DK141823B - Hæftehjælpelag til anvendelse ved strømløs metalafsætning. - Google Patents

Hæftehjælpelag til anvendelse ved strømløs metalafsætning. Download PDF

Info

Publication number: DK141823B
Authority: DK; Denmark
Prior art keywords: adhesive; auxiliary layer; diazonium; metal deposition; resin
Prior art date: 1969-03-25

Application number

DK151570AA

Other languages

Danish (da)

English (en)

Other versions

DK141823C (de

Inventor

Joseph Nicholas Polichette

Original Assignee

Photocircuits Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-03-25

Filing date

1970-03-24

Publication date

1980-06-23

1970-03-24 Application filed by Photocircuits Corp filed Critical Photocircuits Corp

1980-06-23 Publication of DK141823B publication Critical patent/DK141823B/da

1980-11-10 Application granted granted Critical

1980-11-10 Publication of DK141823C publication Critical patent/DK141823C/da

Links

230000001070 adhesive effect Effects 0.000 title description 37
239000000853 adhesive Substances 0.000 title description 32
238000001465 metallisation Methods 0.000 title description 6
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 30
239000000203 mixture Substances 0.000 description 27
239000010410 layer Substances 0.000 description 16
239000002904 solvent Substances 0.000 description 16
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 15
229910052751 metal Inorganic materials 0.000 description 15
239000002184 metal Substances 0.000 description 15
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
239000003054 catalyst Substances 0.000 description 14
238000000576 coating method Methods 0.000 description 13
229920001568 phenolic resin Polymers 0.000 description 13
239000005011 phenolic resin Substances 0.000 description 13
239000011248 coating agent Substances 0.000 description 12
CFRNDJFRRKMHTL-UHFFFAOYSA-N [3-octanoyloxy-2,2-bis(octanoyloxymethyl)propyl] octanoate Chemical compound CCCCCCCC(=O)OCC(COC(=O)CCCCCCC)(COC(=O)CCCCCCC)COC(=O)CCCCCCC CFRNDJFRRKMHTL-UHFFFAOYSA-N 0.000 description 11
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 10
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
239000003960 organic solvent Substances 0.000 description 9
229920005989 resin Polymers 0.000 description 9
239000011347 resin Substances 0.000 description 9
-1 polyvinylpyrrolidion Polymers 0.000 description 8
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
150000001875 compounds Chemical class 0.000 description 7
229910052802 copper Inorganic materials 0.000 description 7
239000010949 copper Substances 0.000 description 7
239000000463 material Substances 0.000 description 7
239000000377 silicon dioxide Substances 0.000 description 7
SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 6
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
239000002313 adhesive film Substances 0.000 description 6
NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 6
239000004020 conductor Substances 0.000 description 6
239000003822 epoxy resin Substances 0.000 description 6
238000000034 method Methods 0.000 description 6
239000000049 pigment Substances 0.000 description 6
229920000647 polyepoxide Polymers 0.000 description 6
230000003197 catalytic effect Effects 0.000 description 5
150000001989 diazonium salts Chemical class 0.000 description 5
239000000975 dye Substances 0.000 description 5
229920000642 polymer Polymers 0.000 description 5
239000000243 solution Substances 0.000 description 5
229920001187 thermosetting polymer Polymers 0.000 description 5
UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
150000002500 ions Chemical class 0.000 description 4
150000002739 metals Chemical class 0.000 description 4
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
150000001540 azides Chemical class 0.000 description 3
239000003795 chemical substances by application Substances 0.000 description 3
229920001577 copolymer Polymers 0.000 description 3
239000012954 diazonium Substances 0.000 description 3
SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 3
238000010907 mechanical stirring Methods 0.000 description 3
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
229910052763 palladium Inorganic materials 0.000 description 3
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 3
239000003504 photosensitizing agent Substances 0.000 description 3
150000003839 salts Chemical class 0.000 description 3
GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 3
UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
KGEXJTVKNZBZGS-UHFFFAOYSA-N 4-(diethylamino)-2-ethoxybenzenediazonium Chemical compound CCOC1=CC(N(CC)CC)=CC=C1[N+]#N KGEXJTVKNZBZGS-UHFFFAOYSA-N 0.000 description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
