DK0654819T3 - Fremgangsmåde til fremstilling af en anordning til varmeafledning - Google Patents

Fremgangsmåde til fremstilling af en anordning til varmeafledning

Info

Publication number
DK0654819T3
DK0654819T3 DK94250278T DK94250278T DK0654819T3 DK 0654819 T3 DK0654819 T3 DK 0654819T3 DK 94250278 T DK94250278 T DK 94250278T DK 94250278 T DK94250278 T DK 94250278T DK 0654819 T3 DK0654819 T3 DK 0654819T3
Authority
DK
Denmark
Prior art keywords
manufacturing
heat dissipation
dissipation device
module
heat
Prior art date
Application number
DK94250278T
Other languages
Danish (da)
English (en)
Inventor
Helmut Dipl-Ing Kahl
Bernd Dipl-Ing Tiburtius
Original Assignee
Emi Tec Elektronische Material
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6503161&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK0654819(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Emi Tec Elektronische Material filed Critical Emi Tec Elektronische Material
Application granted granted Critical
Publication of DK0654819T3 publication Critical patent/DK0654819T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DK94250278T 1993-11-18 1994-11-17 Fremgangsmåde til fremstilling af en anordning til varmeafledning DK0654819T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4339786A DE4339786C5 (de) 1993-11-18 1993-11-18 Verfahren zur Herstellung einer Anordung zur Wärmeableitung

Publications (1)

Publication Number Publication Date
DK0654819T3 true DK0654819T3 (da) 1999-09-20

Family

ID=6503161

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94250278T DK0654819T3 (da) 1993-11-18 1994-11-17 Fremgangsmåde til fremstilling af en anordning til varmeafledning

Country Status (9)

Country Link
US (1) US5518758A (fr)
EP (1) EP0654819B2 (fr)
JP (1) JP3364027B2 (fr)
CN (1) CN1057188C (fr)
AT (1) ATE176551T1 (fr)
AU (1) AU675176B2 (fr)
DE (2) DE4339786C5 (fr)
DK (1) DK0654819T3 (fr)
RU (1) RU2152697C1 (fr)

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WO2008137966A2 (fr) 2007-05-07 2008-11-13 Robert Stancel Structures pour une toiture solaire fiable et peu coûteuse
US7764504B2 (en) * 2007-05-16 2010-07-27 Tyco Electronics Corporation Heat transfer system for a receptacle assembly
US8216418B2 (en) * 2007-06-13 2012-07-10 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings
US8152954B2 (en) * 2007-10-12 2012-04-10 Lam Research Corporation Showerhead electrode assemblies and plasma processing chambers incorporating the same
US8187414B2 (en) * 2007-10-12 2012-05-29 Lam Research Corporation Anchoring inserts, electrode assemblies, and plasma processing chambers
RU2350055C1 (ru) * 2008-01-29 2009-03-20 Евгений Эдуардович Горохов-Мирошников Модуль, состоящий из подложки, силовых приборов, электрической схемы и теплоотвода
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DE102012207790A1 (de) * 2012-05-10 2013-11-14 Kuhnke Automotive Gmbh & Co. Kg Elektrische Schaltungseinheit
RU2513038C1 (ru) * 2012-08-27 2014-04-20 Открытое акционерное общество Арзамасское научно-производственное предприятие "ТЕМП-АВИА" (ОАО АНПП "ТЕМП-АВИА") Радиоэлектронный блок
US10209016B2 (en) * 2013-03-22 2019-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal energy guiding systems including anisotropic thermal guiding coatings and methods for fabricating the same
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
EP3301710A1 (fr) 2016-09-29 2018-04-04 Siemens Aktiengesellschaft Isolateur thermoconducteur
WO2019070296A1 (fr) * 2017-10-06 2019-04-11 Hewlett-Packard Development Company, L.P. Absorption radiofréquence dans des dispositifs électroniques
CN112133621B (zh) * 2019-06-25 2023-09-29 中微半导体设备(上海)股份有限公司 一种导热片和等离子体处理装置
DE102019220034A1 (de) * 2019-12-18 2021-06-24 Volkswagen Aktiengesellschaft Dichtungsanordnung für einen Akkumulator eines Kraftfahrzeugs sowie Verfahren zur Herstellung einer solchen Dichtungsanordnung
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Also Published As

Publication number Publication date
DE4339786A1 (de) 1995-05-24
EP0654819A3 (fr) 1995-10-18
JP3364027B2 (ja) 2003-01-08
CN1108860A (zh) 1995-09-20
DE4339786C5 (de) 2004-02-05
US5518758A (en) 1996-05-21
AU7893094A (en) 1995-05-25
EP0654819B1 (fr) 1999-02-03
RU2152697C1 (ru) 2000-07-10
EP0654819B2 (fr) 2004-11-24
JPH07212067A (ja) 1995-08-11
CN1057188C (zh) 2000-10-04
ATE176551T1 (de) 1999-02-15
AU675176B2 (en) 1997-01-23
RU94040896A (ru) 1996-09-20
DE59407769D1 (de) 1999-03-18
DE4339786C2 (de) 1997-03-20
EP0654819A2 (fr) 1995-05-24

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