DK1744326T3 - Ledende fyldstof og anvendelse deraf - Google Patents

Ledende fyldstof og anvendelse deraf

Info

Publication number
DK1744326T3
DK1744326T3 DK06405255T DK06405255T DK1744326T3 DK 1744326 T3 DK1744326 T3 DK 1744326T3 DK 06405255 T DK06405255 T DK 06405255T DK 06405255 T DK06405255 T DK 06405255T DK 1744326 T3 DK1744326 T3 DK 1744326T3
Authority
DK
Denmark
Prior art keywords
conductive filler
conductive
elastomer
graphite
microns
Prior art date
Application number
DK06405255T
Other languages
English (en)
Inventor
Brian William Callen
William Kimber Walkhouse
Original Assignee
Sulzer Metco Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer Metco Canada Inc filed Critical Sulzer Metco Canada Inc
Application granted granted Critical
Publication of DK1744326T3 publication Critical patent/DK1744326T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
DK06405255T 2005-07-12 2006-06-13 Ledende fyldstof og anvendelse deraf DK1744326T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05405434 2005-07-12

Publications (1)

Publication Number Publication Date
DK1744326T3 true DK1744326T3 (da) 2009-11-23

Family

ID=34943000

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06405255T DK1744326T3 (da) 2005-07-12 2006-06-13 Ledende fyldstof og anvendelse deraf

Country Status (13)