229910003771 Gold(I) chloride Inorganic materials 0.000 description 2
229920013646 Hycar Polymers 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
239000002253 acid Substances 0.000 description 2
239000003929 acidic solution Substances 0.000 description 2
239000012790 adhesive layer Substances 0.000 description 2
239000002998 adhesive polymer Substances 0.000 description 2
238000000889 atomisation Methods 0.000 description 2
244000052616 bacterial pathogen Species 0.000 description 2
XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 2
JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
IINNWAYUJNWZRM-UHFFFAOYSA-L erythrosin B Chemical compound [Na+].[Na+].[O-]C(=O)C1=CC=CC=C1C1=C2C=C(I)C(=O)C(I)=C2OC2=C(I)C([O-])=C(I)C=C21 IINNWAYUJNWZRM-UHFFFAOYSA-L 0.000 description 2
239000004174 erythrosine Substances 0.000 description 2
229940011411 erythrosine Drugs 0.000 description 2
235000012732 erythrosine Nutrition 0.000 description 2
FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
229920002681 hypalon Polymers 0.000 description 2
229910052753 mercury Inorganic materials 0.000 description 2
229910000510 noble metal Inorganic materials 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
238000005507 spraying Methods 0.000 description 2
229920002803 thermoplastic polyurethane Polymers 0.000 description 2
238000009827 uniform distribution Methods 0.000 description 2
JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
ARKQRZXCXIMZHG-UHFFFAOYSA-N 1-azido-4-[(4-azidophenyl)methyl]benzene Chemical compound C1=CC(N=[N+]=[N-])=CC=C1CC1=CC=C(N=[N+]=[N-])C=C1 ARKQRZXCXIMZHG-UHFFFAOYSA-N 0.000 description 1
XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
VPMZFRCOUNREJJ-UHFFFAOYSA-N 4-(ethylamino)-3-methylbenzenediazonium Chemical compound CCNC1=CC=C([N+]#N)C=C1C VPMZFRCOUNREJJ-UHFFFAOYSA-N 0.000 description 1
GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
RGCKGOZRHPZPFP-UHFFFAOYSA-N Alizarin Natural products C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 1
QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
HYBBIBNJHNGZAN-UHFFFAOYSA-N Furaldehyde Natural products O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 1
229920000877 Melamine resin Polymers 0.000 description 1
FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
229920000459 Nitrile rubber Polymers 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
239000004372 Polyvinyl alcohol Substances 0.000 description 1
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
SHOKWSLXDAIZPP-UHFFFAOYSA-N [4-(4-iodooxy-2-methyl-5-propan-2-ylphenyl)-5-methyl-2-propan-2-ylphenyl] hypoiodite Chemical compound C1=C(OI)C(C(C)C)=CC(C=2C(=CC(OI)=C(C(C)C)C=2)C)=C1C SHOKWSLXDAIZPP-UHFFFAOYSA-N 0.000 description 1
HWEONUWVYWIJPF-UHFFFAOYSA-N [[4-[2-(4-diazonioiminocyclohexa-2,5-dien-1-ylidene)ethylidene]cyclohexa-2,5-dien-1-ylidene]hydrazinylidene]azanide Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C=CC1=CC=C(N=[N+]=[N-])C=C1 HWEONUWVYWIJPF-UHFFFAOYSA-N 0.000 description 1
150000001242 acetic acid derivatives Chemical class 0.000 description 1
KVXNKFYSHAUJIA-UHFFFAOYSA-N acetic acid;ethoxyethane Chemical compound CC(O)=O.CCOCC KVXNKFYSHAUJIA-UHFFFAOYSA-N 0.000 description 1
XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
239000013543 active substance Substances 0.000 description 1
239000004840 adhesive resin Substances 0.000 description 1
229920006223 adhesive resin Polymers 0.000 description 1
JROURLWMOZCGJV-UHFFFAOYSA-N alizarin blue Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C1=CC=CN=C1C(O)=C2O JROURLWMOZCGJV-UHFFFAOYSA-N 0.000 description 1
HFVAFDPGUJEFBQ-UHFFFAOYSA-M alizarin red S Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=C(S([O-])(=O)=O)C(O)=C2O HFVAFDPGUJEFBQ-UHFFFAOYSA-M 0.000 description 1
CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
229940063655 aluminum stearate Drugs 0.000 description 1
125000000129 anionic group Chemical group 0.000 description 1
PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
150000004056 anthraquinones Chemical class 0.000 description 1
229920005601 base polymer Polymers 0.000 description 1
CHFBCXOSLARLKB-UHFFFAOYSA-N bis(4-azidophenyl)methanone Chemical compound C1=CC(N=[N+]=[N-])=CC=C1C(=O)C1=CC=C(N=[N+]=[N-])C=C1 CHFBCXOSLARLKB-UHFFFAOYSA-N 0.000 description 1
QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
150000003842 bromide salts Chemical class 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
SXYCCJAPZKHOLS-UHFFFAOYSA-N chembl2008674 Chemical compound [O-][N+](=O)C1=CC=C2C(N=NC3=C4C=CC=CC4=CC=C3O)=C(O)C=C(S(O)(=O)=O)C2=C1 SXYCCJAPZKHOLS-UHFFFAOYSA-N 0.000 description 1
150000001805 chlorine compounds Chemical class 0.000 description 1
239000011247 coating layer Substances 0.000 description 1
