ATE422711T1 - Vorrichtung zur kühlung eines bauteiles - Google Patents

Vorrichtung zur kühlung eines bauteiles

Info

Publication number
ATE422711T1
ATE422711T1 AT03254283T AT03254283T ATE422711T1 AT E422711 T1 ATE422711 T1 AT E422711T1 AT 03254283 T AT03254283 T AT 03254283T AT 03254283 T AT03254283 T AT 03254283T AT E422711 T1 ATE422711 T1 AT E422711T1
Authority
AT
Austria
Prior art keywords
phase
circuit component
coolant
component
cooling
Prior art date
Application number
AT03254283T
Other languages
English (en)
Inventor
James L Haws
William Gerald Wyatt
James F Kviatkofsky
David B Denniston
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ATE422711T1 publication Critical patent/ATE422711T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Surgical Instruments (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT03254283T 2002-07-11 2003-07-05 Vorrichtung zur kühlung eines bauteiles ATE422711T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/193,571 US6937471B1 (en) 2002-07-11 2002-07-11 Method and apparatus for removing heat from a circuit

Publications (1)

Publication Number Publication Date
ATE422711T1 true ATE422711T1 (de) 2009-02-15

Family

ID=29735338

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03254283T ATE422711T1 (de) 2002-07-11 2003-07-05 Vorrichtung zur kühlung eines bauteiles

Country Status (5)

Country Link
US (1) US6937471B1 (de)
EP (1) EP1381083B1 (de)
AT (1) ATE422711T1 (de)
DE (1) DE60326104D1 (de)
ES (1) ES2323683T3 (de)

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US7149086B2 (en) * 2004-12-10 2006-12-12 Intel Corporation Systems to cool multiple electrical components
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US7443354B2 (en) 2005-08-09 2008-10-28 The Boeing Company Compliant, internally cooled antenna apparatus and method
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US7908874B2 (en) 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US7551440B2 (en) * 2007-01-24 2009-06-23 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic component
US7548424B2 (en) * 2007-03-12 2009-06-16 Raytheon Company Distributed transmit/receive integrated microwave module chip level cooling system
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
GB0716116D0 (en) * 2007-08-17 2007-09-26 Selex Sensors & Airborne Sys Antenna
US7921655B2 (en) 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US20090101311A1 (en) * 2007-10-22 2009-04-23 Raytheon Company System and Method for Cooling Using Two Separate Coolants
US8503941B2 (en) 2008-02-21 2013-08-06 The Boeing Company System and method for optimized unmanned vehicle communication using telemetry
US7934386B2 (en) 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
US8441827B2 (en) * 2009-03-11 2013-05-14 Caterpillar Inc. Power converter assembly having a housing
US8045329B2 (en) * 2009-04-29 2011-10-25 Raytheon Company Thermal dissipation mechanism for an antenna
FR2960707B1 (fr) * 2010-05-25 2012-06-29 Thales Sa Antenne a balayage electronique de construction modulaire amelioree et procede de refroidissement d'une telle antenne
JP6391852B2 (ja) * 2015-12-17 2018-09-19 三菱電機株式会社 フェーズドアレイアンテナ
US10217648B1 (en) 2017-05-31 2019-02-26 Hrl Laboratories, Llc Fabrication of microfluidic channels in diamond
RU2691277C1 (ru) * 2018-08-01 2019-06-11 Открытое акционерное общество "Авангард" Антенна мобильной установки
CN109786924B (zh) * 2019-03-05 2021-11-16 成都雷电微力科技股份有限公司 一种自散热tr模块及采用该tr模块的相控阵天线
US11411295B2 (en) * 2020-09-18 2022-08-09 Raytheon Company Antenna sub-array blocks having heat dissipation
CN118175821B (zh) * 2024-05-16 2024-07-19 成都智芯雷通微系统技术有限公司 一种包含散热结构的相控阵雷达模块

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Also Published As

Publication number Publication date
EP1381083A3 (de) 2004-12-08
EP1381083A2 (de) 2004-01-14
US6937471B1 (en) 2005-08-30
DE60326104D1 (de) 2009-03-26
EP1381083B1 (de) 2009-02-11
ES2323683T3 (es) 2009-07-23

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties