DK200201429A - Process for pretreating a surface of a non-conductive material to be plated - Google Patents

Process for pretreating a surface of a non-conductive material to be plated Download PDF

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Publication number
DK200201429A
DK200201429A DK200201429A DKPA200201429A DK200201429A DK 200201429 A DK200201429 A DK 200201429A DK 200201429 A DK200201429 A DK 200201429A DK PA200201429 A DKPA200201429 A DK PA200201429A DK 200201429 A DK200201429 A DK 200201429A
Authority
DK
Denmark
Prior art keywords
sub
ions
metal
plated
metal ions
Prior art date
Application number
DK200201429A
Other languages
Danish (da)
Inventor
Moeller Per
Original Assignee
Inst Produktudvikling
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inst Produktudvikling filed Critical Inst Produktudvikling
Priority to DK200201429A priority Critical patent/DK175025B1/en
Priority to PCT/DK2003/000617 priority patent/WO2004029327A1/en
Priority to US10/529,467 priority patent/US20060000720A1/en
Priority to EP03798083A priority patent/EP1546435B1/en
Priority to AT03798083T priority patent/ATE368136T1/en
Priority to DE60315170T priority patent/DE60315170D1/en
Priority to AU2003266486A priority patent/AU2003266486A1/en
Publication of DK200201429A publication Critical patent/DK200201429A/en
Application granted granted Critical
Publication of DK175025B1 publication Critical patent/DK175025B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1889—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Catalysts (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A method for pretreating a surface of a non-conducting material to be plated through precipitation of metal where an adsorbing metal oxide is initially deposited, such as MnO<SUB>2 </SUB>or Fe<SUB>2</SUB>O<SUB>3 </SUB>on the surface, whereafter said surface is treated with a solution of transition metal ions, such as Sn<SUP>++</SUP> ions, and then with a solution of metal ions of a catalytic metal catalyzing chemical plating, such as a metal of the platinum group. The transition metal ions used are selected among such ions that can reduce catalytic metal ions into catalytic metal. The method renders it possible to plate non-conducting materials, such as plastic materials, which cannot or only with great difficulty can be plated by a conventional activation by means of colloidal palladium.

