DK200201429A - Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres - Google Patents

Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres Download PDF

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Publication number
DK200201429A
DK200201429A DK200201429A DKPA200201429A DK200201429A DK 200201429 A DK200201429 A DK 200201429A DK 200201429 A DK200201429 A DK 200201429A DK PA200201429 A DKPA200201429 A DK PA200201429A DK 200201429 A DK200201429 A DK 200201429A
Authority
DK
Denmark
Prior art keywords
sub
ions
metal
plated
metal ions
Prior art date
Application number
DK200201429A
Other languages
English (en)
Inventor
Moeller Per
Original Assignee
Inst Produktudvikling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Produktudvikling filed Critical Inst Produktudvikling
Priority to DK200201429A priority Critical patent/DK175025B1/da
Priority to AU2003266486A priority patent/AU2003266486A1/en
Priority to EP03798083A priority patent/EP1546435B1/en
Priority to US10/529,467 priority patent/US20060000720A1/en
Priority to DE60315170T priority patent/DE60315170D1/de
Priority to PCT/DK2003/000617 priority patent/WO2004029327A1/en
Priority to AT03798083T priority patent/ATE368136T1/de
Publication of DK200201429A publication Critical patent/DK200201429A/da
Application granted granted Critical
Publication of DK175025B1 publication Critical patent/DK175025B1/da

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Catalysts (AREA)
  • Laminated Bodies (AREA)

Description

PATENTKRAV 1. Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres ved metaludfældning i nærværelse af et katalysatormetal og eventuelt underkastes efterfølgende elektrolytisk plettering eller anden form for overfladebehandling, kendetegnet ved, man a) på overfladen deponerer et adsorberende metaloxid, b) behandler overfladen med en opløsning af overgangsmetalioner, og derefter c) behandler overfladen med en opløsning af katalysatormetalioner, hvor de i trin (b) anvendte overgangsmetalioner er valgt blandt sådanne, der kan reducere katalysatormetalioner til katalysatormetal. 2. Fremgangsmåde ifølge krav 1,kendetegnet ved, det adsorberende metaloxid i trin (a) er mangandioxid (Mn02) eller okker (Fe203). 3. Fremgangsmåde ifølge krav 2, k e n d e t e g n e t ved, man i trin (a) oxiderer overfladen med en permanganatforbindelse under dannelse af mangandioxid, og efter oxidationen bortskyller resterende permanganatforbindelse uden at fjerne det dannede mangandioxid, der er aflejret som et lag eller som småklynger på overfladen. 4. Fremgangsmåde ifølge krav 1, 2 eller 3, kendetegnet ved, man i trin (b) behandler overfladen med en opløsning af Sn^-ioner eller Co^-ioner. 5. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at man i trin (b) behandler overfladen med en vandig opløsning af overgangsmetalioner. 6. Fremgangsmåde ifølge krav 1,kendetegnet ved, at katalysatormetalioneme er ioner at et metal fra platingruppen, fortrinsvis Pd'H', Rh^ eller Pt++. 7. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendete g- n e t ved, at man i trin (c) behandler overfladen med en vandig opløsning af katalysatormetalioner. 8. Fremgangsmåde ifølge et af de foregående krav, kendetegnet ved, at det ikke-ledende materiale som hovedbestandel indeholder et polymermateriale. 9. Fremgangsmåde ifølge krav 8, kendetegnet ved, at polymermaterialet er valgt blandt polycarbonat (PC), polyphenylenoxid (PPO), acrylnitril/butadien/styren-terpoly-mer (ABS), polyacrylamid (PAA), alifatisk eller aromatisk polyamid (PA), polyethylen (PE), polypropylen (PP), polyvinylchlorid (PVC), polystyren (PS), polyetherimid (PEI), polyphthalamid (PPA), polyphenylensulfid PPS), termoplastisk polyester (ΡΕΊ7ΡΒΊΓ), flydende krystalpolymer (LCP), polyetherether-keton (PEEK), polysulfon (PSU), poly-ethersulfon (PES), polyurethan (PUR), epoxy (EP), umættet polyester (UP) og phe-nolplast (PF). 10. Fremgangsmåde ifølge krav 8 eller 9, kendetegnet ved, at det ikke-ledende materiale indeholder armeringsfibre og/eller fyldstoffer på organisk og/eller uorganisk basis. 11. Fremgangsmåde ifølge et af kravene 1-7, kendetegnet ved, at det ikke-ledende materiale som hovedbestandel indeholder en glas, en keram eller et biologisk materiale. 12. Genstand af et ikke-ledende materiale med en overflade, der partielt eller fuldstændigt er belagt med autokatalytisk udfældet kobber, cobalt, sølv, tin, guld eller nikkel eller en legering deraf, opnåelig ved forbehandling af en ikke-ledende genstand ved fremgangsmåden ifølge et hvilket som helst af de foregående krav og efterfølgende autokatalytisk udfældning. 13. Genstand af et ikke-ledende materiale med en overflade, der partielt eller fuldstændigt er belagt med et elektrolytisk pletteringslag, opnåelig ved forbehandling af en ikke-ledende genstand ved fremgangsmåden ifølge et hvilket som helst af kravene 1-11, efterfølgende autokatalytisk udfældning og derefter en konventionel elektrolyse. 14. Genstand ifølge krav 13 belagt med et eller flere elektrolytiske pletteringslag. 15. Genstand ifølge krav 14 belagt med mindst et elektrolytisk pletteringslag med høj elektrisk ledningsevne.
DK200201429A 2002-09-26 2002-09-26 Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres DK175025B1 (da)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DK200201429A DK175025B1 (da) 2002-09-26 2002-09-26 Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres
AU2003266486A AU2003266486A1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
EP03798083A EP1546435B1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
US10/529,467 US20060000720A1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
DE60315170T DE60315170D1 (de) 2002-09-26 2003-09-23 Verfahren zur vorbehandlung einer oberfläche eines mit metall zu beschichtenden nichtleitenden materials
PCT/DK2003/000617 WO2004029327A1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
AT03798083T ATE368136T1 (de) 2002-09-26 2003-09-23 Verfahren zur vorbehandlung einer oberfläche eines mit metall zu beschichtenden nichtleitenden materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK200201429A DK175025B1 (da) 2002-09-26 2002-09-26 Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres
DK200201429 2002-09-26

