DK0913076T3 - Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde - Google Patents

Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde

Info

Publication number
DK0913076T3
DK0913076T3 DK96921860T DK96921860T DK0913076T3 DK 0913076 T3 DK0913076 T3 DK 0913076T3 DK 96921860 T DK96921860 T DK 96921860T DK 96921860 T DK96921860 T DK 96921860T DK 0913076 T3 DK0913076 T3 DK 0913076T3
Authority
DK
Denmark
Prior art keywords
conductive
printed circuits
tracks
made according
printed circuit
Prior art date
Application number
DK96921860T
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Application granted granted Critical
Publication of DK0913076T3 publication Critical patent/DK0913076T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/006—Printed inductances flexible printed inductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Burglar Alarm Systems (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Transmitters (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Liquid Developers In Electrophotography (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DK96921860T 1996-07-18 1996-07-18 Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde DK0913076T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CH1996/000262 WO1998004105A1 (fr) 1996-07-18 1996-07-18 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Publications (1)

Publication Number Publication Date
DK0913076T3 true DK0913076T3 (da) 2002-04-02

Family

ID=4550440

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96921860T DK0913076T3 (da) 1996-07-18 1996-07-18 Fremgangsmåde til fremstilling af trykte kredsløb og trykt kredsløb fremstillet ifølge denne fremgangsmåde

Country Status (12)

Country Link
US (1) US6176010B1 (da)
EP (1) EP0913076B1 (da)
JP (1) JP2000515683A (da)
AT (1) ATE210365T1 (da)
AU (1) AU717462B2 (da)
DE (1) DE69617753T2 (da)
DK (1) DK0913076T3 (da)
ES (1) ES2168490T3 (da)
HU (1) HUP9903550A3 (da)
IL (1) IL128055A (da)
WO (1) WO1998004105A1 (da)
ZA (1) ZA976339B (da)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
US6308406B1 (en) * 1998-08-12 2001-10-30 Thermotrax Corporation Method for forming an electrical conductive circuit on a substrate
CN102254865A (zh) * 1999-02-24 2011-11-23 日立马库塞鲁株式会社 集成电路元件的制造方法
FR2796208B1 (fr) * 1999-07-08 2002-10-25 Gemplus Card Int Antenne pour carte a puce sans contact, cartes hybrides et etiquettes electroniques
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型icカード
DE10016037B4 (de) * 2000-03-31 2005-01-05 Interlock Ag Verfahren zur Herstellung eines Etiketts oder einer Chipkarte
GB0024294D0 (en) * 2000-10-04 2000-11-15 Univ Cambridge Tech Solid state embossing of polymer devices
FR2832286A1 (fr) * 2001-11-14 2003-05-16 Jacky Marcel Pouzet Dispositif de detection d'extraction d'objets par rupture de piste(s) d'un circuit imprime a puce integre au conditionnement et relie a un dispositif electronique. procede de fabrication du circuit
GB0307729D0 (en) * 2003-04-03 2003-05-07 Tesla Engineering Ltd Manufacture of shim windings
US7152317B2 (en) * 2003-08-08 2006-12-26 Shmuel Shapira Circuit forming method
FR2866479A1 (fr) * 2004-02-12 2005-08-19 Thomson Licensing Sa Procede de fabrication d'une antenne et/ou d'un reseau d'antennes, antenne et/ou reseau d'antennes fabriques selon un tel procede
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Icタグ付シートの製造方法、icタグ付シートの製造装置、icタグ付シート、icチップの固定方法、icチップの固定装置、およびicタグ
NL1030664C2 (nl) * 2005-12-13 2007-06-14 Meco Equip Eng Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager.
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
EP2095220A4 (en) * 2006-10-31 2013-07-10 Solicore Inc POWER SUPPLIED CARDS
WO2008054715A2 (en) * 2006-10-31 2008-05-08 Solicore, Inc. Powered print advertisements, product packaging, and trading cards
WO2008082617A2 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
US7967214B2 (en) * 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
FI121592B (fi) * 2008-03-26 2011-01-31 Tecnomar Oy Piirilevylaminaatin, erityisesti rfid-antennilaminaatin valmistusmenetelmä ja piirilevylaminaatti
US20100071197A1 (en) * 2008-09-22 2010-03-25 Fridy Joseph M Integral antennas in metal laminates
DE102010011504A1 (de) * 2010-03-16 2012-06-14 Mühlbauer Ag Verfahren zur Herstellung einer Transponderantenne, Transponderinlay mit einer derartigen Transponderantenne
RU2416894C1 (ru) * 2010-04-12 2011-04-20 Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Полет" Способ изготовления рельефных печатных плат
CN102947093B (zh) 2010-06-14 2017-04-05 艾利丹尼森公司 制造射频识别器件的方法
JP2016184596A (ja) * 2013-08-19 2016-10-20 凸版印刷株式会社 フレキシブル配線基材と配線基板及び太陽電池モジュールとicカード
JP2015070221A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 太陽電池モジュール用集電シートの製造方法
RU2697508C1 (ru) * 2018-06-19 2019-08-15 Федеральное Государственное Унитарное Предприятие "Всероссийский Научно-Исследовательский Институт Автоматики Им.Н.Л.Духова" (Фгуп "Внииа") Способ изготовления печатных плат и устройство для изготовления проводящей схемы
KR102104308B1 (ko) * 2018-10-02 2020-04-24 주식회사 에스에프에이 전면 디스플레이용 스탬핑장치

