DK0439258T3 - Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale - Google Patents
Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmaterialeInfo
- Publication number
- DK0439258T3 DK0439258T3 DK91300202.8T DK91300202T DK0439258T3 DK 0439258 T3 DK0439258 T3 DK 0439258T3 DK 91300202 T DK91300202 T DK 91300202T DK 0439258 T3 DK0439258 T3 DK 0439258T3
- Authority
- DK
- Denmark
- Prior art keywords
- actinic radiation
- sensitive adhesive
- pressure
- adhesive material
- reactive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Dicing (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00493690A JP3181284B2 (ja) | 1990-01-12 | 1990-01-12 | エネルギー線反応性粘着剤組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK0439258T3 true DK0439258T3 (da) | 1995-07-17 |
Family
ID=11597465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK91300202.8T DK0439258T3 (da) | 1990-01-12 | 1991-01-11 | Ved aktinisk stråling reaktivt, trykfølsomt adhæsivmateriale |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5278199A (da) |
| EP (1) | EP0439258B1 (da) |
| JP (1) | JP3181284B2 (da) |
| AT (1) | ATE122088T1 (da) |
| DE (1) | DE69109309T2 (da) |
| DK (1) | DK0439258T3 (da) |
| ES (1) | ES2073113T3 (da) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW230830B (da) * | 1991-11-01 | 1994-09-21 | Furukawa Electric Co Ltd | |
| JP3410202B2 (ja) * | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法 |
| US5683798A (en) * | 1993-11-10 | 1997-11-04 | Minnesota Mining And Manufacturing Company | Tackified pressure sensitive adhesives |
| US5654387A (en) * | 1993-11-10 | 1997-08-05 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives |
| US5602221A (en) * | 1993-11-10 | 1997-02-11 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good low energy surface adhesion |
| US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
| US5616670A (en) * | 1993-11-10 | 1997-04-01 | Minnesota Mining And Manufacturing Company | Pressure sensitive adhesives with good oily surface adhesion |
| JP3081122B2 (ja) * | 1994-07-18 | 2000-08-28 | シャープ株式会社 | 基板搬送用治具及びそれを用いた液晶表示素子の製造方法 |
| JPH08267668A (ja) * | 1995-03-29 | 1996-10-15 | Nitta Ind Corp | 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法 |
| US6008296A (en) | 1995-04-19 | 1999-12-28 | Optima, Inc. | Optical terpolymer of polyisocyanate, polythiol and polyene monomers |
| DE69728935T2 (de) * | 1996-07-15 | 2005-04-28 | Sekisui Kagaku Kogyo K.K. | Ein vernetzbares druckempfindliches Klebmittel in Plattform |
| JP3300610B2 (ja) * | 1996-08-14 | 2002-07-08 | 旭光学工業株式会社 | 紫外線硬化性組成物 |
| US5902678A (en) * | 1997-04-01 | 1999-05-11 | Nitto Denko Corporation | Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal |
| US5777024A (en) * | 1997-04-30 | 1998-07-07 | The Valspar Corporation | Urethane resins and coating compositions and methods for their use |
| US5872158A (en) * | 1997-06-12 | 1999-02-16 | International Business Machines Corporation | Cleavable diacrylate for removable acrylate compositions |
| JP4072927B2 (ja) * | 1997-08-28 | 2008-04-09 | リンテック株式会社 | エネルギー線硬化型親水性粘着剤組成物およびその利用方法 |
