DK1481110T3 - Belægning bestående af en gettermetal-legering og en indretning og fremgangsmåde til fremstilling af denne - Google Patents

Belægning bestående af en gettermetal-legering og en indretning og fremgangsmåde til fremstilling af denne

Info

Publication number
DK1481110T3
DK1481110T3 DK03714759T DK03714759T DK1481110T3 DK 1481110 T3 DK1481110 T3 DK 1481110T3 DK 03714759 T DK03714759 T DK 03714759T DK 03714759 T DK03714759 T DK 03714759T DK 1481110 T3 DK1481110 T3 DK 1481110T3
Authority
DK
Denmark
Prior art keywords
metal alloy
getter metal
vacuum vessel
coating
making
Prior art date
Application number
DK03714759T
Other languages
English (en)
Inventor
Hartmut Reich-Sprenger
Original Assignee
Schwerionenforsch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schwerionenforsch Gmbh filed Critical Schwerionenforsch Gmbh
Application granted granted Critical
Publication of DK1481110T3 publication Critical patent/DK1481110T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12819—Group VB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Physical Vapour Deposition (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Plasma Technology (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Laminated Bodies (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
  • Coating By Spraying Or Casting (AREA)
DK03714759T 2002-03-05 2003-02-27 Belægning bestående af en gettermetal-legering og en indretning og fremgangsmåde til fremstilling af denne DK1481110T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10209423A DE10209423A1 (de) 2002-03-05 2002-03-05 Beschichtung aus einer Gettermetall-Legierung sowie Anordnung und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
DK1481110T3 true DK1481110T3 (da) 2006-04-18

Family

ID=27762646

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03714759T DK1481110T3 (da) 2002-03-05 2003-02-27 Belægning bestående af en gettermetal-legering og en indretning og fremgangsmåde til fremstilling af denne

Country Status (9)

Country Link
US (1) US7871679B2 (da)
EP (1) EP1481110B1 (da)
JP (1) JP4274947B2 (da)
AT (1) ATE312210T1 (da)
AU (1) AU2003219001A1 (da)
DE (2) DE10209423A1 (da)
DK (1) DK1481110T3 (da)
RU (1) RU2315819C2 (da)
WO (1) WO2003074753A1 (da)

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DE10209423A1 (de) 2002-03-05 2003-09-18 Schwerionenforsch Gmbh Beschichtung aus einer Gettermetall-Legierung sowie Anordnung und Verfahren zur Herstellung derselben
US7626135B2 (en) * 2006-05-10 2009-12-01 Sub-One Technology, Inc. Electrode systems and methods of using electrodes
ITTO20070704A1 (it) * 2007-10-05 2009-04-06 Create New Technology S R L Sistema e metodo di placcatura di leghe metalliche mediante tecnologia galvanica
DE102015101315B3 (de) * 2015-01-29 2016-04-21 Inp Greifswald E.V. Plasmabehandlungsgerät und Verfahren zur Plasmabehandlung
DE102016123146A1 (de) 2016-06-03 2017-12-07 Movatec Gmbh Vakuumgerät und Verfahren zur Beschichtung von Bauteilen
US10661223B2 (en) * 2017-06-02 2020-05-26 Applied Materials, Inc. Anneal chamber with getter
DE102018111200A1 (de) * 2018-05-09 2019-11-14 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung eines wenigstens teilweise gehäusten Halbleiterwafers
RU190682U1 (ru) * 2019-04-15 2019-07-09 Общество с ограниченной ответственностью "Вакуумные системы и технологии" Высоковольтный вакуумный ввод
WO2021247879A1 (en) * 2020-06-04 2021-12-09 Purdue Research Foundation Methods for forming microscale and/or nanoscale structures on surfaces and devices including biomedical devices having surfaces with such structures
CN112169528B (zh) * 2020-09-24 2022-07-12 有研工程技术研究院有限公司 一种内加热式吸气剂片及其制备方法
CN113161215B (zh) * 2021-04-13 2024-07-23 南京华东电子真空材料有限公司 一种高可靠吸气剂热子结构及制备方法
KR102588567B1 (ko) * 2021-07-16 2023-10-16 주식회사 원익홀딩스 Zr계 게터의 표면 불순물 제거 방법
FR3128232A1 (fr) * 2021-10-14 2023-04-21 Safran Electronics & Defense Procédé de fabrication d’un élément de pompage comprenant la réalisation d’un dépôt de matériau getter par pulvérisation par faisceau d’ions
CN116575005B (zh) * 2023-05-10 2024-01-16 中国科学院近代物理研究所 一种TiZrCo真空吸气剂薄膜及其制备方法与应用
CN120006236B (zh) * 2025-04-18 2025-08-08 中国科学院近代物理研究所 钛合金内衬二极铁管道的处理方法

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Also Published As

Publication number Publication date
AU2003219001A1 (en) 2003-09-16
RU2004129588A (ru) 2005-06-10
ATE312210T1 (de) 2005-12-15
US7871679B2 (en) 2011-01-18
WO2003074753A1 (de) 2003-09-12
US20050164028A1 (en) 2005-07-28
DE10209423A1 (de) 2003-09-18
DE50301856D1 (de) 2006-01-12
RU2315819C2 (ru) 2008-01-27
EP1481110B1 (de) 2005-12-07
JP4274947B2 (ja) 2009-06-10
EP1481110A1 (de) 2004-12-01
JP2005519197A (ja) 2005-06-30

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