DK0439258T3 - Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale - Google Patents

Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale

Info

Publication number
DK0439258T3
DK0439258T3 DK91300202.8T DK91300202T DK0439258T3 DK 0439258 T3 DK0439258 T3 DK 0439258T3 DK 91300202 T DK91300202 T DK 91300202T DK 0439258 T3 DK0439258 T3 DK 0439258T3
Authority
DK
Denmark
Prior art keywords
actinic radiation
sensitive adhesive
pressure
adhesive material
reactive
Prior art date
Application number
DK91300202.8T
Other languages
English (en)
Inventor
Kazuo Ohkawa
Seiichi Saito
Original Assignee
Asahi Denka Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo Kk filed Critical Asahi Denka Kogyo Kk
Application granted granted Critical
Publication of DK0439258T3 publication Critical patent/DK0439258T3/da

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Dicing (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
DK91300202.8T 1990-01-12 1991-01-11 Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale DK0439258T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP00493690A JP3181284B2 (ja) 1990-01-12 1990-01-12 エネルギー線反応性粘着剤組成物

Publications (1)

Publication Number Publication Date
DK0439258T3 true DK0439258T3 (da) 1995-07-17

Family

ID=11597465

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91300202.8T DK0439258T3 (da) 1990-01-12 1991-01-11 Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale

Country Status (7)

Country Link
US (2) US5278199A (da)
EP (1) EP0439258B1 (da)
JP (1) JP3181284B2 (da)
AT (1) ATE122088T1 (da)
DE (1) DE69109309T2 (da)
DK (1) DK0439258T3 (da)
ES (1) ES2073113T3 (da)

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US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5616670A (en) * 1993-11-10 1997-04-01 Minnesota Mining And Manufacturing Company Pressure sensitive adhesives with good oily surface adhesion
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JPH08267668A (ja) * 1995-03-29 1996-10-15 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
US6008296A (en) 1995-04-19 1999-12-28 Optima, Inc. Optical terpolymer of polyisocyanate, polythiol and polyene monomers
DE69728935T2 (de) * 1996-07-15 2005-04-28 Sekisui Kagaku Kogyo K.K. Ein vernetzbares druckempfindliches Klebmittel in Plattform
JP3300610B2 (ja) * 1996-08-14 2002-07-08 旭光学工業株式会社 紫外線硬化性組成物
US5902678A (en) * 1997-04-01 1999-05-11 Nitto Denko Corporation Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal
US5777024A (en) * 1997-04-30 1998-07-07 The Valspar Corporation Urethane resins and coating compositions and methods for their use
US5872158A (en) * 1997-06-12 1999-02-16 International Business Machines Corporation Cleavable diacrylate for removable acrylate compositions
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
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US7105226B2 (en) * 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof
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JPWO2003077239A1 (ja) * 2002-03-11 2005-07-07 Tdk株式会社 フォトレジスト原盤の加工方法、記録媒体用原盤の製造方法、記録媒体の製造方法、フォトレジスト原盤、記録媒体用原盤及び記録媒体
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US7572491B2 (en) * 2003-01-24 2009-08-11 Sipix Imaging, Inc. Adhesive and sealing layers for electrophoretic displays
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ATE553638T1 (de) * 2003-12-25 2012-04-15 Nitto Denko Corp Verfahren zur herstellung durch laser werkstücke
WO2005085309A2 (de) * 2004-03-05 2005-09-15 Crylas Gmbh Verfahren zum aushärten eines photosensitiven füllmaterials und aushärtevorrichtung
US20060052540A1 (en) 2004-09-09 2006-03-09 Maria Ellul Thermoplastic vulcanizates
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP2006309114A (ja) * 2005-03-30 2006-11-09 Lintec Corp 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
US7678529B2 (en) * 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
JP5140996B2 (ja) * 2006-08-29 2013-02-13 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
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JP5356661B2 (ja) * 2007-06-21 2013-12-04 日本化薬株式会社 光硬化型透明接着剤組成物
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JP5464810B2 (ja) * 2008-03-13 2014-04-09 日本合成化学工業株式会社 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法
JP5503357B2 (ja) * 2009-03-23 2014-05-28 古河電気工業株式会社 ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法
JP5068793B2 (ja) * 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
JP5762781B2 (ja) * 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
US20120261066A1 (en) * 2011-04-15 2012-10-18 Covidien Ag Sealed Device and Method of Sealing
WO2013073364A1 (ja) * 2011-11-17 2013-05-23 株式会社スリーボンド アクリル樹脂組成物
JP5820306B2 (ja) * 2012-03-01 2015-11-24 株式会社イノアック技術研究所 粘着組成物および粘着組成物の製造方法
US11809100B2 (en) 2012-03-05 2023-11-07 Landa Corporation Ltd. Intermediate transfer members for use with indirect printing systems and protonatable intermediate transfer members for use with indirect printing systems
US9517618B2 (en) 2012-03-15 2016-12-13 Landa Corporation Ltd. Endless flexible belt for a printing system
JP5991833B2 (ja) * 2012-03-26 2016-09-14 日本合成化学工業株式会社 アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物
JP6261914B2 (ja) * 2013-08-30 2018-01-17 株式会社イノアック技術研究所 粘着性接着剤、積層体および積層体の製造方法
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JP6890118B2 (ja) 2015-08-18 2021-06-18 スリーエム イノベイティブ プロパティズ カンパニー ポリエステル組成物
JP6912456B2 (ja) 2015-08-18 2021-08-04 スリーエム イノベイティブ プロパティズ カンパニー 耐薬品性ポリエステル感圧接着剤
US10815404B2 (en) 2015-08-18 2020-10-27 3M Innovative Properties Company Impact-resistant polyester pressure-sensitive adhesive
WO2017189389A1 (en) 2016-04-29 2017-11-02 3M Innovative Properties Company Adhesive and damping film
CN114148099B (zh) 2016-05-30 2025-03-14 兰达公司 数字印刷方法
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JP7203814B2 (ja) * 2017-07-14 2023-01-13 ランダ コーポレイション リミテッド 中間転写部材
JP7083069B2 (ja) 2018-09-18 2022-06-09 アイセンス,インコーポレーテッド 遷移金属複合体を含む酸化-還元高分子およびこれを利用した電気化学的バイオセンサ
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Also Published As

Publication number Publication date
US5360873A (en) 1994-11-01
JP3181284B2 (ja) 2001-07-03
ES2073113T3 (es) 1995-08-01
EP0439258A2 (en) 1991-07-31
JPH03210312A (ja) 1991-09-13
EP0439258A3 (en) 1992-04-29
ATE122088T1 (de) 1995-05-15
US5278199A (en) 1994-01-11
EP0439258B1 (en) 1995-05-03
DE69109309D1 (de) 1995-06-08
DE69109309T2 (de) 1995-09-28

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