DK1932104T3 - Elektronisk modul med dobbelt kommunikationsinterface, især til chipkort - Google Patents

Elektronisk modul med dobbelt kommunikationsinterface, især til chipkort

Info

Publication number
DK1932104T3
DK1932104T3 DK06794373.8T DK06794373T DK1932104T3 DK 1932104 T3 DK1932104 T3 DK 1932104T3 DK 06794373 T DK06794373 T DK 06794373T DK 1932104 T3 DK1932104 T3 DK 1932104T3
Authority
DK
Denmark
Prior art keywords
communication interface
electronic module
smart cards
dual communication
dual
Prior art date
Application number
DK06794373.8T
Other languages
English (en)
Inventor
Olivier Artigue
Henri Boccia
Olivier Brunet
Original Assignee
Smart Packaging Solutions Sps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions Sps filed Critical Smart Packaging Solutions Sps
Application granted granted Critical
Publication of DK1932104T3 publication Critical patent/DK1932104T3/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Near-Field Transmission Systems (AREA)
DK06794373.8T 2005-08-30 2006-08-28 Elektronisk modul med dobbelt kommunikationsinterface, især til chipkort DK1932104T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0508860A FR2890212B1 (fr) 2005-08-30 2005-08-30 Module electronique a double interface de communication, notamment pour carte a puce
PCT/FR2006/002012 WO2007026077A1 (fr) 2005-08-30 2006-08-28 Module électronique à double interface de communication, notamment pour carte à puce

Publications (1)

Publication Number Publication Date
DK1932104T3 true DK1932104T3 (da) 2013-02-25

Family

ID=36499669

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06794373.8T DK1932104T3 (da) 2005-08-30 2006-08-28 Elektronisk modul med dobbelt kommunikationsinterface, især til chipkort

Country Status (15)

