DK2052013T5 - Fremgangsmåde til sammenføjning af plastdele elektriske eller elektroniske komponenter - Google Patents
Fremgangsmåde til sammenføjning af plastdele elektriske eller elektroniske komponenter Download PDFInfo
- Publication number
- DK2052013T5 DK2052013T5 DK07801659.9T DK07801659T DK2052013T5 DK 2052013 T5 DK2052013 T5 DK 2052013T5 DK 07801659 T DK07801659 T DK 07801659T DK 2052013 T5 DK2052013 T5 DK 2052013T5
- Authority
- DK
- Denmark
- Prior art keywords
- adhesive
- bonded
- parts
- process according
- plastic parts
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 60
- 229920003023 plastic Polymers 0.000 title claims description 59
- 239000004033 plastic Substances 0.000 title claims description 59
- 238000005304 joining Methods 0.000 title description 3
- 239000000853 adhesive Substances 0.000 claims description 61
- 230000001070 adhesive effect Effects 0.000 claims description 57
- 230000008569 process Effects 0.000 claims description 54
- 229920002647 polyamide Polymers 0.000 claims description 36
- 239000004952 Polyamide Substances 0.000 claims description 34
- 230000005405 multipole Effects 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 4
- 235000019253 formic acid Nutrition 0.000 claims description 4
- 230000000877 morphologic effect Effects 0.000 claims description 4
- 239000002998 adhesive polymer Substances 0.000 claims description 3
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229920006345 thermoplastic polyamide Polymers 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 239000002612 dispersion medium Substances 0.000 claims 4
- 239000004615 ingredient Substances 0.000 claims 2
- 239000002671 adjuvant Substances 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 239000000314 lubricant Substances 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 32
- 239000000463 material Substances 0.000 description 19
- 238000003466 welding Methods 0.000 description 16
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000002861 polymer material Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 101150105088 Dele1 gene Proteins 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- -1 for example Polymers 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- XAUQWYHSQICPAZ-UHFFFAOYSA-N 10-amino-decanoic acid Chemical compound NCCCCCCCCCC(O)=O XAUQWYHSQICPAZ-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- XDOLZJYETYVRKV-UHFFFAOYSA-N 7-Aminoheptanoic acid Chemical compound NCCCCCCC(O)=O XDOLZJYETYVRKV-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 244000089742 Citrus aurantifolia Species 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- 244000303965 Cyamopsis psoralioides Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007707 calorimetry Methods 0.000 description 1
- 239000000919 ceramic Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005594 polymer fiber Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000008521 reorganization Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 229920006134 semi-aromatic non-crystalline polyamide resin Polymers 0.000 description 1
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/121—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives by heating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C08J5/125—Adhesives in organic diluents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Claims (11)
1. Fremgangsmåde til binding af to eller flere dele henholdsvis bestående af termoplastiske polyamider og tilhørende en elektrisk eller elektronisk komponent, fortrinsvis en flerpolet stikforbindelse, hvor plastdelene skal sættes sammen til hinanden ved hjælp af et klæbemiddel i en klæbemiddelbindingsproces, hvor klæbemidlet først påføres på kontaktfladerne af de dele, der skal klæbes, og derefter presses kontaktområderne sammen, hvor det klæbemiddel, der anvendes, omfatter et fysisk indstillingsopløsningsmiddel eller fysisk indstillende dispersionsklæbemiddel, der er formuleret til at være kompatibelt med plasten, hvoraf plastikdelene, der skal klæbebindes, består ved anvendelse af et polyamid som klæbende polymer ved kvantitative koncentrationer fra 18 til 35 procent i masse i henholdsvis opløsningsmidlet eller dispersionsmediet, som anvendes fra klæbemidlet, hvor de morfologiske egenskaber af klæbemidlets polyamid svarer til de morfologiske egenskaber af polyamidet af plastdelene, der skal bindes, og hvor myresyre anvendes som opløsningsmiddel eller dispersionsmedium.
2. Fremgangsmåde ifølge krav 1, kendetegnet ved, at plastdelene, der skal klæbebindes, er fremstillet ved en sprøjtestøbningsproces.