229910017052 cobalt Inorganic materials 0.000 description 1
239000010941 cobalt Substances 0.000 description 1
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
239000000084 colloidal system Substances 0.000 description 1
238000000151 deposition Methods 0.000 description 1
SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical class [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
238000004090 dissolution Methods 0.000 description 1
238000009826 distribution Methods 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
239000000806 elastomer Substances 0.000 description 1
230000005611 electricity Effects 0.000 description 1
150000002148 esters Chemical class 0.000 description 1
125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
230000000763 evoking effect Effects 0.000 description 1
239000004744 fabric Substances 0.000 description 1
239000000945 filler Substances 0.000 description 1
150000002222 fluorine compounds Chemical class 0.000 description 1
IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
HDNHWROHHSBKJG-UHFFFAOYSA-N formaldehyde;furan-2-ylmethanol Chemical compound O=C.OCC1=CC=CO1 HDNHWROHHSBKJG-UHFFFAOYSA-N 0.000 description 1
239000007849 furan resin Substances 0.000 description 1
238000005286 illumination Methods 0.000 description 1
230000001939 inductive effect Effects 0.000 description 1
150000004694 iodide salts Chemical class 0.000 description 1
150000002503 iridium Chemical class 0.000 description 1
229910052741 iridium Inorganic materials 0.000 description 1
GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
229940008718 metallic mercury Drugs 0.000 description 1
NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 1
229920003052 natural elastomer Polymers 0.000 description 1
229920001194 natural rubber Polymers 0.000 description 1
150000002823 nitrates Chemical class 0.000 description 1
229920000620 organic polymer Polymers 0.000 description 1
125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
239000002245 particle Substances 0.000 description 1
230000000737 periodic effect Effects 0.000 description 1
230000002165 photosensitisation Effects 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
229920002689 polyvinyl acetate Polymers 0.000 description 1
239000011118 polyvinyl acetate Substances 0.000 description 1
229920002451 polyvinyl alcohol Polymers 0.000 description 1
239000000843 powder Substances 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
239000000047 product Substances 0.000 description 1
230000001698 pyrogenic effect Effects 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
229910052703 rhodium Inorganic materials 0.000 description 1
239000010948 rhodium Substances 0.000 description 1
MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
230000001235 sensitizing effect Effects 0.000 description 1
229910000077 silane Inorganic materials 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
239000011780 sodium chloride Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
229940071182 stannate Drugs 0.000 description 1
PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
235000021286 stilbenes Nutrition 0.000 description 1
238000003756 stirring Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
229920003051 synthetic elastomer Polymers 0.000 description 1
239000005061 synthetic rubber Substances 0.000 description 1
239000004634 thermosetting polymer Substances 0.000 description 1
HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
XOSXWYQMOYSSKB-LDKJGXKFSA-L water blue Chemical compound CC1=CC(/C(\C(C=C2)=CC=C2NC(C=C2)=CC=C2S([O-])(=O)=O)=C(\C=C2)/C=C/C\2=N\C(C=C2)=CC=C2S([O-])(=O)=O)=CC(S(O)(=O)=O)=C1N.[Na+].[Na+] XOSXWYQMOYSSKB-LDKJGXKFSA-L 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1
229910052724 xenon Inorganic materials 0.000 description 1
FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
235000005074 zinc chloride Nutrition 0.000 description 1
239000011592 zinc chloride Substances 0.000 description 1
NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/52—Compositions containing diazo compounds as photosensitive substances
- G03C1/62—Metal compounds reducible to metal
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/695—Compositions containing azides as the photosensitive substances
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/04—Chromates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Organic Chemistry (AREA)
Materials Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing & Machinery (AREA)
Ceramic Engineering (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Adhesives Or Adhesive Processes (AREA)
Manufacturing Of Printed Wiring (AREA)
Chemically Coating (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Compositions Of Macromolecular Compounds (AREA)