Country Link
US (1) US8100337B2 (da)
EP (1) EP1932104B1 (da)
KR (1) KR101236577B1 (da)
CN (1) CN101297308B (da)
CY (1) CY1113910T1 (da)
DK (1) DK1932104T3 (da)
ES (1) ES2403533T3 (da)
FR (1) FR2890212B1 (da)
MA (1) MA29778B1 (da)
MY (1) MY151796A (da)
PL (1) PL1932104T3 (da)
PT (1) PT1932104E (da)
RU (1) RU2412483C2 (da)
SI (1) SI1932104T1 (da)
WO (1) WO2007026077A1 (da)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2915011B1 (fr) * 2007-03-29 2009-06-05 Smart Packaging Solutions Sps Carte a puce a double interface de communication
EP2068274A1 (fr) * 2007-12-03 2009-06-10 Gemplus Système à double circuit intégré et utilisation du système à la mise en oeuvre d'application à distance
EP2073154A1 (en) 2007-12-20 2009-06-24 Gemalto SA Biometric micro-module
FR2952740B1 (fr) 2009-11-16 2011-12-09 Oberthur Technologies Dispositif electronique sans contact, procede de fabrication du dispositif et etiquette electronique sans contact
FR2963141B1 (fr) 2010-07-20 2012-08-31 Oberthur Technologies Etiquette electronique sans contact
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
EP2525304A1 (fr) 2011-05-17 2012-11-21 Gemalto SA Dispositif transpondeur radiofréquence à circuit résonant passif optimisé
EP2541471A1 (fr) 2011-07-01 2013-01-02 Gemalto SA Dispositif portatif à contacts électriques évidés
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US9697459B2 (en) 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9836684B2 (en) 2014-08-10 2017-12-05 Féinics Amatech Teoranta Smart cards, payment objects and methods
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US10867235B2 (en) 2011-08-08 2020-12-15 Féinics Amatech Teoranta Metallized smartcard constructions and methods
EP2754204A1 (en) 2011-09-11 2014-07-16 Féinics AmaTech Teoranta Rfid antenna modules and methods of making
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
WO2013110625A1 (en) 2012-01-23 2013-08-01 Féinics Amatech Teoranta Offsetting shielding and enhancing coupling in metallized smart cards
AU2013214133A1 (en) 2012-02-05 2014-07-31 Feinics Amatech Teoranta RFID antenna modules and methods
FR2992761B1 (fr) 2012-07-02 2015-05-29 Inside Secure Procede de fabrication d'un microcircuit sans contact
FR2994005B1 (fr) 2012-07-25 2017-05-26 Microconnections Sas Module electronique pour carte a puce et circuit imprime pour la realisation d'un tel module
US10783426B2 (en) 2012-08-30 2020-09-22 David Finn Dual-interface metal hybrid smartcard
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
FR2997782B1 (fr) * 2012-11-05 2016-01-15 Linxens Holding Procede de fabrication d'un connecteur pour module de carte a puce, connecteur de carte a puce obtenu par ce procede et module de carte a puce comportant un tel connecteur.
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US11341389B2 (en) 2013-01-18 2022-05-24 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US11928537B2 (en) 2013-01-18 2024-03-12 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US9167691B2 (en) 2013-04-16 2015-10-20 Identive Group, Inc. Dual interface module and dual interface card having a dual interface module manufactured using laser welding
WO2014191123A1 (en) * 2013-05-28 2014-12-04 Féinics Amatech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
EP3005243B2 (en) * 2013-05-28 2026-05-27 Féinics AmaTech Teoranta Dual-interface rfid antenna modules
EP3069303B1 (en) 2013-11-13 2022-07-20 Féinics AmaTech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
WO2015071086A1 (en) * 2013-11-13 2015-05-21 Féinics Amatech Teoranta Connection bridges for dual interface transponder chip modules
EP3751464A1 (en) 2014-02-27 2020-12-16 Féinics Amatech Teoranta Transponder chip modules and method of making same
US11068770B2 (en) 2014-03-08 2021-07-20 Féinics AmaTech Teoranta Lower Churchfield Connection bridges for dual interface transponder chip modules
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
USD776070S1 (en) 2014-03-18 2017-01-10 Sony Corporation Non-contact type data carrier
US11410010B2 (en) * 2014-08-21 2022-08-09 Amatech Group Limiied Smartcard with a coupling frame and a wireless connection between modules
EP3198528B1 (en) 2014-09-22 2020-08-26 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
FR3028982B1 (fr) * 2014-10-31 2017-09-08 Smart Packaging Solutions Module eletronique de taille reduite pour carte a puce
US10438110B2 (en) 2015-07-08 2019-10-08 Assa Abloy Ab Multiple frequency transponder with a single antenna
RU2607725C1 (ru) * 2015-08-06 2017-01-10 Общество с ограниченной ответственностью "Интеллектуальные Системы Управления Бизнесом" Смарт-карта с двойным интерфейсом и способ ее изготовления
EP3159831B1 (en) * 2015-10-21 2018-10-03 Nxp B.V. Dual-interface ic card
US10089568B2 (en) 2016-06-01 2018-10-02 CPI Card Group—Colorado, Inc. IC chip card with integrated biometric sensor pads
WO2018035258A1 (en) 2016-08-16 2018-02-22 Cpi Card Group - Colorado, Inc. Improved ic chip card
CN106449485B (zh) * 2016-10-26 2024-02-02 东莞市锐祥智能卡科技有限公司 一种双界面芯片的封装装置
EP3602680B1 (en) 2017-03-29 2024-01-17 Féinics AmaTech Teoranta Smartcard with coupling frame antenna
WO2018178314A1 (en) 2017-03-29 2018-10-04 Féinics Amatech Teoranta Contactless metal card constructions
EP3762871B1 (en) 2018-03-07 2024-08-07 X-Card Holdings, LLC Metal card
CA3099344A1 (en) 2018-05-03 2019-11-07 Pierre L. DE ROCHEMONT High speed / low power server farms and server networks
WO2019236734A1 (en) 2018-06-05 2019-12-12 De Rochemont L Pierre Module with high peak bandwidth i/o channels
KR101914422B1 (ko) * 2018-07-17 2018-11-01 정규은 Ｉｃ칩 동조 기능을 가지는 ｉｃ 카드 및 이의 신호 송수신 방법
US20210081743A1 (en) 2019-08-12 2021-03-18 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
US12277462B2 (en) 2019-08-14 2025-04-15 Federal Card Services, LLC Metal-containing dual interface smartcards
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
FR3110735B1 (fr) 2020-05-21 2022-04-29 Linxens Holding Procédé de métallisation électro-chimique d’un circuit électrique double-face pour carte à puce et circuit électrique obtenu par ce procédé.
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
JP7651373B2 (ja) * 2021-05-24 2025-03-26 Tdk株式会社 アンテナ装置及びこれを備えるワイヤレス電力伝送デバイス

