DK165074C - Proeve med gennempletterede huller, til brug ved mikroskopundersoegelse, samt fremgangsmaade ved tilvirkning af en saadan proeve - Google Patents

Proeve med gennempletterede huller, til brug ved mikroskopundersoegelse, samt fremgangsmaade ved tilvirkning af en saadan proeve

Info

Publication number
DK165074C
DK165074C DK632887A DK632887A DK165074C DK 165074 C DK165074 C DK 165074C DK 632887 A DK632887 A DK 632887A DK 632887 A DK632887 A DK 632887A DK 165074 C DK165074 C DK 165074C
Authority
DK
Denmark
Prior art keywords
sample
sampling
procedures
implemented
holes
Prior art date
Application number
DK632887A
Other languages
English (en)
Other versions
DK632887A (da
DK632887D0 (da
DK165074B (da
Inventor
Georges Henry Guy Broido
Original Assignee
Hyprez Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyprez Sa filed Critical Hyprez Sa
Publication of DK632887D0 publication Critical patent/DK632887D0/da
Publication of DK632887A publication Critical patent/DK632887A/da
Publication of DK165074B publication Critical patent/DK165074B/da
Application granted granted Critical
Publication of DK165074C publication Critical patent/DK165074C/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/36—Embedding or analogous mounting of samples
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Medicinal Preparation (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
DK632887A 1986-12-05 1987-12-02 Proeve med gennempletterede huller, til brug ved mikroskopundersoegelse, samt fremgangsmaade ved tilvirkning af en saadan proeve DK165074C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8617062A FR2607928B1 (fr) 1986-12-05 1986-12-05 Echantillon a percage muni d'un revetement destine a etre examine au microscope et son procede de preparation
FR8617062 1986-12-05

Publications (4)

Publication Number Publication Date
DK632887D0 DK632887D0 (da) 1987-12-02
DK632887A DK632887A (da) 1988-06-06
DK165074B DK165074B (da) 1992-10-05
DK165074C true DK165074C (da) 1993-02-15

Family

ID=9341620

Family Applications (1)

Application Number Title Priority Date Filing Date
DK632887A DK165074C (da) 1986-12-05 1987-12-02 Proeve med gennempletterede huller, til brug ved mikroskopundersoegelse, samt fremgangsmaade ved tilvirkning af en saadan proeve

Country Status (8)

Country Link
US (1) US4833913A (da)
EP (1) EP0280822B1 (da)
JP (1) JPS63149538A (da)
AT (1) ATE58597T1 (da)
DE (1) DE3766361D1 (da)
DK (1) DK165074C (da)
ES (1) ES2018563B3 (da)
FR (1) FR2607928B1 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110774351B (zh) * 2019-09-24 2021-10-12 惠州市金百泽电路科技有限公司 一种厚型无内定位光模多模组件连接器的加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2494834A (en) * 1945-07-10 1950-01-17 Richard S Ringheim Mounted specimen
US2776596A (en) * 1952-07-28 1957-01-08 Eigen Morris Preparation and mounting of specimen sections
JPS5335163A (en) * 1976-09-14 1978-04-01 Hitachi Chemical Co Ltd Method of producing printed circuit board substrate having through hole from metallic material

Also Published As

Publication number Publication date
ATE58597T1 (de) 1990-12-15
DK632887A (da) 1988-06-06
EP0280822B1 (fr) 1990-11-22
US4833913A (en) 1989-05-30
DE3766361D1 (de) 1991-01-03
JPS63149538A (ja) 1988-06-22
FR2607928A1 (fr) 1988-06-10
DK632887D0 (da) 1987-12-02
EP0280822A1 (fr) 1988-09-07
FR2607928B1 (fr) 1989-02-17
DK165074B (da) 1992-10-05
ES2018563B3 (es) 1991-04-16

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Legal Events

Date Code Title Description
PBP Patent lapsed