PL2198455T3 - Moduł chipa do karty chipowej - Google Patents

Moduł chipa do karty chipowej

Info

Publication number
PL2198455T3
PL2198455T3 PL08837280T PL08837280T PL2198455T3 PL 2198455 T3 PL2198455 T3 PL 2198455T3 PL 08837280 T PL08837280 T PL 08837280T PL 08837280 T PL08837280 T PL 08837280T PL 2198455 T3 PL2198455 T3 PL 2198455T3
Authority
PL
Poland
Prior art keywords
chip
card
module
chip module
chip card
Prior art date
Application number
PL08837280T
Other languages
English (en)
Inventor
Magnus Olbrich
Original Assignee
Giesecke & Devrient Mobile Security Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke & Devrient Mobile Security Gmbh filed Critical Giesecke & Devrient Mobile Security Gmbh
Publication of PL2198455T3 publication Critical patent/PL2198455T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL08837280T 2007-10-08 2008-10-07 Moduł chipa do karty chipowej PL2198455T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007048237A DE102007048237A1 (de) 2007-10-08 2007-10-08 Chipmodul für Chipkarte
EP08837280.0A EP2198455B1 (de) 2007-10-08 2008-10-07 Chipmodul für chipkarte
PCT/EP2008/008461 WO2009046962A2 (de) 2007-10-08 2008-10-07 Chipmodul für chipkarte

Publications (1)

Publication Number Publication Date
PL2198455T3 true PL2198455T3 (pl) 2017-10-31

Family

ID=40418207

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08837280T PL2198455T3 (pl) 2007-10-08 2008-10-07 Moduł chipa do karty chipowej

Country Status (5)

Country Link
EP (1) EP2198455B1 (pl)
DE (1) DE102007048237A1 (pl)
ES (1) ES2635261T3 (pl)
PL (1) PL2198455T3 (pl)
WO (1) WO2009046962A2 (pl)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19535989C3 (de) * 1995-09-27 2003-03-27 Siemens Ag Chipmodul
WO1997034247A2 (de) * 1996-03-14 1997-09-18 Pav Card Gmbh Chipkarte, verbindungsanordnung und verfahren zum herstellen einer chipkarte
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
JP4299414B2 (ja) * 1999-10-12 2009-07-22 富士通マイクロエレクトロニクス株式会社 コンビネーションカード、ｉｃカード用モジュール及びコンビネーションカードの製造方法
DE102005002732A1 (de) * 2005-01-20 2006-08-03 Giesecke & Devrient Gmbh Tragbarer Datenträger

Also Published As

Publication number Publication date
WO2009046962A2 (de) 2009-04-16
WO2009046962A3 (de) 2009-07-02
EP2198455B1 (de) 2017-05-24
DE102007048237A1 (de) 2009-04-09
EP2198455A2 (de) 2010-06-23
ES2635261T3 (es) 2017-10-03

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