| US6174578B1 (en) * | 1997-10-24 | 2001-01-16 | Rexam Industries Corp. | Radiation deactivatable adhesive tape |
| US6235387B1 (en) | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| US7105226B2 (en) * | 1998-08-26 | 2006-09-12 | Lintec Corporation | Pressure sensitive adhesive double coated sheet and method of use thereof |
| US6342122B1 (en) * | 2000-08-07 | 2002-01-29 | Ashland Chemical, Inc. | UV post curable pressure sensitive adhesives for membrane switch applications and their Production |
| US6946366B2 (en) * | 2000-12-05 | 2005-09-20 | Analog Devices, Inc. | Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| US6645263B2 (en) | 2001-05-22 | 2003-11-11 | 3M Innovative Properties Company | Cellular abrasive article |
| US6641627B2 (en) * | 2001-05-22 | 2003-11-04 | 3M Innovative Properties Company | Abrasive articles |
| TWI236013B (en) * | 2001-11-30 | 2005-07-11 | Tdk Corp | Fabrication method of parent template for information medium, fabrication method of child template for information medium, fabrication device of parent template for information medium, and fabrication device of child template for information medium |
| JPWO2003077239A1 (ja) * | 2002-03-11 | 2005-07-07 | Tdk株式会社 | フォトレジスト原盤の加工方法、記録媒体用原盤の製造方法、記録媒体の製造方法、フォトレジスト原盤、記録媒体用原盤及び記録媒体 |
| US7166182B2 (en) * | 2002-09-04 | 2007-01-23 | Sipix Imaging, Inc. | Adhesive and sealing layers for electrophoretic displays |
| TW575646B (en) * | 2002-09-04 | 2004-02-11 | Sipix Imaging Inc | Novel adhesive and sealing layers for electrophoretic displays |
| US7616374B2 (en) * | 2002-09-23 | 2009-11-10 | Sipix Imaging, Inc. | Electrophoretic displays with improved high temperature performance |
| US6887917B2 (en) * | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
| US9346987B2 (en) * | 2003-01-24 | 2016-05-24 | E Ink California, Llc | Adhesive and sealing layers for electrophoretic displays |
| TWI230832B (en) * | 2003-01-24 | 2005-04-11 | Sipix Imaging Inc | Novel adhesive and sealing layers for electrophoretic displays |
| US7572491B2 (en) * | 2003-01-24 | 2009-08-11 | Sipix Imaging, Inc. | Adhesive and sealing layers for electrophoretic displays |
| US20060246279A1 (en) * | 2003-04-25 | 2006-11-02 | Masakatsu Urairi | Method of producing laser-processed product and adhesive sheet, for laser processing used therefor |
| EP1658343B1 (en) * | 2003-08-20 | 2007-05-09 | Koninklijke Philips Electronics N.V. | Non-leaching adhesive system and its use in a liquid immersion objective |
| US7173752B2 (en) * | 2003-11-05 | 2007-02-06 | E Ink Corporation | Electro-optic displays, and materials for use therein |
| ATE553638T1 (de) * | 2003-12-25 | 2012-04-15 | Nitto Denko Corp | Verfahren zur herstellung durch laser werkstücke |
| WO2005085309A2 (de) * | 2004-03-05 | 2005-09-15 | Crylas Gmbh | Verfahren zum aushärten eines photosensitiven füllmaterials und aushärtevorrichtung |
| US20060052540A1 (en) | 2004-09-09 | 2006-03-09 | Maria Ellul | Thermoplastic vulcanizates |
| JP4873863B2 (ja) * | 2005-01-14 | 2012-02-08 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用粘着シート |
