DK1213572T3 - Fremgangsmåde til fremstilling af en forseglet temperatursonde og sonde fremstillet således - Google Patents
Fremgangsmåde til fremstilling af en forseglet temperatursonde og sonde fremstillet såledesInfo
- Publication number
- DK1213572T3 DK1213572T3 DK00830800T DK00830800T DK1213572T3 DK 1213572 T3 DK1213572 T3 DK 1213572T3 DK 00830800 T DK00830800 T DK 00830800T DK 00830800 T DK00830800 T DK 00830800T DK 1213572 T3 DK1213572 T3 DK 1213572T3
- Authority
- DK
- Denmark
- Prior art keywords
- probe
- prepared
- producing
- sealed temperature
- cable
- Prior art date
Links
- 239000000523 sample Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000012815 thermoplastic material Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Ceramic Products (AREA)
- Insulated Conductors (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00830800A EP1213572B1 (en) | 2000-12-05 | 2000-12-05 | Method for manufacturing a sealed temperature probe and probe thus manufactured |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK1213572T3 true DK1213572T3 (da) | 2003-06-23 |
Family
ID=8175577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK00830800T DK1213572T3 (da) | 2000-12-05 | 2000-12-05 | Fremgangsmåde til fremstilling af en forseglet temperatursonde og sonde fremstillet således |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20020067243A1 (da) |
| EP (1) | EP1213572B1 (da) |
| AT (1) | ATE235046T1 (da) |
| BR (1) | BR0105778A (da) |
| DE (1) | DE60001756T2 (da) |
| DK (1) | DK1213572T3 (da) |
| ES (1) | ES2192517T3 (da) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6592253B2 (en) * | 2001-10-09 | 2003-07-15 | Northrop Grumman Corporation | Precision temperature probe having fast response |
| US7046116B2 (en) * | 2002-11-12 | 2006-05-16 | Heraeus Sensor Technology Gmbh | Temperature probe and its use |
| DE10340636B3 (de) * | 2003-09-03 | 2005-01-13 | Epcos Ag | Verfahren zur Herstellung eines feuchtedichten Fühlers |
| JP4620400B2 (ja) * | 2004-07-16 | 2011-01-26 | 日本特殊陶業株式会社 | 温度センサ、温度センサの製造方法 |
| JP4214124B2 (ja) * | 2005-03-14 | 2009-01-28 | 株式会社バイオエコーネット | 耳式体温計 |
| DE102007046900C5 (de) * | 2007-09-28 | 2018-07-26 | Heraeus Sensor Technology Gmbh | Hochtemperatursensor und ein Verfahren zu dessen Herstellung |
| CN104501524B (zh) * | 2014-12-22 | 2017-09-19 | 合肥美的电冰箱有限公司 | 感温组件及具有其的制冷设备 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD256951A1 (de) * | 1986-12-30 | 1988-05-25 | Forsch U Rationalisierung Tga | Ummantelungsverfahren fuer elektronische bauelemente |
| JP2658772B2 (ja) * | 1992-11-16 | 1997-09-30 | 日立電線株式会社 | 温度センサの封止構造及び封止方法 |
| JP3198823B2 (ja) * | 1994-09-21 | 2001-08-13 | 三菱マテリアル株式会社 | 樹脂モールドサーミスタセンサ |
| JPH08219904A (ja) * | 1995-02-20 | 1996-08-30 | Matsushita Electric Ind Co Ltd | サーミスタ式表面温度センサ |
| US5665653A (en) * | 1995-03-29 | 1997-09-09 | Unifet, Incorporated | Method for encapsulating an electrochemical sensor |
-
2000
- 2000-12-05 ES ES00830800T patent/ES2192517T3/es not_active Expired - Lifetime
- 2000-12-05 EP EP00830800A patent/EP1213572B1/en not_active Expired - Lifetime
- 2000-12-05 DK DK00830800T patent/DK1213572T3/da active
- 2000-12-05 DE DE60001756T patent/DE60001756T2/de not_active Expired - Lifetime
- 2000-12-05 AT AT00830800T patent/ATE235046T1/de not_active IP Right Cessation
-
2001
- 2001-11-05 US US10/005,943 patent/US20020067243A1/en not_active Abandoned
- 2001-12-04 BR BR0105778-2A patent/BR0105778A/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1213572B1 (en) | 2003-03-19 |
| EP1213572A1 (en) | 2002-06-12 |
| US20020067243A1 (en) | 2002-06-06 |
| ES2192517T3 (es) | 2003-10-16 |
| DE60001756T2 (de) | 2003-12-24 |
| ATE235046T1 (de) | 2003-04-15 |
| DE60001756D1 (de) | 2003-04-24 |
| BR0105778A (pt) | 2002-08-13 |
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