DK0913076T3 - Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde - Google Patents

Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde

Info

Publication number
DK0913076T3
DK0913076T3 DK96921860T DK96921860T DK0913076T3 DK 0913076 T3 DK0913076 T3 DK 0913076T3 DK 96921860 T DK96921860 T DK 96921860T DK 96921860 T DK96921860 T DK 96921860T DK 0913076 T3 DK0913076 T3 DK 0913076T3
Authority
DK
Denmark
Prior art keywords
conductive
printed circuits
tracks
made according
printed circuit
Prior art date
Application number
DK96921860T
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Application granted granted Critical
Publication of DK0913076T3 publication Critical patent/DK0913076T3/da

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/003Printed circuit coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type
    • H01F17/0006Printed inductances
    • H01F2017/006Printed inductances flexible printed inductors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Burglar Alarm Systems (AREA)
  • Transmitters (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Liquid Developers In Electrophotography (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DK96921860T 1996-07-18 1996-07-18 Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde DK0913076T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CH1996/000262 WO1998004105A1 (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Publications (1)

Publication Number Publication Date
DK0913076T3 true DK0913076T3 (da) 2002-04-02

Family

ID=4550440

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96921860T DK0913076T3 (da) 1996-07-18 1996-07-18 Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde

Country Status (12)

Country Link
US (1) US6176010B1 (da)
EP (1) EP0913076B1 (da)
JP (1) JP2000515683A (da)
AT (1) ATE210365T1 (da)
AU (1) AU717462B2 (da)
DE (1) DE69617753T2 (da)
DK (1) DK0913076T3 (da)
ES (1) ES2168490T3 (da)
HU (1) HUP9903550A3 (da)
IL (1) IL128055A (da)
WO (1) WO1998004105A1 (da)
ZA (1) ZA976339B (da)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
US6308406B1 (en) * 1998-08-12 2001-10-30 Thermotrax Corporation Method for forming an electrical conductive circuit on a substrate
AU2690400A (en) * 1999-02-24 2000-09-14 Hitachi Maxell, Ltd. Ic device and its production method, and information carrier mounted with ic device and its production method
FR2796208B1 (fr) * 1999-07-08 2002-10-25 Gemplus Card Int Antenne pour carte a puce sans contact, cartes hybrides et etiquettes electroniques
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型icカード
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
GB0024294D0 (en) * 2000-10-04 2000-11-15 Univ Cambridge Tech Solid state embossing of polymer devices
FR2832286A1 (fr) * 2001-11-14 2003-05-16 Jacky Marcel Pouzet Dispositif de detection d'extraction d'objets par rupture de piste(s) d'un circuit imprime a puce integre au conditionnement et relie a un dispositif electronique. procede de fabrication du circuit
GB0307729D0 (en) * 2003-04-03 2003-05-07 Tesla Engineering Ltd Manufacture of shim windings
US7152317B2 (en) * 2003-08-08 2006-12-26 Shmuel Shapira Circuit forming method
FR2866479A1 (fr) * 2004-02-12 2005-08-19 Thomson Licensing Sa Procede de fabrication d'une antenne et/ou d'un reseau d'antennes, antenne et/ou reseau d'antennes fabriques selon un tel procede
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Icタグ付シートの製造方法、icタグ付シートの製造装置、icタグ付シート、icチップの固定方法、icチップの固定装置、およびicタグ
NL1030664C2 (nl) * 2005-12-13 2007-06-14 Meco Equip Eng Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager.
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
KR20090076994A (ko) * 2006-10-31 2009-07-13 솔리코어 인코포레이티드 인증카드
JP5684475B2 (ja) * 2006-10-31 2015-03-11 ソリコア インコーポレイテッドSOLICORE,Incorporated 電池式デバイス
US8181879B2 (en) * 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
FI121592B (fi) * 2008-03-26 2011-01-31 Tecnomar Oy Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti
