DK0483058T3 - Kølelegeme til halvlederelementer - Google Patents

Kølelegeme til halvlederelementer

Info

Publication number
DK0483058T3
DK0483058T3 DK91810778.0T DK91810778T DK0483058T3 DK 0483058 T3 DK0483058 T3 DK 0483058T3 DK 91810778 T DK91810778 T DK 91810778T DK 0483058 T3 DK0483058 T3 DK 0483058T3
Authority
DK
Denmark
Prior art keywords
heat sink
semiconductor elements
cooling ribs
baseplate
interconnect
Prior art date
Application number
DK91810778.0T
Other languages
English (en)
Inventor
Uwe Bock
Original Assignee
Alusuisse Lonza Services Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Lonza Services Ag filed Critical Alusuisse Lonza Services Ag
Application granted granted Critical
Publication of DK0483058T3 publication Critical patent/DK0483058T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
DK91810778.0T 1990-10-24 1991-10-04 Kølelegeme til halvlederelementer DK0483058T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH340390 1990-10-24

Publications (1)

Publication Number Publication Date
DK0483058T3 true DK0483058T3 (da) 1996-01-15

Family

ID=4255235

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91810778.0T DK0483058T3 (da) 1990-10-24 1991-10-04 Kølelegeme til halvlederelementer

Country Status (5)

Country Link
EP (1) EP0483058B1 (da)
AT (1) ATE127276T1 (da)
DE (1) DE59106364D1 (da)
DK (1) DK0483058T3 (da)
ES (1) ES2076503T3 (da)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4314663A1 (de) * 1993-05-04 1994-11-10 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
DE9412460U1 (de) 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltechnik Gmbh, 88267 Vogt Kühlvorrichtung für elektrische bzw. elektronische Bauelemente mit einer Grundplatte und mit Kühlelementen
DE29602367U1 (de) * 1995-03-24 1996-05-15 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
DE29602366U1 (de) * 1995-08-17 1996-05-02 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
US6009937A (en) * 1995-12-20 2000-01-04 Hoogovens Aluminium Profiltechnik Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
DK0789396T3 (da) * 1996-01-31 2006-10-23 Alcan Tech & Man Ag Köleelement til halvlederkomponenter eller lignende
DE29602212U1 (de) * 1996-02-09 1996-05-02 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl. Einrichtungen
DE29715585U1 (de) * 1997-08-28 1998-12-24 Hoogovens Aluminium Profiltechnik Bonn GmbH, 53117 Bonn Kühlvorrichtung für elektrische bzw. elektronische Bauelemente
DE19806978B4 (de) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Kühlvorrichtung zur Kühlung durch Konvektion
CH693251A5 (de) * 1998-12-24 2003-04-30 Eural Gnuttis P A Kühlkörper sowie Einzelteil und Verfahren zurHerstellung eines Kühlkörpers.
US8499824B2 (en) * 2005-10-04 2013-08-06 Elektronische Bauelemente Gesellschaft M.B.H. Heat sink
DE102006061215A1 (de) * 2006-08-12 2008-02-21 Diehl Ako Stiftung & Co. Kg Leistungselektronik mit Kühlkörper
DE102006038980B4 (de) * 2006-08-21 2009-02-19 Alcan Technology & Management Ag Kühlkörper für Halbleiterbauelemente sowie Verfahren zu seiner Herstellung
DE102009055367A1 (de) * 2009-12-29 2011-06-30 Kungtin Metallic Products Ltd. Kühlrippe und zugehöriges Rippenmodul
DE102010027765B4 (de) 2010-04-15 2023-10-12 Robert Bosch Gmbh Kühleinrichtung zur Kühlung von Bauteilen
CN109578160A (zh) * 2019-01-07 2019-04-05 浙江康思特动力机械有限公司 带有强制冷却风道的通用汽油机曲轴箱体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3024748C2 (de) * 1980-06-30 1986-09-04 Aluminium Walzwerke Singen Gmbh, 7700 Singen Kühlkörper für Halbleiterbauelemente
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung

Also Published As

Publication number Publication date
DE59106364D1 (de) 1995-10-05
ES2076503T3 (es) 1995-11-01
ATE127276T1 (de) 1995-09-15
EP0483058B1 (de) 1995-08-30
EP0483058A1 (de) 1992-04-29

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