Country Link
US (2) US20070012900A1 (da)
EP (1) EP1744326B1 (da)
JP (1) JP2007027111A (da)
KR (1) KR101224091B1 (da)
AT (1) ATE444558T1 (da)
CA (1) CA2548835C (da)
DE (1) DE602006009442D1 (da)
DK (1) DK1744326T3 (da)
ES (1) ES2332106T3 (da)
PL (1) PL1744326T3 (da)
SG (1) SG129379A1 (da)
SI (1) SI1744326T1 (da)
TW (1) TWI381399B (da)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物
JP5496446B2 (ja) * 2007-07-12 2014-05-21 東海ゴム工業株式会社 静電容量型センサ
KR100850007B1 (ko) * 2007-08-31 2008-08-01 이재욱 전자파를 차폐하는 조성물, 이의 제조방법 및 전자파차폐기능을 갖는 카메라 하우징
KR100956240B1 (ko) * 2007-11-14 2010-05-06 삼성전기주식회사 고분자 복합체
WO2011022188A2 (en) * 2009-08-17 2011-02-24 Laird Technologies, Inc. Formation of high electrical conductivity polymer composites with multiple fillers
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
MX2012003346A (es) * 2009-10-02 2012-04-20 Saint Gobain Performance Plast Sello modular de polimero de interferencia electromagnetica/interf erencia de radiofrecuencia (emi/rfi).
US8673416B2 (en) * 2009-10-28 2014-03-18 Xerox Corporation Multilayer electrical component, coating composition, and method of making electrical component
US20120080639A1 (en) * 2010-10-04 2012-04-05 Laird Technologies, Inc. Potato shaped graphite filler, thermal interface materials and emi shielding
CN103250478A (zh) * 2010-12-28 2013-08-14 美国圣戈班性能塑料公司 用于emi屏蔽的具有金属填充剂的聚合物
US9346991B2 (en) * 2011-04-14 2016-05-24 Ada Technologies, Inc. Thermal interface materials and systems and devices containing the same
EP2557571B1 (en) * 2011-08-08 2014-07-02 Tyco Electronics Corporation Electrically conductive metal/plastic hybrid comprising a polymer material, a first metal and metal particles of a second metal embedded in the first metal and method of producing such
US9178128B2 (en) 2011-11-17 2015-11-03 Gentherm Incorporated Thermoelectric devices with interface materials and methods of manufacturing the same
US9780061B2 (en) * 2014-05-26 2017-10-03 Infineon Technologies Ag Molded chip package and method of manufacturing the same
KR101597346B1 (ko) 2014-05-30 2016-02-25 (주) 유니플라텍 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름
CN104558979B (zh) * 2014-12-26 2016-08-24 中北大学 通过导电性大分子偶联剂制备碳基填料/聚合物基复合材料的方法
CN104637566B (zh) * 2015-02-16 2017-01-04 中国科学院宁波材料技术与工程研究所 一种金属/石墨烯复合材料及其制备方法和应用
KR101704454B1 (ko) * 2015-05-18 2017-02-09 대상에스티 주식회사 전자파 차폐 필름
EP3307815B1 (en) 2015-06-12 2026-02-18 NeoGraf Solutions, LLC Graphite composites and thermal management systems
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
US10183420B2 (en) * 2016-02-15 2019-01-22 General Electric Company Resistively heated thermoplastic washout mandrel
US11189420B2 (en) 2016-03-31 2021-11-30 Neograf Solutions, Llc Noise suppressing assemblies
US10711141B1 (en) * 2016-10-04 2020-07-14 Triton Systems, Inc. Nickel free conductive filler
US10468574B2 (en) * 2017-05-04 2019-11-05 Baker Hughes, A Ge Company, Llc Thermoelectric materials and related compositions and methods
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US20200123379A1 (en) * 2018-10-23 2020-04-23 Lockheed Martin Corporation Toughened, high conductivity emi thermoplastic with nanomaterials and articles and methods thereof
US20230311204A1 (en) * 2020-11-20 2023-10-05 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved microwave shielding performance
WO2022120186A1 (en) * 2020-12-03 2022-06-09 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved corrosion resistance
CN115019999A (zh) * 2022-06-30 2022-09-06 航天特种材料及工艺技术研究所 一种耐高温铂包镍导电浆料及其制备方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914507A (en) * 1970-03-20 1975-10-21 Sherritt Gordon Mines Ltd Method of preparing metal alloy coated composite powders
JPS5293621A (en) * 1976-02-02 1977-08-06 Hitachi Ltd Production of copper alloy containing graphite
US5786785A (en) * 1984-05-21 1998-07-28 Spectro Dynamics Systems, L.P. Electromagnetic radiation absorptive coating composition containing metal coated microspheres
JPS6155168A (ja) * 1984-08-24 1986-03-19 Mitsui Petrochem Ind Ltd 耐熱性に優れた導電性塗料
US4711814A (en) * 1986-06-19 1987-12-08 Teichmann Robert J Nickel particle plating system
US5811113A (en) * 1989-04-27 1998-09-22 Cancer Technologies, Inc. Method and composition for deactivating HIV infected blood and for deactivating and decolorizing anticancer drugs
US5200003A (en) * 1990-12-28 1993-04-06 Board Of Regents Of The University Of Wisconsin System On Behalf Of The University Of Wisconsin-Milwaukee Copper graphite composite
US5614320A (en) * 1991-07-17 1997-03-25 Beane; Alan F. Particles having engineered properties
DE69219552T2 (de) * 1991-10-23 1997-12-18 Inco Ltd Mit Nickel überzogene Vorform aus Kohlenstoff
US5366664A (en) * 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
US6132645A (en) 1992-08-14 2000-10-17 Eeonyx Corporation Electrically conductive compositions of carbon particles and methods for their production
US5498372A (en) 1992-08-14 1996-03-12 Hexcel Corporation Electrically conductive polymeric compositions
WO1994011885A1 (en) 1992-11-06 1994-05-26 Hexcel Corporation Electrically conductive polymeric compositions
DE4317302A1 (de) * 1993-05-25 1994-12-01 Degussa Leitfähige Bodenbeschichtung
CA2129073C (en) * 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
EP0814799A1 (en) * 1995-03-20 1998-01-07 Allergan Use of retinoids for the manufacture of a medicament for the treatment of restenosis
US5807506A (en) 1997-04-01 1998-09-15 Xerox Corporation Conductive polymers
JPH11157816A (ja) * 1997-11-21 1999-06-15 Unitika Ltd 金属被覆された球状ガラス状炭素
FI118127B (fi) * 1999-03-04 2007-07-13 Valtion Teknillinen Sähköä johtava termoplastinen elastomeeri ja siitä valmistettu tuote
JP3603945B2 (ja) * 1999-10-06 2004-12-22 信越化学工業株式会社 導電性シリコーンゴム組成物
US20020160193A1 (en) 2001-02-21 2002-10-31 Karel Hajmrle Noble metal clad Ni/C conductive fillers and conductive polymers made therefrom
US6784363B2 (en) * 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
JP2003134740A (ja) * 2001-10-23 2003-05-09 Matsushita Electric Ind Co Ltd 摺動部材
US20030113531A1 (en) * 2001-12-19 2003-06-19 Karel Hajmrle Conductive fillers and conductive polymers made therefrom
JP3749504B2 (ja) * 2002-05-29 2006-03-01 Ｔｄｋ株式会社 Ｐｔｃ組成物、サーミスタ素子およびこれらの製造方法
US7208192B2 (en) * 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
JP4022750B2 (ja) * 2002-10-31 2007-12-19 信越化学工業株式会社 導電性粉体及びその製造方法並びに導電性シリコーンゴム組成物
DE10253399A1 (de) * 2002-11-15 2004-05-27 Eramet & Comilog Chemicals S.A. Carbon-Black-Zusammensetzungen und ihre Anwendungen
TWI276117B (en) * 2003-07-04 2007-03-11 Natoco Co Ltd Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure
US7562858B2 (en) * 2005-03-16 2009-07-21 Diamond Innovations, Inc. Wear and texture coatings for components used in manufacturing glass light bulbs
JP5082845B2 (ja) * 2005-03-29 2012-11-28 日立金属株式会社 高熱伝導性黒鉛粒子分散型複合体及びその製造方法
TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物

Also Published As

Publication number Publication date
EP1744326B1 (en) 2009-09-30
TWI381399B (zh) 2013-01-01
ES2332106T3 (es) 2010-01-26
KR20070008407A (ko) 2007-01-17
TW200707467A (en) 2007-02-16
US20070012900A1 (en) 2007-01-18
SI1744326T1 (sl) 2010-01-29
CA2548835C (en) 2013-11-12
CA2548835A1 (en) 2007-01-12
ATE444558T1 (de) 2009-10-15
US20110108775A1 (en) 2011-05-12
SG129379A1 (en) 2007-02-26
KR101224091B1 (ko) 2013-01-18
HK1098246A1 (en) 2007-07-13
EP1744326A1 (en) 2007-01-17
DE602006009442D1 (de) 2009-11-12
JP2007027111A (ja) 2007-02-01
PL1744326T3 (pl) 2010-03-31

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