US20100071197A1 (en) * 2008-09-22 2010-03-25 Fridy Joseph M Integral antennas in metal laminates
DE102010011504A1 (de) * 2010-03-16 2012-06-14 Mühlbauer Ag Verfahren zur Herstellung einer Transponderantenne, Transponderinlay mit einer derartigen Transponderantenne
RU2416894C1 (ru) * 2010-04-12 2011-04-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления рельефных печатных плат
EP2580715B1 (en) 2010-06-14 2019-05-22 Avery Dennison Corporation Method, system and apparatus for making short run radio frequency identification tags and labels
JP2016184596A (ja) * 2013-08-19 2016-10-20 凸版印刷株式会社 フレキシブル配線基材と配線基板及び太陽電池モジュールとicカード
JP2015070221A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 太陽電池モジュール用集電シートの製造方法
RU2697508C1 (ru) * 2018-06-19 2019-08-15 Федеральное Государственное Унитарное Предприятие "Всероссийский Научно-Исследовательский Институт Автоматики Им.Н.Л.Духова" (Фгуп "Внииа") Способ изготовления печатных плат и устройство для изготовления проводящей схемы
KR102104308B1 (ko) * 2018-10-02 2020-04-24 주식회사 에스에프에이 전면 디스플레이용 스탬핑장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB610058A (en) * 1945-03-24 1948-10-11 Albert Ward Franklin Improvements in structural unit for radio apparatus and method of making the same
US2622054A (en) * 1946-05-11 1952-12-16 Albert W Franklin Method of making an electrical unit
DE1615015B1 (de) 1965-01-14 1970-10-22 Western Electric Co Verfahren zur Herstellung einer gedruckten Schaltung
DE1690542A1 (de) * 1967-09-07 1971-11-18 Zucht Geb Schmidt Gisela Verfahren zur mechanischen Separierung reproduzierbarer,diskreter Leiterbahnen auf mit leitender Schicht bedecktem Isoliermaterial
DE2223892A1 (de) * 1971-05-18 1973-01-11 Maria Antonietta Brandi Verfahren zum herstellen von elektrischen stromleiterplatten
US3911716A (en) * 1971-05-21 1975-10-14 Jerobee Ind Inc Circuit board, method of making the circuit board and improved die for making said board
FR2318556A1 (fr) * 1975-07-12 1977-02-11 Seebach Juergen Procede de fabrication de plaques de circuits electriques et appareil mettant en oeuvre ce procede
NL172113C (nl) * 1977-01-06 1983-07-01 Spierings Ferd Hubert F G Werkwijze voor het aanbrengen van een lijnvormige opening in een deklaag van elektrisch geleidend materiaal op een substraat.
US4356627A (en) * 1980-02-04 1982-11-02 Amp Incorporated Method of making circuit path conductors in plural planes
US4555291A (en) 1981-04-23 1985-11-26 Minnesota Mining And Manufacturing Company Method of constructing an LC network
DE3143208C2 (de) * 1981-10-30 1984-07-05 Max-E. Dipl.-Ing. 7320 Göppingen Reeb Identifizierungsanordnung in Form eines an einem Gegenstand anbringbaren etikettartigen Streifens und Verfahren zu deren Herstellung
DE3330738A1 (de) 1983-08-26 1985-03-07 Gerhard 8912 Kaufering Rahlf Verfahren und vorrichtung zur herstellung von elektrischen schaltungen auf leiterplatten
JPH01129396A (ja) * 1987-11-14 1989-05-22 Tokai Kinzoku Kk 共振タグおよびその製造法
EP0526484B1 (fr) * 1990-04-19 1994-03-16 GUSTAFSON, Ake Procede d'assemblage d'une bobine sur un circuit imprime
US5050292A (en) * 1990-05-25 1991-09-24 Trovan Limited Automated method for the manufacture of transponder devices by winding around a bobbin
FR2674724A1 (fr) 1991-03-27 1992-10-02 Lecoent Fernand Procede de fabrication de circuit electronique moule en deux ou trois dimensions.
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card

Also Published As

Publication number Publication date
HUP9903550A3 (en) 2000-09-28
IL128055A0 (en) 1999-11-30
ES2168490T3 (es) 2002-06-16
US6176010B1 (en) 2001-01-23
HUP9903550A2 (hu) 2000-02-28
EP0913076A1 (fr) 1999-05-06
AU6297196A (en) 1998-02-10
IL128055A (en) 2003-12-10
ATE210365T1 (de) 2001-12-15
DE69617753T2 (de) 2002-08-08
WO1998004105A1 (fr) 1998-01-29
EP0913076B1 (fr) 2001-12-05
DE69617753D1 (de) 2002-01-17
JP2000515683A (ja) 2000-11-21
AU717462B2 (en) 2000-03-30
ZA976339B (en) 1998-02-18

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