Description

PATENTKRAV 1. Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres ved metaludfældning i nærværelse af et katalysatormetal og eventuelt underkastes efterfølgende elektrolytisk plettering eller anden form for overfladebehandling, kendetegnet ved, man a) på overfladen deponerer et adsorberende metaloxid, b) behandler overfladen med en opløsning af overgangsmetalioner, og derefter c) behandler overfladen med en opløsning af katalysatormetalioner, hvor de i trin (b) anvendte overgangsmetalioner er valgt blandt sådanne, der kan reducere katalysatormetalioner til katalysatormetal. 2. Fremgangsmåde ifølge krav 1,kendetegnet ved, det adsorberende metaloxid i trin (a) er mangandioxid (Mn02) eller okker (Fe203). 3. Fremgangsmåde ifølge krav 2, k e n d e t e g n e t ved, man i trin (a) oxiderer overfladen med en permanganatforbindelse under dannelse af mangandioxid, og efter oxidationen bortskyller resterende permanganatforbindelse uden at fjerne det dannede mangandioxid, der er aflejret som et lag eller som småklynger på overfladen. 4. Fremgangsmåde ifølge krav 1, 2 eller 3, kendetegnet ved, man i trin (b) behandler overfladen med en opløsning af Sn^-ioner eller Co^-ioner. 5. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendetegnet ved, at man i trin (b) behandler overfladen med en vandig opløsning af overgangsmetalioner. 6. Fremgangsmåde ifølge krav 1,kendetegnet ved, at katalysatormetalioneme er ioner at et metal fra platingruppen, fortrinsvis Pd'H', Rh^ eller Pt++. 7. Fremgangsmåde ifølge et hvilket som helst af de foregående krav, kendete g- n e t ved, at man i trin (c) behandler overfladen med en vandig opløsning af katalysatormetalioner. 8. Fremgangsmåde ifølge et af de foregående krav, kendetegnet ved, at det ikke-ledende materiale som hovedbestandel indeholder et polymermateriale. 9. Fremgangsmåde ifølge krav 8, kendetegnet ved, at polymermaterialet er valgt blandt polycarbonat (PC), polyphenylenoxid (PPO), acrylnitril/butadien/styren-terpoly-mer (ABS), polyacrylamid (PAA), alifatisk eller aromatisk polyamid (PA), polyethylen (PE), polypropylen (PP), polyvinylchlorid (PVC), polystyren (PS), polyetherimid (PEI), polyphthalamid (PPA), polyphenylensulfid PPS), termoplastisk polyester (ΡΕΊ7ΡΒΊΓ), flydende krystalpolymer (LCP), polyetherether-keton (PEEK), polysulfon (PSU), poly-ethersulfon (PES), polyurethan (PUR), epoxy (EP), umættet polyester (UP) og phe-nolplast (PF). 10. Fremgangsmåde ifølge krav 8 eller 9, kendetegnet ved, at det ikke-ledende materiale indeholder armeringsfibre og/eller fyldstoffer på organisk og/eller uorganisk basis. 11. Fremgangsmåde ifølge et af kravene 1-7, kendetegnet ved, at det ikke-ledende materiale som hovedbestandel indeholder en glas, en keram eller et biologisk materiale. 12. Genstand af et ikke-ledende materiale med en overflade, der partielt eller fuldstændigt er belagt med autokatalytisk udfældet kobber, cobalt, sølv, tin, guld eller nikkel eller en legering deraf, opnåelig ved forbehandling af en ikke-ledende genstand ved fremgangsmåden ifølge et hvilket som helst af de foregående krav og efterfølgende autokatalytisk udfældning. 13. Genstand af et ikke-ledende materiale med en overflade, der partielt eller fuldstændigt er belagt med et elektrolytisk pletteringslag, opnåelig ved forbehandling af en ikke-ledende genstand ved fremgangsmåden ifølge et hvilket som helst af kravene 1-11, efterfølgende autokatalytisk udfældning og derefter en konventionel elektrolyse. 14. Genstand ifølge krav 13 belagt med et eller flere elektrolytiske pletteringslag. 15. Genstand ifølge krav 14 belagt med mindst et elektrolytisk pletteringslag med høj elektrisk ledningsevne.A process for pretreating a surface on a non-conductive material to be plated by metal precipitation in the presence of a catalyst metal and optionally subjected to subsequent electrolytic plating or other surface treatment, characterized in that a) an adsorbent metal oxide is deposited on the surface. , b) treating the surface with a solution of transition metal ions, and then c) treating the surface with a solution of catalyst metal ions, the transition metal ions used in step (b) being selected from those which can reduce catalyst metal ions to catalyst metal. Process according to claim 1, characterized in that the adsorbent metal oxide in step (a) is manganese dioxide (MnO 2) or ocher (Fe 2 O 3). Process according to claim 2, characterized in that in step (a) the surface is oxidized with a permanganate compound to form manganese dioxide and after oxidation the residual permanganate compound is rinsed without removing the formed manganese dioxide deposited as a layer or as small clusters on the surface. . Process according to claim 1, 2 or 3, characterized in that in step (b) the surface is treated with a solution of Sn 2 ions or Co 2 ions. Process according to any one of the preceding claims, characterized in that in step (b) the surface is treated with an aqueous solution of transition metal ions. Process according to claim 1, characterized in that the catalyst metal ions are ions to a metal of the plate group, preferably Pd'H ', Rh1 or Pt ++. Process according to any one of the preceding claims, characterized in that in step (c) the surface is treated with an aqueous solution of catalyst metal ions. Process according to one of the preceding claims, characterized in that the non-conductive material contains as a main component a polymeric material. Process according to claim 8, characterized in that the polymer material is selected from polycarbonate (PC), polyphenylene oxide (PPO), acrylonitrile / butadiene / styrene terpolymer (ABS), polyacrylamide (PAA), aliphatic or aromatic polyamide (PA). , polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polystyrene (PS), polyetherimide (PEI), polyphthalamide (PPA), polyphenylene sulfide PPS), thermoplastic polyester (ΡΕΊ7ΡΒΊΓ), liquid crystal polymer (LCP), polyether ether ketone (PEEK), polysulfone (PSU), polyethersulfone (PES), polyurethane (PUR), epoxy (EP), unsaturated polyester (UP), and phenolic resin (PF). Process according to claim 8 or 9, characterized in that the non-conductive material contains reinforcing fibers and / or fillers on an organic and / or inorganic basis. Process according to one of claims 1-7, characterized in that the non-conductive material contains as a main component a glass, a ceramic or a biological material. An article of a non-conductive material having a surface partially or completely coated with autocatalytically precipitated copper, cobalt, silver, tin, gold or nickel or an alloy thereof obtainable by pretreating a non-conductive article by the method of any of the preceding claims and subsequent autocatalytic precipitation. An article of a non-conductive material having a surface partially or completely coated with an electrolytic plating layer obtainable by pretreating a non-conductive article by the method of any one of claims 1-11, subsequent autocatalytic precipitation and then a conventional electrolysis. The article of claim 13 coated with one or more electrolytic plating layers. The article of claim 14 coated with at least one electrolytic plating layer with high electrical conductivity.