| JP4854061B2 (ja) * | 2005-01-14 | 2012-01-11 | 日東電工株式会社 | レーザー加工品の製造方法及びレーザー加工用保護シート |
| JP2006309114A (ja) * | 2005-03-30 | 2006-11-09 | Lintec Corp | 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法 |
| US7678529B2 (en) * | 2005-11-21 | 2010-03-16 | Shin-Etsu Chemical Co., Ltd. | Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method |
| JP5140996B2 (ja) * | 2006-08-29 | 2013-02-13 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
| JP4881208B2 (ja) * | 2007-03-30 | 2012-02-22 | リンテック株式会社 | 日射遮蔽フィルム用粘着剤及び日射遮蔽フィルム |
| JP5356661B2 (ja) * | 2007-06-21 | 2013-12-04 | 日本化薬株式会社 | 光硬化型透明接着剤組成物 |
| US8092921B2 (en) * | 2007-08-17 | 2012-01-10 | Ppg Industries Ohio, Inc | Clearcoat composition for use in waterborne basecoat-clearcoat composite coatings |
| CN101382668B (zh) * | 2007-09-04 | 2010-09-08 | 成都博深高技术材料开发有限公司 | 热敏调光材料及其制备方法和由其构成的光学器件 |
| JP5464810B2 (ja) * | 2008-03-13 | 2014-04-09 | 日本合成化学工業株式会社 | 剥離性粘着剤、剥離性粘着シート、剥離性粘着シートの剥離方法 |
| JP5503357B2 (ja) * | 2009-03-23 | 2014-05-28 | 古河電気工業株式会社 | ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法 |
| JP5068793B2 (ja) * | 2009-09-24 | 2012-11-07 | リンテック株式会社 | 粘着シート |
| JP5762781B2 (ja) * | 2011-03-22 | 2015-08-12 | リンテック株式会社 | 基材フィルムおよび該基材フィルムを備えた粘着シート |
| US20120261066A1 (en) * | 2011-04-15 | 2012-10-18 | Covidien Ag | Sealed Device and Method of Sealing |
| WO2013073364A1 (ja) * | 2011-11-17 | 2013-05-23 | 株式会社スリーボンド | アクリル樹脂組成物 |
| JP5820306B2 (ja) * | 2012-03-01 | 2015-11-24 | 株式会社イノアック技術研究所 | 粘着組成物および粘着組成物の製造方法 |
| US11809100B2 (en) | 2012-03-05 | 2023-11-07 | Landa Corporation Ltd. | Intermediate transfer members for use with indirect printing systems and protonatable intermediate transfer members for use with indirect printing systems |
| US9517618B2 (en) | 2012-03-15 | 2016-12-13 | Landa Corporation Ltd. | Endless flexible belt for a printing system |
| JP5991833B2 (ja) * | 2012-03-26 | 2016-09-14 | 日本合成化学工業株式会社 | アクリル系粘着剤、光学部材用粘着剤、およびそれを用いてなる粘着剤層付き光学部材、画像表示装置、ならびにアクリル系粘着剤の製造方法、アクリル系粘着剤組成物 |
| JP6261914B2 (ja) * | 2013-08-30 | 2018-01-17 | 株式会社イノアック技術研究所 | 粘着性接着剤、積層体および積層体の製造方法 |
| US11806997B2 (en) | 2015-04-14 | 2023-11-07 | Landa Corporation Ltd. | Indirect printing system and related apparatus |
| JP6890118B2 (ja) | 2015-08-18 | 2021-06-18 | スリーエム イノベイティブ プロパティズ カンパニー | ポリエステル組成物 |
| JP6912456B2 (ja) | 2015-08-18 | 2021-08-04 | スリーエム イノベイティブ プロパティズ カンパニー | 耐薬品性ポリエステル感圧接着剤 |
| US10815404B2 (en) | 2015-08-18 | 2020-10-27 | 3M Innovative Properties Company | Impact-resistant polyester pressure-sensitive adhesive |
| WO2017189389A1 (en) | 2016-04-29 | 2017-11-02 | 3M Innovative Properties Company | Adhesive and damping film |
| CN114148099B (zh) | 2016-05-30 | 2025-03-14 | 兰达公司 | 数字印刷方法 |
| GB201609463D0 (en) | 2016-05-30 | 2016-07-13 | Landa Labs 2012 Ltd | Method of manufacturing a multi-layer article |
| JP7203814B2 (ja) * | 2017-07-14 | 2023-01-13 | ランダ コーポレイション リミテッド | 中間転写部材 |
| JP7083069B2 (ja) | 2018-09-18 | 2022-06-09 | アイセンス,インコーポレーテッド | 遷移金属複合体を含む酸化-還元高分子およびこれを利用した電気化学的バイオセンサ |
