DK0685571T3 - Fremgangsmåde og indretning til ved katodeforstøvning at coate et substrat - Google Patents

Fremgangsmåde og indretning til ved katodeforstøvning at coate et substrat

Info

Publication number: DK0685571T3
Authority: DK; Denmark
Prior art keywords: substrate; elements; surface layer; deposited; target
Prior art date: 1994-06-02

Application number

DK95870065T

Other languages

English (en)

Inventor

Rene U L B Winand

Alain R D C S Weymeersch

Brande Pierre U L B Vanden

Stephane Lucas

Lucien Renard

Original Assignee

Cockerill Rech & Dev

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1994-06-02

Filing date

1995-06-02

Publication date

1999-08-23

1995-06-02 Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev

1999-08-23 Application granted granted Critical

1999-08-23 Publication of DK0685571T3 publication Critical patent/DK0685571T3/da

Links

239000000758 substrate Substances 0.000 title abstract 6
238000004544 sputter deposition Methods 0.000 title abstract 4
238000000034 method Methods 0.000 title abstract 3
239000011248 coating agent Substances 0.000 title abstract 2
238000000576 coating method Methods 0.000 title abstract 2
239000002344 surface layer Substances 0.000 abstract 4
230000015572 biosynthetic process Effects 0.000 abstract 1
239000007788 liquid Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physical Vapour Deposition (AREA)

DK95870065T 1994-06-02 1995-06-02 Fremgangsmåde og indretning til ved katodeforstøvning at coate et substrat DK0685571T3 (da)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
BE9400552A BE1008303A3 (fr)	1994-06-02	1994-06-02	Procede et dispositif pour la formation d'un revetement sur un substrat par pulverisation cathodique.

Publications (1)

Publication Number	Publication Date
DK0685571T3 true DK0685571T3 (da)	1999-08-23

Family

ID=3888189

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK95870065T DK0685571T3 (da)	1994-06-02	1995-06-02	Fremgangsmåde og indretning til ved katodeforstøvning at coate et substrat

Country Status (7)

Country	Link
EP (1)	EP0685571B1 (da)
AT (1)	ATE174637T1 (da)
BE (1)	BE1008303A3 (da)
DE (1)	DE69506618T2 (da)
DK (1)	DK0685571T3 (da)
ES (1)	ES2128028T3 (da)
GR (1)	GR3029503T3 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6432281B2 (en) *	1995-12-20	2002-08-13	Recherche Et Developpement Due Groupe Cockerill Sambre	Process for formation of a coating on a substrate
BE1009838A3 (fr) *	1995-12-20	1997-10-07	Cockerill Rech & Dev	Procede et dispositif pour la formation d'un revetement sur un substrat.
BE1010797A3 (fr) *	1996-12-10	1999-02-02	Cockerill Rech & Dev	Procede et dispositif pour la formation d'un revetement sur un substrat, par pulverisation cathodique.
EP1182272A1 (fr)	2000-08-23	2002-02-27	Cold Plasma Applications C.P.A.	Procédé et dispositif permettant le dépôt de couches métalliques en continu par plasma froid
US11952654B2 (en) *	2018-10-24	2024-04-09	Evatec Ag	Liquid sputter target

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2528108B2 (de) *	1975-06-24	1977-11-03	Siemens AG, 1000 Berlin und 8000 München	Verfahren zum aufbringen von elektrisch leitenden schichten auf eine unterlage
JPH0192384A (ja) *	1987-10-02	1989-04-11	Hitachi Ltd	プラズマ処理装置
JPH0219466A (ja) *	1988-07-07	1990-01-23	Matsushita Electric Ind Co Ltd	繊維・フィルム連続蒸着装置

1994
- 1994-06-02 BE BE9400552A patent/BE1008303A3/fr not_active IP Right Cessation
1995
- 1995-06-02 DK DK95870065T patent/DK0685571T3/da active
- 1995-06-02 DE DE69506618T patent/DE69506618T2/de not_active Expired - Lifetime
- 1995-06-02 EP EP95870065A patent/EP0685571B1/fr not_active Expired - Lifetime
- 1995-06-02 ES ES95870065T patent/ES2128028T3/es not_active Expired - Lifetime
- 1995-06-02 AT AT95870065T patent/ATE174637T1/de active
1999
- 1999-02-26 GR GR990400600T patent/GR3029503T3/el unknown

Also Published As

Publication number	Publication date
ATE174637T1 (de)	1999-01-15
EP0685571A1 (fr)	1995-12-06
DE69506618T2 (de)	1999-07-08
BE1008303A3 (fr)	1996-04-02
DE69506618D1 (de)	1999-01-28
GR3029503T3 (en)	1999-05-28
EP0685571B1 (fr)	1998-12-16
ES2128028T3 (es)	1999-05-01

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