DK200201429A 2002-09-26 2002-09-26 Process for pretreating a surface of a non-conductive material to be plated DK175025B1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DK200201429A DK175025B1 (en) 2002-09-26 2002-09-26 Process for pretreating a surface of a non-conductive material to be plated
PCT/DK2003/000617 WO2004029327A1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
US10/529,467 US20060000720A1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
EP03798083A EP1546435B1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated
AT03798083T ATE368136T1 (en) 2002-09-26 2003-09-23 METHOD FOR PRETREATING A SURFACE OF A NONCONDUCTIVE MATERIAL TO BE COATED WITH METAL
DE60315170T DE60315170D1 (en) 2002-09-26 2003-09-23 METHOD FOR PRE-TREATING A SURFACE OF A NON-LEADING MATERIAL TO BE COATED WITH METAL
AU2003266486A AU2003266486A1 (en) 2002-09-26 2003-09-23 Method for pretreating a surface of a non-conducting material to be plated

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK200201429 2002-09-26
DK200201429A DK175025B1 (en) 2002-09-26 2002-09-26 Process for pretreating a surface of a non-conductive material to be plated

Publications (2)

Publication Number Publication Date
DK200201429A true DK200201429A (en) 2004-03-27
DK175025B1 DK175025B1 (en) 2004-05-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DK200201429A DK175025B1 (en) 2002-09-26 2002-09-26 Process for pretreating a surface of a non-conductive material to be plated

Country Status (7)

Country Link
US (1) US20060000720A1 (en)
EP (1) EP1546435B1 (en)
AT (1) ATE368136T1 (en)
AU (1) AU2003266486A1 (en)
DE (1) DE60315170D1 (en)
DK (1) DK175025B1 (en)
WO (1) WO2004029327A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900236B1 (en) 1999-10-18 2005-05-31 University Of Connecticut Cannabimimetic indole derivatives
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
DE102010021553A1 (en) 2010-05-21 2011-11-24 Siemens Aktiengesellschaft Component with a catalytic surface, process for its preparation and use of this component
DE102010021554A1 (en) 2010-05-21 2011-11-24 Siemens Aktiengesellschaft Component with a catalytic surface, process for its preparation and use of this component
CN111519226A (en) * 2020-06-05 2020-08-11 麦德美科技（苏州）有限公司 Polyetherimide chemical roughening electroplating process

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US3579428A (en) * 1967-09-30 1971-05-18 Mitsubishi Petrochemical Co Method of manufacturing plated polypropylene shaped articles
GB1404855A (en) * 1971-07-28 1975-09-03 Mitsui Mining & Smelting Co Catalytic purification of exhaust gases
GB1401600A (en) * 1972-12-13 1975-07-16 Kollmorgen Corp Composition and process for the activation of resinous bodies for adherent metallization
US4073740A (en) * 1975-06-18 1978-02-14 Kollmorgen Technologies Corporation Composition for the activation of resinous bodies for adherent metallization
DE3816494A1 (en) * 1988-05-10 1989-11-16 Schering Ag SOLUTION AND METHOD FOR THE AETZING AND ACTIVATION OF INSULATED SURFACES
US5078889A (en) * 1989-02-28 1992-01-07 Csa Division, Lake Industries, Inc. Selective removal of contaminants from water sources using inorganic media
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
DE3928435A1 (en) * 1989-08-24 1991-02-28 Schering Ag METHOD FOR DIRECTLY METALLIZING A NON-CONDUCTIVE SUBSTRATE
US5693209A (en) * 1989-09-14 1997-12-02 Atotech Deutschland Gmbh Process for metallization of a nonconductor surface
US5648125A (en) * 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards

Also Published As

Publication number Publication date
AU2003266486A1 (en) 2004-04-19
WO2004029327A1 (en) 2004-04-08
EP1546435B1 (en) 2007-07-25
DE60315170D1 (en) 2007-09-06
ATE368136T1 (en) 2007-08-15
US20060000720A1 (en) 2006-01-05
EP1546435A1 (en) 2005-06-29
DK175025B1 (en) 2004-05-03

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