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19534480C2 (de) * 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
FR2743649B1 (fr) * 1996-01-17 1998-04-03 Gemplus Card Int Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication
DE19654902C2 (de) * 1996-03-15 2000-02-03 David Finn Chipkarte
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
FR2760113B1 (fr) * 1997-02-24 1999-06-04 Gemplus Card Int Procede de fabrication de carte sans contact a antenne bobinee
FR2765010B1 (fr) * 1997-06-20 1999-07-16 Inside Technologies Micromodule electronique, notamment pour carte a puce
DE69831592T2 (de) * 1997-11-14 2006-06-22 Toppan Printing Co. Ltd. Zusammengesetzte ic-karte
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
FR2788646B1 (fr) * 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
US6634564B2 (en) * 2000-10-24 2003-10-21 Dai Nippon Printing Co., Ltd. Contact/noncontact type data carrier module
FR2829857B1 (fr) * 2001-09-14 2004-09-17 A S K Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique
US6913196B2 (en) * 2002-02-20 2005-07-05 O2Micro International Limited Dual mode controller for ISO7816 and USB enabled smart cards
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
JP2004118694A (ja) * 2002-09-27 2004-04-15 Toshiba Corp コンビｉｃカードの実装方法
KR100689016B1 (ko) * 2004-09-15 2007-03-02 주식회사 와이비엘 아이씨 카드

Also Published As

Publication number Publication date
PT1932104E (pt) 2013-02-13
WO2007026077B1 (fr) 2007-05-31
CY1113910T1 (el) 2016-07-27
RU2412483C2 (ru) 2011-02-20
CN101297308B (zh) 2012-05-30
EP1932104B1 (fr) 2012-11-07
US8100337B2 (en) 2012-01-24
KR20080041620A (ko) 2008-05-13
RU2008111742A (ru) 2009-10-10
EP1932104A1 (fr) 2008-06-18
KR101236577B1 (ko) 2013-02-22
SI1932104T1 (sl) 2013-04-30
WO2007026077A1 (fr) 2007-03-08
FR2890212B1 (fr) 2009-08-21
CN101297308A (zh) 2008-10-29
MA29778B1 (fr) 2008-09-01
FR2890212A1 (fr) 2007-03-02
ES2403533T3 (es) 2013-05-20
US20080245879A1 (en) 2008-10-09
MY151796A (en) 2014-07-14
PL1932104T3 (pl) 2013-05-31

Similar Documents

Publication Publication Date Title
PL1932104T3 (pl) Moduł elektroniczny z podwójnym interfejsem komunikacyjnym, zwłaszcza dla kart chipowych
GB0718001D0 (en) Smart card chip arrangement
ZA200804265B (en) Smart card
ZA200903097B (en) Chip module for an RFID system
FR2915011B1 (fr) Carte a puce a double interface de communication
TWI318812B (en) A sim card retainer
IL202771A0 (en) Contactless smart sim
TWI346522B (en) Cellular phone sim card fastening mechanism
EP1837953A4 (en) CARD CONNECTOR
EP1889374A4 (en) ELECTRONIC MODULE READER
PL1892645T3 (pl) Inteligentna karta
EP1970841A4 (en) CARD THAT CAN BE AUTHENTICATED BY A HOLOGRAM CHIP
FR2915010B1 (fr) Module microelectronique a double interface de communication notamment pour carte a puce.
DE602005005038D1 (de) Kontaktlose karte
GB0400182D0 (en) Module for network interface card
BRPI0611144A2 (pt) método de fabricação de uma antena, método de fabricação de um cartão inteligente, e cartão inteligente
DK1703605T3 (da) Forbedret forsænket modul
AT501289B8 (de) Modul
NL1034228A1 (nl) Ultrabreedbandige communicatieantenne.
SI1934892T1 (sl) Osebni dokument, ki obsega ÄŤip
AP2006003556A0 (en) Sim card based billing.
GB0618645D0 (en) TV card with PCMCIA interface
TR200602440A3 (tr) Elektronik kredi karti.
PL2198455T3 (pl) Moduł chipa do karty chipowej
ES1057264Y (es) Carpeta-libro portadocumentos con elementos de divulgacion.