DK151570AA 1969-03-25 1970-03-24 Hæftehjælpelag til anvendelse ved strømløs metalafsætning. DK141823B (da)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US81037869A	1969-03-25	1969-03-25
US81037869		1969-03-25

Publications (2)

Publication Number	Publication Date
DK141823B true DK141823B (da)	1980-06-23
DK141823C DK141823C (de)	1980-11-10

Family

ID=25203717

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK151570AA DK141823B (da)	1969-03-25	1970-03-24	Hæftehjælpelag til anvendelse ved strømløs metalafsætning.

Country Status (11)

Country	Link
US (1)	US3779758A (de)
JP (1)	JPS5040221B1 (de)
AT (1)	AT307846B (de)
CA (1)	CA958936A (de)
CH (1)	CH549098A (de)
DE (1)	DE2014737B2 (de)
DK (1)	DK141823B (de)
FR (1)	FR2039963A5 (de)
GB (1)	GB1310580A (de)
NL (1)	NL167032C (de)
SE (1)	SE372351B (de)

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US3900320A (en) *	1971-09-30	1975-08-19	Bell & Howell Co	Activation method for electroless plating
JPS5525418B2 (de) *	1972-12-20	1980-07-05
US3887373A (en) *	1973-04-11	1975-06-03	Motorola Inc	Non-polluting photoresist developing process
DE2411869C3 (de) *	1974-03-12	1982-07-08	Standard Elektrik Lorenz Ag, 7000 Stuttgart	Photochemisches System zur Beschichtung des Leuchtschirmes von Farbfernsehröhren
US3928670A (en) *	1974-09-23	1975-12-23	Amp Inc	Selective plating on non-metallic surfaces
US4191573A (en) *	1974-10-09	1980-03-04	Fuji Photo Film Co., Ltd.	Photosensitive positive image forming process with two photo-sensitive layers
US4107351A (en) *	1976-10-15	1978-08-15	Rca Corporation	Method of depositing or repairing a patterned metal layer on a substrate
US4216246A (en) *	1977-05-14	1980-08-05	Hitachi Chemical Company, Ltd.	Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards
US4388351A (en) *	1979-08-20	1983-06-14	Western Electric Company, Inc.	Methods of forming a patterned metal film on a support
DK427780A (da) *	1980-10-10	1982-04-11	Neselco As	Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3130159C2 (de) *	1981-07-30	1987-02-05	Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt	Verfahren zur Herstellung von Leiterplatten
EP0089221A1 (de) *	1982-03-15	1983-09-21	EASTMAN KODAK COMPANY (a New Jersey corporation)	Elektrographisches Verfahren zur Herstellung leitender Schaltungsmuster und auf diese Weise hergestellte Leiterplatten
US4666735A (en) *	1983-04-15	1987-05-19	Polyonics Corporation	Process for producing product having patterned metal layer
US4555414A (en) *	1983-04-15	1985-11-26	Polyonics Corporation	Process for producing composite product having patterned metal layer
JPS62102241A (ja) *	1985-10-30	1987-05-12	Tokyo Ohka Kogyo Co Ltd	感光性組成物
US4910072A (en) *	1986-11-07	1990-03-20	Monsanto Company	Selective catalytic activation of polymeric films
US5075037A (en) *	1986-11-07	1991-12-24	Monsanto Company	Selective catalytic activation of polymeric films
US4851159A (en) *	1988-05-02	1989-07-25	Monsanto Company	Process for the preparation of N- phosphonomethylglycine
US5650261A (en) *	1989-10-27	1997-07-22	Rohm And Haas Company	Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system
US5506091A (en) *	1990-04-20	1996-04-09	Nisshinbo Industries, Inc.	Photosensitive resin composition and method of forming conductive pattern
US5631753A (en) *	1991-06-28	1997-05-20	Dai Nippon Printing Co., Ltd.	Black matrix base board and manufacturing method therefor, and liquid crystal display panel and manufacturing method therefor
US5532105A (en) *	1992-08-07	1996-07-02	Hitachi Chemical Company, Ltd.	Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board
ZA962880B (en) *	1995-04-12	1997-03-17	Procter & Gamble	A pharmaceutical composition for inhibiting the growth of viruses and cancers
US5665713A (en) *	1995-04-12	1997-09-09	Procter & Gamble Company	Pharmaceutical composition for inhibiting the growth of viruses and cancers
AU2001264832A1 (en) *	2000-05-23	2001-12-03	Aprilis, Inc.	Data storage medium comprising colloidal metal and preparation process thereof
CN103176365A (zh) *	2011-12-22	2013-06-26	深圳富泰宏精密工业有限公司	菲林及其制作方法，应用该菲林进行遮蔽的方法
FR3064010B1 (fr) *	2017-03-14	2022-11-18	Commissariat Energie Atomique	Solution de precurseur pour former une couche d’oxyde metallique et procede de revetement d’un substrat par une couche d’oxyde metallique

