DK1629690T3 - En fremgangsmåde til at fremstille et bæreelement til et höreapparat og et bæreelement til et höreapparat - Google Patents

En fremgangsmåde til at fremstille et bæreelement til et höreapparat og et bæreelement til et höreapparat

Info

Publication number
DK1629690T3
DK1629690T3 DK03722304T DK03722304T DK1629690T3 DK 1629690 T3 DK1629690 T3 DK 1629690T3 DK 03722304 T DK03722304 T DK 03722304T DK 03722304 T DK03722304 T DK 03722304T DK 1629690 T3 DK1629690 T3 DK 1629690T3
Authority
DK
Denmark
Prior art keywords
hearing aid
support
substantially flat
making
gap
Prior art date
Application number
DK03722304T
Other languages
English (en)
Inventor
Morten Linkenkaer-Hansen
Original Assignee
Widex As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Widex As filed Critical Widex As
Application granted granted Critical
Publication of DK1629690T3 publication Critical patent/DK1629690T3/da

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/603—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of mechanical or electronic switches or control elements

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Battery Mounting, Suspending (AREA)
  • Push-Button Switches (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrically Operated Instructional Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)
DK03722304T 2003-05-09 2003-05-09 En fremgangsmåde til at fremstille et bæreelement til et höreapparat og et bæreelement til et höreapparat DK1629690T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DK2003/000307 WO2004100606A1 (en) 2003-05-09 2003-05-09 A method for manufacturing a carrier element for a hearing aid and a carrier element for a hearing aid

Publications (1)

Publication Number Publication Date
DK1629690T3 true DK1629690T3 (da) 2008-07-21

Family

ID=33426907

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03722304T DK1629690T3 (da) 2003-05-09 2003-05-09 En fremgangsmåde til at fremstille et bæreelement til et höreapparat og et bæreelement til et höreapparat

Country Status (10)

Country Link
US (1) US20060056648A1 (da)
EP (1) EP1629690B1 (da)
JP (1) JP4109259B2 (da)
CN (1) CN1771759B (da)
AT (1) ATE391404T1 (da)
AU (1) AU2003229527B2 (da)
CA (1) CA2524328C (da)
DE (1) DE60320148T2 (da)
DK (1) DK1629690T3 (da)
WO (1) WO2004100606A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007006088A1 (de) * 2007-02-07 2008-08-14 Biotronik Crm Patent Ag Kontaktmodul für ein medizinisches Implantat
DE102007008551A1 (de) * 2007-02-21 2008-09-04 Siemens Audiologische Technik Gmbh Hörvorrichtung mit magnetisch befestigtem Batteriefach
DE102008044642A1 (de) * 2008-08-27 2010-03-04 Siemens Medical Instruments Pte. Ltd. Elektrische Schaltung, elektrisches Kleingerät, insbesondere ein Hörgerät, mit der elektrischen Schaltung und Verwendung der elektrischen Schaltung zu Herstellung des elektrischen Kleingeräts
AU335458S (en) * 2010-08-24 2011-03-17 Oticon As Hearing aid
JP5622623B2 (ja) * 2011-03-17 2014-11-12 矢崎総業株式会社 モジュールの端子構造
DE102011082193A1 (de) * 2011-09-06 2012-09-20 Siemens Medical Instruments Pte. Ltd. Modulares Kontaktbauteil für eine Hörvorrichtung
USD1022214S1 (en) * 2023-03-01 2024-04-09 Sonova Ag Hearing aid

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8328734U1 (de) * 1983-10-05 1986-02-13 Siemens AG, 1000 Berlin und 8000 München Hörgerät
AT391047B (de) * 1987-06-26 1990-08-10 Siemens Ag Hoergeraet mit einer leiterplatte und einer hoerspule
US5440082A (en) * 1991-09-19 1995-08-08 U.S. Philips Corporation Method of manufacturing an in-the-ear hearing aid, auxiliary tool for use in the method, and ear mould and hearing aid manufactured in accordance with the method
US5246388A (en) * 1992-06-30 1993-09-21 Amp Incorporated Electrical over stress device and connector
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.
DE69419219T2 (de) * 1993-09-03 2000-01-05 Kabushiki Kaisha Toshiba, Kawasaki Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten
US5701348A (en) * 1994-12-29 1997-12-23 Decibel Instruments, Inc. Articulated hearing device
US6143989A (en) * 1995-07-20 2000-11-07 The Regents Of The University Of California Active alignment/contact verification system
RU2156521C2 (ru) * 1996-05-17 2000-09-20 Сименс Акциенгезелльшафт Несущий элемент для полупроводниковой микросхемы
JP3026426B2 (ja) * 1996-08-29 2000-03-27 沖電気工業株式会社 樹脂封止型半導体装置とその製造方法及びその金型構造
US6072228A (en) * 1996-10-25 2000-06-06 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
JP3638750B2 (ja) * 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
US6203212B1 (en) * 1998-08-24 2001-03-20 Agilent Technologies, Inc. Optical subassembly for use in fiber optic data transmission and reception
GB9907050D0 (en) * 1999-03-26 1999-05-19 Sonomax Sft Inc System for fitting a hearing device in the ear
US6236300B1 (en) * 1999-03-26 2001-05-22 R. Sjhon Minners Bistable micro-switch and method of manufacturing the same
US6456720B1 (en) * 1999-12-10 2002-09-24 Sonic Innovations Flexible circuit board assembly for a hearing aid
US6533062B1 (en) * 2000-09-25 2003-03-18 Phonak Ag Production process for custom-moulded ear-plug devices
US6617518B2 (en) * 2001-11-02 2003-09-09 Jds Uniphase Corporaton Enhanced flex cable

Also Published As

Publication number Publication date
JP4109259B2 (ja) 2008-07-02
WO2004100606A1 (en) 2004-11-18
CA2524328C (en) 2011-01-04
DE60320148T2 (de) 2009-05-20
CN1771759B (zh) 2011-08-03
JP2006514804A (ja) 2006-05-11
EP1629690A1 (en) 2006-03-01
ATE391404T1 (de) 2008-04-15
CN1771759A (zh) 2006-05-10
EP1629690B1 (en) 2008-04-02
AU2003229527B2 (en) 2008-09-11
CA2524328A1 (en) 2004-11-18
DE60320148D1 (de) 2008-05-15
US20060056648A1 (en) 2006-03-16
AU2003229527A1 (en) 2004-11-26

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