DK139590B - Strømløs kobberafsætningsopløsning. - Google Patents

Strømløs kobberafsætningsopløsning.

Info

Publication number
DK139590B
DK139590B DK51370AA DK51370A DK139590B DK 139590 B DK139590 B DK 139590B DK 51370A A DK51370A A DK 51370AA DK 51370 A DK51370 A DK 51370A DK 139590 B DK139590 B DK 139590B
Authority
DK
Denmark
Prior art keywords
copper deposition
deposition solution
powerless
powerless copper
solution
Prior art date
Application number
DK51370AA
Other languages
English (en)
Other versions
DK139590C (da
Inventor
Frederick William Schneble Jr
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK139590B publication Critical patent/DK139590B/da
Application granted granted Critical
Publication of DK139590C publication Critical patent/DK139590C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DK51370AA 1969-02-04 1970-02-03 Strømløs kobberafsætningsopløsning. DK139590B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79654269A 1969-02-04 1969-02-04

Publications (2)

Publication Number Publication Date
DK139590B true DK139590B (da) 1979-03-12
DK139590C DK139590C (da) 1979-09-03

Family

ID=25168439

Family Applications (1)

Application Number Title Priority Date Filing Date
DK51370AA DK139590B (da) 1969-02-04 1970-02-03 Strømløs kobberafsætningsopløsning.

Country Status (9)

Country Link
US (1) US3607317A (da)
JP (1) JPS4834975B1 (da)
AT (1) AT313017B (da)
CH (1) CH533690A (da)
DK (1) DK139590B (da)
FR (1) FR2033925A5 (da)
GB (1) GB1263445A (da)
NL (1) NL165507C (da)
SE (1) SE366776B (da)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (da) * 1975-03-14 1981-06-25
US4082898A (en) * 1975-06-23 1978-04-04 Ppg Industries, Inc. Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates
US4171225A (en) * 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
DE2635457C2 (de) * 1976-08-04 1985-06-05 Schering AG, 1000 Berlin und 4709 Bergkamen Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
DE3121015C2 (de) * 1981-05-27 1986-12-04 Friedr. Blasberg GmbH und Co KG, 5650 Solingen Verfahren zur Aktivierung von gebeizten Oberflächen und Lösung zur Durchführung desselben
US4405663A (en) * 1982-03-29 1983-09-20 Republic Steel Corporation Tin plating bath composition and process
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
DE3239090A1 (de) * 1982-10-22 1984-04-26 Bayer Ag, 5090 Leverkusen Schwarz-metallisierte substratoberflaechen
JPS6033358A (ja) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd 無電解銅めっき液
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
DE3622090C1 (da) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2472393A (en) * 1944-09-25 1949-06-07 American Steel & Wire Co Process and bath for copper coating ferrous metal
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3246995A (en) * 1962-02-19 1966-04-19 Aerojet General Co Metal marking composition
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating

Also Published As

Publication number Publication date
DE2005032A1 (de) 1970-08-20
FR2033925A5 (da) 1970-12-04
DK139590C (da) 1979-09-03
AT313017B (de) 1974-01-25
CH533690A (de) 1973-02-15
JPS4834975B1 (da) 1973-10-25
US3607317A (en) 1971-09-21
NL7001599A (da) 1970-08-06
DE2005032B2 (de) 1975-06-12
GB1263445A (en) 1972-02-09
NL165507C (nl) 1981-04-15
SE366776B (da) 1974-05-06

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