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BE407603A (de) *	1930-02-05
US2501874A (en) *	1946-06-12	1950-03-28	Gen Aniline & Film Corp	Photographic diazo-sensitized glassine paper
NL76649C (de) *	1949-04-09
US3406068A (en) *	1951-07-30	1968-10-15	Rca Corp	Photographic methods of making electron-sensitive mosaic screens
US2695846A (en) *	1952-11-04	1954-11-30	Powers Chemco Inc	Developing of diazo and azide sensitized colloids
US2914404A (en) *	1953-07-31	1959-11-24	Blaupunkt Werke Gmbh	Method of producing two-dimensional circuits or circuit elements on supporting bases
US2852379A (en) *	1955-05-04	1958-09-16	Eastman Kodak Co	Azide resin photolithographic composition
US3006819A (en) *	1955-06-13	1961-10-31	Sanders Associates Inc	Method of photo-plating electrical circuits
US2996380A (en) *	1957-10-08	1961-08-15	Sylvania Electric Prod	Method of fabricating image display screens
NL113853C (de) *	1959-07-22
US3222173A (en) *	1961-05-15	1965-12-07	Vitramon Inc	Method of making an electrical unit
NL287857A (de) *	1962-01-27
US3259559A (en) *	1962-08-22	1966-07-05	Day Company	Method for electroless copper plating
BE637058A (de) *	1962-09-07
US3316092A (en) *	1963-05-09	1967-04-25	Dietzgen Co Eugene	Diazotype material comprising a metal sulfate nitrogenous compound and polymeric anhydride
US3326686A (en) *	1963-05-31	1967-06-20	Gen Aniline & Film Corp	Light-sensitive two-component diazotype materials adapted for heat development
US3469984A (en) *	1965-05-17	1969-09-30	Addressograph Multigraph	Heat-sensitive diazotype materials
DE1572155A1 (de) *	1965-08-10	1970-01-02	Dr Eduard Roell	Licht-bzw.strahlungsempfindliches Material und Verfahren zu dessen Herstellung
US3458313A (en) *	1966-09-07	1969-07-29	Nasa	High resolution developing of photosensitive resists

