 Grace W R & Co Photocurable polyene-polythiol lacquer composition
US4234676A (en) * 1978-01-23 1980-11-18 W. R. Grace & Co. Polythiol effect curable polymeric composition
US4264658A (en) * 1978-07-10 1981-04-28 Owens-Illinois, Inc. Three-component polymeric coating for glass substrate
JPS6020427B2 (ja) * 1983-06-17 1985-05-22 日立化成工業株式会社 放射線硬化型感圧性接着剤組成物
JPS60124677A (ja) * 1983-12-09 1985-07-03 Hitachi Chem Co Ltd 放射線硬化型粘着テ−プ類の製造方法
US4587313A (en) * 1984-11-20 1986-05-06 Hitachi Chemical Company, Ltd. Radiation curable pressure-sensitive adhesive composition
DE3671577D1 (de) * 1985-02-14 1990-06-28 Bando Chemical Ind Verfahren zum schneiden einer halbleiterscheibe in wuerfel.
US4820746A (en) * 1986-08-12 1989-04-11 Avery International Corporation Radiation-cured rubber-based pressure-sensitive adhesive
DE3850451T2 (de) * 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Strahlungsvernetzbare Klebestreifen.

Also Published As

Publication number Publication date
DE69109309T2 (de) 1995-09-28
US5360873A (en) 1994-11-01
ES2073113T3 (es) 1995-08-01
EP0439258B1 (en) 1995-05-03
EP0439258A3 (en) 1992-04-29
ATE122088T1 (de) 1995-05-15
JPH03210312A (ja) 1991-09-13
EP0439258A2 (en) 1991-07-31
DE69109309D1 (de) 1995-06-08
US5278199A (en) 1994-01-11
JP3181284B2 (ja) 2001-07-03

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