DK141411C - - Google Patents

Info

Publication number
DK141411C
DK141411C DK53967A DK53967A DK141411C DK 141411 C DK141411 C DK 141411C DK 53967 A DK53967 A DK 53967A DK 53967 A DK53967 A DK 53967A DK 141411 C DK141411 C DK 141411C
Authority
DK
Denmark
Application number
DK53967A
Other languages
Danish (da)
Other versions
DK141411B (da
Inventor
Jr. F W Schneble
J Mccormack
R J Zeblisky
Original Assignee
Photocircuits Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corporation filed Critical Photocircuits Corporation
Publication of DK141411B publication Critical patent/DK141411B/da
Application granted granted Critical
Publication of DK141411C publication Critical patent/DK141411C/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
DK53967A 1966-02-01 1967-01-31 Bad til afsætning af metalovertræk uden ydre strømtilførsel. DK141411B (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US52386366A 1966-02-01 1966-02-01
US52390266A 1966-02-01 1966-02-01
US52386366 1966-02-01
US52390266 1966-02-01

Publications (2)

Publication Number Publication Date
DK141411B DK141411B (da) 1980-03-10
DK141411C true DK141411C (de) 1980-09-08

Family

ID=27061291

Family Applications (1)

Application Number Title Priority Date Filing Date
DK53967A DK141411B (da) 1966-02-01 1967-01-31 Bad til afsætning af metalovertræk uden ydre strømtilførsel.

Country Status (8)

Country Link
AT (1) AT289498B (de)
CH (1) CH490509A (de)
DE (1) DE1621309C2 (de)
DK (1) DK141411B (de)
ES (1) ES336275A1 (de)
FR (1) FR1509789A (de)
NL (1) NL166727C (de)
SE (1) SE384880B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE441530B (sv) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M Sett och bad for att utfora stromlos forkoppring
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US2884344A (en) * 1957-10-07 1959-04-28 Reynolds Metals Co Nickel plating

Also Published As

Publication number Publication date
AT289498B (de) 1971-04-26
DE1621309C2 (de) 1981-04-16
SE384880B (sv) 1976-05-24
NL166727C (nl) 1981-09-15
FR1509789A (fr) 1968-01-12
ES336275A1 (es) 1967-12-16
DE1621309A1 (de) 1971-06-03
NL6701526A (de) 1967-08-02
NL166727B (nl) 1981-04-15
DE1621309B2 (de) 1972-10-12
CH490509A (de) 1970-05-15
DK141411B (da) 1980-03-10

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Legal Events

Date Code Title Description
PBP Patent lapsed