1969
- 1969-03-25 US US00810378A patent/US3779758A/en not_active Expired - Lifetime
- 1969-11-07 CA CA066,978A patent/CA958936A/en not_active Expired
- 1969-12-08 JP JP44098584A patent/JPS5040221B1/ja active Pending
1970
- 1970-03-20 DE DE2014737A patent/DE2014737B2/de not_active Ceased
- 1970-03-20 GB GB1351970A patent/GB1310580A/en not_active Expired
- 1970-03-23 CH CH435270A patent/CH549098A/de not_active IP Right Cessation
- 1970-03-23 SE SE7003948A patent/SE372351B/xx unknown
- 1970-03-24 AT AT272370A patent/AT307846B/de not_active IP Right Cessation
- 1970-03-24 DK DK151570AA patent/DK141823B/da not_active IP Right Cessation
- 1970-03-25 NL NL7004323.A patent/NL167032C/xx not_active IP Right Cessation
- 1970-03-25 FR FR7010711A patent/FR2039963A5/fr not_active Expired

Also Published As

Publication number	Publication date
NL167032B (nl)	1981-05-15
CA958936A (en)	1974-12-10
FR2039963A5 (de)	1971-01-15
NL7004323A (de)	1970-09-29
DE2014737A1 (de)	1970-10-01
AT307846B (de)	1973-06-12
DE2014737B2 (de)	1975-03-06
DK141823C (de)	1980-11-10
GB1310580A (en)	1973-03-21
SE372351B (de)	1974-12-16
CH549098A (de)	1974-05-15
NL167032C (nl)	1981-10-15
JPS5040221B1 (de)	1975-12-23
US3779758A (en)	1973-12-18

Legal Events

Date	Code	Title	Description
1988-03-07	PBP	Patent lapsed

Publication	Publication Date	Title
US3708296A (en)	1973-01-02	Photopolymerization of epoxy monomers
US3046110A (en)	1962-07-24	Process of making printing plates and light sensitive material suitable for use therein
US4882245A (en)	1989-11-21	Photoresist composition and printed circuit boards and packages made therewith
US3536489A (en)	1970-10-27	Heterocyclic iminoaromatic-halogen containing photoinitiator light sensitive compositions
US3097097A (en)	1963-07-09	Photo degrading of gel systems and photographic production of reliefs therewith
US3779758A (en)	1973-12-18	Photosensitive process for producing printed circuits employing electroless deposition
DK146780B (da)	1984-01-02	Fremgangsmaade til additiv fremstilling af ved metaludskillelse frembragte moenstre
HK99787A (en)	1987-12-31	Process for producing relief images
US3652272A (en)	1972-03-28	Phenoxy photopolymer having no epoxy groups, and article made therefrom
US3493371A (en)	1970-02-03	Radiation-sensitive recording material
JPH03167249A (ja)	1991-07-19	陽画作用フォトレジスト組成物
JPS62192584A (ja)	1987-08-24	錯体を含むポリマ−及びポリマ−表面の活性化法、基材への金属付着法及び基材表面への金属原型又は導電パタ−ンの形成方法
JPS60206085A (ja)	1985-10-17	プリント回路板の製造法
US3547629A (en)	1970-12-15	Photoflash method of transferring information and fabricating printed circuits
CA1289803C (en)	1991-10-01	Photoresist composition and printed circuit boards and packages made therewith
JPS64687B2 (de)	1989-01-09
JP3993692B2 (ja)	2007-10-17	レジストパターン形成方法
US2916376A (en)	1959-12-08	Light sensitive coating composition
EP2185976B1 (de)	2013-04-24	Lichtempfindliche zusammensetzungen mit polyvinylalkohol und ihre verwendung für druckverfahren
US3288608A (en)	1966-11-29	Light-sensitive coating for pre-sensitized plates intended for offset printing and for engraved wiring of printed circuits
US3050388A (en)	1962-08-21	Presensitized printing plates and method for the production thereof
US3748190A (en)	1973-07-24	Laminated aluminum article and method
JPS63133598A (ja)	1988-06-06	フォトイメージングによって形成された誘電層
JPS5915246A (ja)	1984-01-26	感光性組成物及びパタ−ン形成法
TW479447B (en)	2002-03-11	Laminate for pattern formation