DK0687383T3 - Kølelegemeanordning for halvlederindretninger - Google Patents

Kølelegemeanordning for halvlederindretninger

Info

Publication number
DK0687383T3
DK0687383T3 DK94908029.5T DK94908029T DK0687383T3 DK 0687383 T3 DK0687383 T3 DK 0687383T3 DK 94908029 T DK94908029 T DK 94908029T DK 0687383 T3 DK0687383 T3 DK 0687383T3
Authority
DK
Denmark
Prior art keywords
heat sink
adaptor
sink assembly
semiconductor devices
microprocessor
Prior art date
Application number
DK94908029.5T
Other languages
Danish (da)
English (en)
Inventor
Peter D Tata
William B Rife
Original Assignee
Chip Coolers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/026,515 external-priority patent/US5313099A/en
Application filed by Chip Coolers Inc filed Critical Chip Coolers Inc
Application granted granted Critical
Publication of DK0687383T3 publication Critical patent/DK0687383T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DK94908029.5T 1993-03-04 1994-02-14 Kølelegemeanordning for halvlederindretninger DK0687383T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/026,515 US5313099A (en) 1993-03-04 1993-03-04 Heat sink assembly for solid state devices
US08/097,483 US5397919A (en) 1993-03-04 1993-07-26 Heat sink assembly for solid state devices

Publications (1)

Publication Number Publication Date
DK0687383T3 true DK0687383T3 (da) 1998-06-02

Family

ID=26701349

Family Applications (1)

Application Number Title Priority Date Filing Date
DK94908029.5T DK0687383T3 (da) 1993-03-04 1994-02-14 Kølelegemeanordning for halvlederindretninger

Country Status (11)

Country Link
US (1) US5397919A (fr)
EP (1) EP0687383B1 (fr)
JP (1) JP2971578B2 (fr)
KR (1) KR100262045B1 (fr)
AT (1) ATE166182T1 (fr)
AU (1) AU673056B2 (fr)
BR (1) BR9405732A (fr)
CA (1) CA2143105C (fr)
DE (1) DE69410245T2 (fr)
DK (1) DK0687383T3 (fr)
WO (1) WO1994020987A1 (fr)

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US7413851B2 (en) * 2002-12-13 2008-08-19 Aurelium Biopharma, Inc. Nucleophosmin directed diagnostics and therapeutics for multidrug resistant neoplastic disease
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Also Published As

Publication number Publication date
EP0687383A1 (fr) 1995-12-20
EP0687383B1 (fr) 1998-05-13
WO1994020987A1 (fr) 1994-09-15
ATE166182T1 (de) 1998-05-15
AU673056B2 (en) 1996-10-24
JP2971578B2 (ja) 1999-11-08
US5397919A (en) 1995-03-14
KR100262045B1 (ko) 2000-07-15
DE69410245D1 (de) 1998-06-18
KR960701469A (ko) 1996-02-24
EP0687383A4 (fr) 1995-10-26
JPH08507655A (ja) 1996-08-13
CA2143105C (fr) 1996-12-31
AU6137494A (en) 1994-09-26
BR9405732A (pt) 1995-12-05
CA2143105A1 (fr) 1994-09-15
DE69410245T2 (de) 1998-09-03

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