DK1453654T3 - Indretning til bearbejdning af en tredimensional struktur i et substrat - Google Patents

Indretning til bearbejdning af en tredimensional struktur i et substrat

Info

Publication number
DK1453654T3
DK1453654T3 DK02803341T DK02803341T DK1453654T3 DK 1453654 T3 DK1453654 T3 DK 1453654T3 DK 02803341 T DK02803341 T DK 02803341T DK 02803341 T DK02803341 T DK 02803341T DK 1453654 T3 DK1453654 T3 DK 1453654T3
Authority
DK
Denmark
Prior art keywords
substrate
plan
machining
dimensional structure
flexible force
Prior art date
Application number
DK02803341T
Other languages
English (en)
Inventor
Jesper Tidemann
Esad Zubcevic
Original Assignee
Glud & Marstrand As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Glud & Marstrand As filed Critical Glud & Marstrand As
Application granted granted Critical
Publication of DK1453654T3 publication Critical patent/DK1453654T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/0004—Machines or apparatus for embossing decorations or marks, e.g. embossing coins characterised by the movement of the embossing tool(s), or the movement of the work, during the embossing operation
    • B44B5/0009—Rotating embossing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts

Landscapes

  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Machines For Manufacturing Corrugated Board In Mechanical Paper-Making Processes (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Types And Forms Of Lifts (AREA)
  • Micromachines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
DK02803341T 2001-11-23 2002-11-22 Indretning til bearbejdning af en tredimensional struktur i et substrat DK1453654T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33198901P 2001-11-23 2001-11-23

Publications (1)

Publication Number Publication Date
DK1453654T3 true DK1453654T3 (da) 2006-08-14

Family

ID=23296213

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02803341T DK1453654T3 (da) 2001-11-23 2002-11-22 Indretning til bearbejdning af en tredimensional struktur i et substrat

Country Status (10)

Country Link
EP (1) EP1453654B1 (da)
JP (1) JP2005509544A (da)
CN (1) CN100417512C (da)
AT (1) ATE323586T1 (da)
AU (1) AU2002366211A1 (da)
BR (1) BR0214360A (da)
DE (1) DE60210814T2 (da)
DK (1) DK1453654T3 (da)
RU (1) RU2297915C2 (da)
WO (1) WO2003043801A1 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007085044A1 (en) * 2006-01-24 2007-08-02 Mycrolab Pty Ltd Stamping methods and devices
DE102007060613A1 (de) * 2007-12-13 2009-06-18 Heidelberger Druckmaschinen Ag Rotationsprägeeinrichtung
KR101341883B1 (ko) * 2009-08-07 2013-12-16 효고껭 몰드 고정용 점착 시트, 몰드 고정용 점착 테이프, 및 미세구조의 제조방법
GB2484267A (en) * 2010-10-01 2012-04-11 Concepts For Success Ultrasonic welding using helical anvil
CN102101232B (zh) * 2010-11-17 2013-01-23 江苏大学 一种在晶态镁合金表面制作微纳结构的方法
CN102069588B (zh) * 2010-12-30 2013-03-27 郑州乐达实业有限公司 减震胶板定型机
DE102013206043A1 (de) * 2013-04-05 2014-10-09 Bayerische Motoren Werke Aktiengesellschaft Verfahren zur Herstellung eines Bauteils mit Hologramm
CN109926489B (zh) * 2018-10-12 2021-02-26 万向钱潮股份有限公司 一种基于双排排样方案的冲压落料装置及其操作方法
FR3123822B1 (fr) 2021-06-15 2024-05-10 Coatec Pack En Abrege Ctp Modification structurelle et visuelle d’un polymere par un embossage a chaud

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1139805A (en) * 1965-02-17 1969-01-15 Samco Strong Ltd Improvements in or relating to the pressure-moulding of articles
US3743463A (en) * 1970-09-21 1973-07-03 Union Carbide Corp Mold construction having thermal baffle for molding articles without distortion such as plastic printing plates and the like
US4116594A (en) * 1975-12-12 1978-09-26 Magna-Graphics Corporation Embossing apparatus having magnetic roller and flexible embossing plates therefor
FR2430057A1 (fr) * 1978-06-29 1980-01-25 Thomson Csf Dispositif de pressage de disques souples et procede de pressage mettant en oeuvre un tel dispositif
JPS5624116A (en) * 1979-08-07 1981-03-07 Shinsei Kogyo Kk Stamping impulse type heat sealer
JPS60141339A (ja) * 1983-12-28 1985-07-26 Nissan Motor Co Ltd 逆絞りプレス装置
FR2744113B1 (fr) * 1996-01-31 1998-04-24 Corning Inc Procede et dispositif de fabrication de reseaux de microlentilles
DE69930156T2 (de) * 1998-12-30 2006-11-02 Glud & Marstrand A/S Replikationsverfahren für ein oberflächen-relief und ein produkt mit einem reliefdruck

Also Published As

Publication number Publication date
DE60210814T2 (de) 2006-11-30
CN100417512C (zh) 2008-09-10
ATE323586T1 (de) 2006-05-15
DE60210814D1 (de) 2006-05-24
BR0214360A (pt) 2004-10-26
RU2004118843A (ru) 2005-05-10
AU2002366211A1 (en) 2003-06-10
WO2003043801A1 (en) 2003-05-30
EP1453654B1 (en) 2006-04-19
JP2005509544A (ja) 2005-04-14
RU2297915C2 (ru) 2007-04-27
CN1608002A (zh) 2005-04-20
EP1453654A1 (en) 2004-09-08

Similar Documents

Publication Publication Date Title
DK1241930T3 (da) Klæbende mikrostruktur og fremgangsmåde til fremstilling af samme
WO2005096751A3 (en) Microfluidic connections
DE60134760D1 (de) Stabilisierte flüssige zusammensetzungen
DK1453654T3 (da) Indretning til bearbejdning af en tredimensional struktur i et substrat
DK1192657T3 (da) Fremgangsmåde til underinddeling af en wafer
EP2025466A3 (en) Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method
TW200519445A (en) Apparatus for manipulation of an optical element
NO20034883L (no) Anordning for demping av vibrasjoner og utboyning av verktoy og/eller arbeidsstykker
TW200721421A (en) Semiconductor structure and method of assembly
WO2002088859A3 (en) System and method for scheduling the movement of wafers in a wafer-processing tool
DE60226185D1 (de) Bistabile, ausdehnbare Vorrichtung und Verfahren zum Ausdehnen einer solchen Vorrichtung
DE59913197D1 (de) Virtuelles Teach-In-System
WO2003034490A3 (en) Semiconductor structure with one or more through-holes
ATE517173T1 (de) Verfahren für elektronischen, homogenen zusammenbau und herstellung von gegenständen
WO2008032128A8 (en) Bonding technique
WO2003060564A3 (en) Three dimensional engineering of planar optical structures
DE50206324D1 (de) Verfahren und vorrichtung zum befestigen einer führungsschiene
AU2002356627A1 (en) Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
SE0202205D0 (sv) Fästanordning
ATE438540T1 (de) Befestigungsvorrichtung für eine leitung
WO2005059674A3 (en) System and method for functional elements
ATE529216T1 (de) Vorrichtung zur befestigung von insbesondere flächigen werkstücken mit einer befestigungsfläche
DE502006002782D1 (de) Verfahren zur sanierung eines befahrbaren bauwerks
FI20021531A7 (fi) Muurausmenetelmä
ATE427282T1 (de) Mikromechanische komponente mit aktiven elementen und verfahren zur herstellung einer komponente dieser art