| US11318734B2 (en) | 2018-10-08 | 2022-05-03 | Landa Corporation Ltd. | Friction reduction means for printing systems and method |
| WO2020202145A1 (en) | 2019-03-31 | 2020-10-08 | Landa Corporation Ltd | Systems and methods for preventing or minimizing printing defects in printing processes |
| US12435247B2 (en) | 2019-11-15 | 2025-10-07 | 3M Innovative Properties Company | Ionomeric polyester-based pressure sensitive adhesives |
| WO2021105806A1 (en) | 2019-11-25 | 2021-06-03 | Landa Corporation Ltd. | Drying ink in digital printing using infrared radiation absorbed by particles embedded inside itm |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3920877A (en) * | 1971-07-01 | 1975-11-18 | Grace W R & Co | Fully cured crosslinkable pressure sensitive adhesive materials and method of making same |
| US3925320A (en) * | 1972-05-05 | 1975-12-09 | Grace W R & Co | Solid curable polyene compositions containing liquid polythiols and solid styrene-allyl alcohol copolymer based polyenes |
| US3908039A (en) * | 1973-10-25 | 1975-09-23 | Grace W R & Co | Photocurable polyene-polythiol lacquer composition |
| US4234676A (en) * | 1978-01-23 | 1980-11-18 | W. R. Grace & Co. | Polythiol effect curable polymeric composition |
| US4264658A (en) * | 1978-07-10 | 1981-04-28 | Owens-Illinois, Inc. | Three-component polymeric coating for glass substrate |
| JPS6020427B2 (ja) * | 1983-06-17 | 1985-05-22 | 日立化成工業株式会社 | 放射線硬化型感圧性接着剤組成物 |
| JPS60124677A (ja) * | 1983-12-09 | 1985-07-03 | Hitachi Chem Co Ltd | 放射線硬化型粘着テ−プ類の製造方法 |
| US4587313A (en) * | 1984-11-20 | 1986-05-06 | Hitachi Chemical Company, Ltd. | Radiation curable pressure-sensitive adhesive composition |
| DE3671577D1 (de) * | 1985-02-14 | 1990-06-28 | Bando Chemical Ind | Verfahren zum schneiden einer halbleiterscheibe in wuerfel. |
| US4820746A (en) * | 1986-08-12 | 1989-04-11 | Avery International Corporation | Radiation-cured rubber-based pressure-sensitive adhesive |
| DE3850451T2 (de) * | 1987-07-08 | 1995-03-09 | Furukawa Electric Co Ltd | Strahlungsvernetzbare Klebestreifen. |
-
1990
- 1990-01-12 JP JP00493690A patent/JP3181284B2/ja not_active Expired - Lifetime
- 1990-12-21 US US07/632,190 patent/US5278199A/en not_active Expired - Fee Related
-
1991
- 1991-01-11 EP EP91300202A patent/EP0439258B1/en not_active Expired - Lifetime
- 1991-01-11 AT AT91300202T patent/ATE122088T1/de active
- 1991-01-11 ES ES91300202T patent/ES2073113T3/es not_active Expired - Lifetime
- 1991-01-11 DE DE69109309T patent/DE69109309T2/de not_active Expired - Fee Related
- 1991-01-11 DK DK91300202.8T patent/DK0439258T3/da active
-
1993
- 1993-08-20 US US08/110,078 patent/US5360873A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5360873A (en) | 1994-11-01 |
| JP3181284B2 (ja) | 2001-07-03 |
| ES2073113T3 (es) | 1995-08-01 |
| EP0439258A2 (en) | 1991-07-31 |
| JPH03210312A (ja) | 1991-09-13 |
| EP0439258A3 (en) | 1992-04-29 |
| ATE122088T1 (de) | 1995-05-15 |
| US5278199A (en) | 1994-01-11 |
| EP0439258B1 (en) | 1995-05-03 |
| DE69109309D1 (de) | 1995-06-08 |
| DE69109309T2 (de) | 1995-09-28 |
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