Publications (2)

Publication Number Publication Date
DK200201429A true DK200201429A (da) 2004-03-27
DK175025B1 DK175025B1 (da) 2004-05-03

Family

ID=32039054

Family Applications (1)

Application Number Title Priority Date Filing Date
DK200201429A DK175025B1 (da) 2002-09-26 2002-09-26 Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres

Country Status (7)

Country Link
US (1) US20060000720A1 (da)
EP (1) EP1546435B1 (da)
AT (1) ATE368136T1 (da)
AU (1) AU2003266486A1 (da)
DE (1) DE60315170D1 (da)
DK (1) DK175025B1 (da)
WO (1) WO2004029327A1 (da)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900236B1 (en) 1999-10-18 2005-05-31 University Of Connecticut Cannabimimetic indole derivatives
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
DE102010021554A1 (de) 2010-05-21 2011-11-24 Siemens Aktiengesellschaft Bauteil mit einer katalytischen Oberfläche, Verfahren zu dessen Herstellung und Verwendung dieses Bauteils
DE102010021553A1 (de) 2010-05-21 2011-11-24 Siemens Aktiengesellschaft Bauteil mit einer katalytischen Oberfläche, Verfahren zu dessen Herstellung und Verwendung dieses Bauteils
CN111519226A (zh) * 2020-06-05 2020-08-11 麦德美科技（苏州）有限公司 聚醚酰亚胺化学粗化电镀工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579428A (en) * 1967-09-30 1971-05-18 Mitsubishi Petrochemical Co Method of manufacturing plated polypropylene shaped articles
GB1404855A (en) * 1971-07-28 1975-09-03 Mitsui Mining & Smelting Co Catalytic purification of exhaust gases
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
US4073740A (en) * 1975-06-18 1978-02-14 Kollmorgen Technologies Corporation Composition for the activation of resinous bodies for adherent metallization
DE3816494A1 (de) * 1988-05-10 1989-11-16 Schering Ag Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen
US5078889A (en) * 1989-02-28 1992-01-07 Csa Division, Lake Industries, Inc. Selective removal of contaminants from water sources using inorganic media
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
DE3928435A1 (de) * 1989-08-24 1991-02-28 Schering Ag Verfahren zur direkten metallisierung eines nicht leitenden substrats
US5693209A (en) * 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
US5648125A (en) * 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards

Also Published As

Publication number Publication date
AU2003266486A1 (en) 2004-04-19
EP1546435A1 (en) 2005-06-29
DE60315170D1 (de) 2007-09-06
EP1546435B1 (en) 2007-07-25
WO2004029327A1 (en) 2004-04-08
DK175025B1 (da) 2004-05-03
US20060000720A1 (en) 2006-01-05
ATE368136T1 (de) 2007-08-15

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