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB610058A (en) * 1945-03-24 1948-10-11 Albert Ward Franklin Improvements in structural unit for radio apparatus and method of making the same
US2622054A (en) * 1946-05-11 1952-12-16 Albert W Franklin Method of making an electrical unit
DE1615015B1 (de) 1965-01-14 1970-10-22 Western Electric Co Verfahren zur Herstellung einer gedruckten Schaltung
DE1690542A1 (de) * 1967-09-07 1971-11-18 Zucht Geb Schmidt Gisela Verfahren zur mechanischen Separierung reproduzierbarer,diskreter Leiterbahnen auf mit leitender Schicht bedecktem Isoliermaterial
DE2223892A1 (de) 1971-05-18 1973-01-11 Maria Antonietta Brandi Verfahren zum herstellen von elektrischen stromleiterplatten
US3911716A (en) * 1971-05-21 1975-10-14 Jerobee Ind Inc Circuit board, method of making the circuit board and improved die for making said board
FR2318556A1 (fr) * 1975-07-12 1977-02-11 Seebach Juergen Procede de fabrication de plaques de circuits electriques et appareil mettant en oeuvre ce procede
NL172113C (nl) * 1977-01-06 1983-07-01 Spierings Ferd Hubert F G Werkwijze voor het aanbrengen van een lijnvormige opening in een deklaag van elektrisch geleidend materiaal op een substraat.
US4356627A (en) * 1980-02-04 1982-11-02 Amp Incorporated Method of making circuit path conductors in plural planes
US4555291A (en) 1981-04-23 1985-11-26 Minnesota Mining And Manufacturing Company Method of constructing an LC network
DE3143208C2 (de) * 1981-10-30 1984-07-05 Max-E. Dipl.-Ing. 7320 Göppingen Reeb Identifizierungsanordnung in Form eines an einem Gegenstand anbringbaren etikettartigen Streifens und Verfahren zu deren Herstellung
DE3330738A1 (de) 1983-08-26 1985-03-07 Gerhard 8912 Kaufering Rahlf Verfahren und vorrichtung zur herstellung von elektrischen schaltungen auf leiterplatten
JPH01129396A (ja) * 1987-11-14 1989-05-22 Tokai Kinzoku Kk 共振タグおよびその製造法
DE69101436T2 (de) * 1990-04-19 1994-07-21 Ake Gustafson Verfahren zum montieren von einer spule auf eine leiterplatte.
US5050292A (en) 1990-05-25 1991-09-24 Trovan Limited Automated method for the manufacture of transponder devices by winding around a bobbin
FR2674724A1 (fr) 1991-03-27 1992-10-02 Lecoent Fernand Procede de fabrication de circuit electronique moule en deux ou trois dimensions.
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card

Also Published As

Publication number Publication date
EP0913076B1 (fr) 2001-12-05
HUP9903550A3 (en) 2000-09-28
ZA976339B (en) 1998-02-18
DE69617753D1 (de) 2002-01-17
AU6297196A (en) 1998-02-10
IL128055A0 (en) 1999-11-30
JP2000515683A (ja) 2000-11-21
EP0913076A1 (fr) 1999-05-06
ATE210365T1 (de) 2001-12-15
DE69617753T2 (de) 2002-08-08
WO1998004105A1 (fr) 1998-01-29
ES2168490T3 (es) 2002-06-16
IL128055A (en) 2003-12-10
HUP9903550A2 (hu) 2000-02-28
US6176010B1 (en) 2001-01-23
AU717462B2 (en) 2000-03-30

Similar Documents

Publication Publication Date Title
IL128055A (en) Method for making printed circuits and resulting printed circuit
MY128039A (en) Printed circuit boards and method of producing the same
EP0129697A3 (en) Method of making printed circuit boards
TW428259B (en) Method of producing electronic part attached with adhesive and method of mounting a plurality of such electronic parts on a circuit board
SE9804150D0 (sv) Förfarande för tillverkning av tryckt kretskort med flera skikt
EP0329313A3 (en) Laser patterning using a novel resist
ATE342649T1 (de) Elektrisches kontaktierungsverfahren
WO2000007219A3 (en) High density printed circuit substrate and method of fabrication
EP0282625A3 (en) Method for producing rigid-type multilayer printed wiring board
ATE355726T1 (de) Verbessertes verfahren zur herstellung leitender spuren und so hergestellte gedruckte leiterplatten
TW200507009A (en) Method of forming high resolution electronic circuits on a substrate
DE3567770D1 (en) Method for producing electronic circuits based on thin layers transistors and capacitors
WO1997022235A3 (en) Solder mask for manufacture of printed circuit boards
KR980007902A (ko) 레이저를 이용한 다층인쇄회로기판의 제조방법
SE0000097D0 (sv) Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt
WO2003030254A3 (en) Process for assembling systems and structure thus obtained
JPS56116697A (en) Method of forming conductor layer on multilayer circuit board
WO1990012482A3 (en) Printed circuit boards
SE8702704D0 (sv) Sett for tillverkning av ett monsterkort samt anordning for anvendning vid genomforande av settet
IE801669L (en) Manufacture of printed circuits
GB2075270A (en) Method for metalizing holes in insulating material
JPH0548246A (ja) フレキシブルプリント配線板の製造方法
JP2869616B2 (ja) 回路配線基板の製造法
TR199900111T2 (xx) Baskılı devre yapmak için metod.
JPS58175222A (ja) 平滑回路基板の製造方法