DK0459745T3 - Hærdningsmiddel til epoxyharpiks - Google Patents

Hærdningsmiddel til epoxyharpiks

Info

Publication number
DK0459745T3
DK0459745T3 DK91304790.8T DK91304790T DK0459745T3 DK 0459745 T3 DK0459745 T3 DK 0459745T3 DK 91304790 T DK91304790 T DK 91304790T DK 0459745 T3 DK0459745 T3 DK 0459745T3
Authority
DK
Denmark
Prior art keywords
curing agent
epoxy resin
curable compositions
epoxy
automobiles
Prior art date
Application number
DK91304790.8T
Other languages
English (en)
Inventor
Souichi Muroi
Hsi-Chuan Tsai
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP02138176A external-priority patent/JP3098760B2/ja
Priority claimed from JP2163966A external-priority patent/JP2914390B2/ja
Priority claimed from JP07061591A external-priority patent/JP3168016B2/ja
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of DK0459745T3 publication Critical patent/DK0459745T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
DK91304790.8T 1990-05-28 1991-05-28 Hærdningsmiddel til epoxyharpiks DK0459745T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP02138176A JP3098760B2 (ja) 1990-05-28 1990-05-28 球状エポキシ樹脂用硬化剤
JP2163966A JP2914390B2 (ja) 1990-06-21 1990-06-21 改良されたエポキシ樹脂用硬化剤マスターバッチ
JP07061591A JP3168016B2 (ja) 1991-03-11 1991-03-11 エポキシ樹脂用硬化剤マスターバッチ

Publications (1)

Publication Number Publication Date
DK0459745T3 true DK0459745T3 (da) 1998-03-30

Family

ID=27300385

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91304790.8T DK0459745T3 (da) 1990-05-28 1991-05-28 Hærdningsmiddel til epoxyharpiks

Country Status (7)

Country Link
EP (1) EP0459745B1 (da)
AT (1) ATE157107T1 (da)
CA (1) CA2043337C (da)
DE (1) DE69127321T2 (da)
DK (1) DK0459745T3 (da)
ES (1) ES2107440T3 (da)
GR (1) GR3024834T3 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357008A (en) * 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
WO2005000932A1 (en) * 2003-06-13 2005-01-06 Dow Global Technologies, Inc. Fusible catalysts and polyurethane products made therefrom
US7820772B2 (en) 2004-03-31 2010-10-26 Asahi Kasei Chemicals Corporation Hardener for epoxy resin and epoxy resin composition
KR101495383B1 (ko) * 2007-11-08 2015-02-24 가부시키가이샤 아데카 분말상 에폭시 수지용 잠재성 경화제의 제조 방법, 그 방법에 의해 얻어진 분말상 에폭시 수지용 잠재성 경화제, 및 그것을 이용한 경화성 에폭시 수지 조성물
US8044154B2 (en) 2009-06-12 2011-10-25 Trillion Science, Inc. Latent hardener for epoxy compositions
US8067484B2 (en) 2010-03-12 2011-11-29 Trillion Science, Inc. Latent hardener with improved barrier properties and compatibility
GB2578737B (en) * 2018-11-05 2022-02-23 Aev Holding Ltd Curable epoxy resin and use thereof
CN112280244B (zh) * 2020-10-28 2023-11-03 上海库弗新材料有限公司 一种低翘曲的环氧树脂组合物及其制备方法
CN114230749B (zh) * 2021-11-29 2023-03-17 西安交通大学 一种可快速自修复环氧树脂固化物、制备方法及应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1403867A (fr) * 1963-05-16 1965-06-25 Ici Ltd Dispersions de polymères synthétiques
DE2943689A1 (de) * 1979-10-30 1981-05-14 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von stabilen polymer-polyol-dispersionen
EP0304503B1 (en) * 1987-08-26 1994-06-29 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system

Also Published As

Publication number Publication date
DE69127321T2 (de) 1998-01-29
GR3024834T3 (en) 1998-01-30
CA2043337C (en) 2003-04-15
EP0459745A2 (en) 1991-12-04
DE69127321D1 (de) 1997-09-25
EP0459745B1 (en) 1997-08-20
ES2107440T3 (es) 1997-12-01
EP0459745A3 (en) 1992-08-19
ATE157107T1 (de) 1997-09-15
CA2043337A1 (en) 1991-11-29

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