DK1455391T3 - Effekthalvledermodul med fölerkomponent - Google Patents

Effekthalvledermodul med fölerkomponent

Info

Publication number
DK1455391T3
DK1455391T3 DK04003562T DK04003562T DK1455391T3 DK 1455391 T3 DK1455391 T3 DK 1455391T3 DK 04003562 T DK04003562 T DK 04003562T DK 04003562 T DK04003562 T DK 04003562T DK 1455391 T3 DK1455391 T3 DK 1455391T3
Authority
DK
Denmark
Prior art keywords
power semiconductor
semiconductor module
follower component
sensor
base plate
Prior art date
Application number
DK04003562T
Other languages
English (en)
Inventor
Thomas Dr Stockmeier
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1455391T3 publication Critical patent/DK1455391T3/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Fluid Pressure (AREA)
DK04003562T 2003-03-04 2004-02-18 Effekthalvledermodul med fölerkomponent DK1455391T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10309302A DE10309302B4 (de) 2003-03-04 2003-03-04 Leistungshalbleitermodul mit Sensorbauteil

Publications (1)

Publication Number Publication Date
DK1455391T3 true DK1455391T3 (da) 2007-07-30

Family

ID=32797792

Family Applications (1)

Application Number Title Priority Date Filing Date
DK04003562T DK1455391T3 (da) 2003-03-04 2004-02-18 Effekthalvledermodul med fölerkomponent

Country Status (5)

Country Link
EP (1) EP1455391B1 (da)
AT (1) ATE357741T1 (da)
DE (2) DE10309302B4 (da)
DK (1) DK1455391T3 (da)
ES (1) ES2282745T3 (da)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
DE102007044143A1 (de) * 2007-09-18 2009-04-02 Behr-Hella Thermocontrol Gmbh Vorrichtung zur Ansteuerung eines elektrischen Verbrauchers, insbesondere eines Gebläsemotors
DE102009024385B4 (de) * 2009-06-09 2011-03-17 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung eines Leistungshalbleitermoduls und Leistungshalbleitermodul mit einer Verbindungseinrichtung
JP5517988B2 (ja) * 2011-04-22 2014-06-11 日立オートモティブシステムズ株式会社 エンジン始動装置
DE102012013741B4 (de) 2011-08-02 2026-07-30 Sew-Eurodrive Gmbh & Co Kg Anordnung zum Kühlen, Elektrogerät und Verwendung einer Anordnung zum Kühlen
EP2989658B1 (en) 2013-04-26 2016-11-23 ABB Schweiz AG Power semiconductor module
DE102013223430A1 (de) * 2013-11-18 2015-05-21 BSH Hausgeräte GmbH Vorrichtung mit einem Leistungselektronikmodul zum Versorgen eines elektrischen Verbrauchers eines Haushaltsgeräts mit elektrischer Versorgungsspannung, Haushaltsgerät und Verfahren zum Herstellen einer derartigen Vorrichtung
KR102787083B1 (ko) * 2019-01-10 2025-03-26 울프스피드 인코포레이티드 전력 장치를 병렬화하기 위한 낮은 인덕턴스와 빠른 스위칭을 갖는 고전력 다층 모듈
JP7380062B2 (ja) * 2019-10-18 2023-11-15 富士電機株式会社 半導体モジュール
EP4340014A1 (de) * 2022-09-15 2024-03-20 Siemens Aktiengesellschaft Anordnung mit mindestens einem passiven bauelement

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148523A (ja) * 1995-11-21 1997-06-06 Toshiba Corp 半導体装置
DE19630902B4 (de) * 1996-08-01 2005-07-14 Ixys Semiconductor Gmbh Einrichtung zur Temperaturüberwachung in einer leistungselektronischen Anordnung
DE19745040C2 (de) * 1997-02-10 2003-03-27 Daimler Chrysler Ag Anordnung und Verfahren zum Messen einer Temperatur
KR100268665B1 (ko) * 1997-06-27 2000-10-16 윤종용 휴대용통신단말기의액정표시기(lcd)를인쇄회로기판(pcb)에실장시키는방법및장치
GB2337121B (en) * 1998-05-09 2002-07-31 Motorola Ltd Temperature estimation arrangement and method
DE10024516B4 (de) * 2000-05-18 2006-03-09 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Leistungshalbleitermodul
WO2002054489A2 (en) * 2000-12-29 2002-07-11 Advanced Micro Devices, Inc. Temperature measurement system and method

Also Published As

Publication number Publication date
DE10309302B4 (de) 2007-09-27
DE502004003250D1 (de) 2007-05-03
EP1455391A1 (de) 2004-09-08
ATE357741T1 (de) 2007-04-15
DE10309302A1 (de) 2004-09-30
ES2282745T3 (es) 2007-10-16
EP1455391B1 (de) 2007-03-21

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