3. Fremgangsmåde ifølge krav 1 eller 2, kendetegnet ved, at kogepunktet for opløsningsmidlet eller dispersionsmediet ligger i området fra 0 til 110 ° C.
4. Fremgangsmåde ifølge et hvilket som helst af kravene 1 til 3, kendetegnet ved, at klæbemidlet fremstilles in situ ved, umiddelbart efter påføringen af klæbemidlet, at blande klæbestoffets komponenter sammen efter behov, nemlig klæbemiddelpolymeren på hånden og opløsningen eller dispersionen medium på den anden side.
5. Fremgangsmåde ifølge krav 1 til 4, kendetegnet ved, at yderligere ingredienser tilsættes til klæbemidlet, nemlig additiver og / eller hjælpestoffer valgt blandt fyldstoffer, pigmenter, flammehæmmere, stabilisatorer, smøremidler, blødgørere og blandinger af disse, hvor de yderligere bestanddele af klæbemidlet vælges for at være kompatibelt med plastdelene, der skal limes sammen.
6. Fremgangsmåde ifølge kravene 1 til 5 er kendetegnet ved, at fremgangsmåden udføres ved temperaturer i området fra 15 til 30 ° C.
7. Fremgangsmåde ifølge et hvilket som helst af kravene 1 til 6, kendetegnet ved, at klæbemidlet påføres ved hjælp af spot-applikation, påføring ved sprøjtedyse eller doktorering til de kontaktområder af plastdelene, der skal klæbes sammen, og et tryk fra 0,1 til 20 N / cm2 påføres for at presse kontraktområderne sammen.
8. Fremgangsmåde ifølge et hvilket som helst af kravene 1 til 7, kendetegnet ved, at den anvendte mængde af klæbemidlet er fra 0,05 til 0,3 mm og / eller at dimensionen af det klæbemiddelbundne produkt styres ved hjælp af den valgte tykkelse af klæbemiddellaget.
9. Fremgangsmåde ifølge et hvilket som helst af kravene 1 til 8, kendetegnet ved, at det hærde klæbende lag på den ene side og den klæbemiddelbundne plast har på den anden side identiske krystalliniteter og / eller morfologier og / eller glas overgangs temperaturer.
10. Fremgangsmåde ifølge et hvilket som helst af kravene 1 til 9, kendetegnet ved, at plastdele, der skal klæbes, er modulære dele af en flerpolet stikkontakt.
11. Elektrisk eller elektronisk komponent i form af en flerpolet stikforbindelse, hvor komponenten har henholdsvis to eller flere husdele bestående af polyamider, der er bundet til hinanden, Karakteriseret i at bindingen mellem plastdelene er blevet fremstillet ved en vedhæftningsproces ifølge et hvilket som helst af kravene 1 til 10.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006038330A DE102006038330A1 (de) | 2006-08-15 | 2006-08-15 | Verfahren zum Verbinden von Kunststoffteilen elektrischer oder elektronischer Bauteile, insbesondere von Steckverbindern, und auf diese Weise erhaltene Produkte |
| PCT/EP2007/007195 WO2008019833A1 (de) | 2006-08-15 | 2007-08-15 | Verfahren zum verbinden von kunststoffteilen elektrischer oder elektronischer bauteile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK2052013T3 DK2052013T3 (da) | 2018-07-30 |
| DK2052013T5 true DK2052013T5 (da) | 2019-02-25 |
Family
ID=38736083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK07801659.9T DK2052013T5 (da) | 2006-08-15 | 2007-08-15 | Fremgangsmåde til sammenføjning af plastdele elektriske eller elektroniske komponenter |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20110092101A1 (da) |
| EP (1) | EP2052013B1 (da) |
| JP (1) | JP5240584B2 (da) |
| KR (1) | KR101498565B1 (da) |
| CN (1) | CN101501111B (da) |
| DE (1) | DE102006038330A1 (da) |
| DK (1) | DK2052013T5 (da) |
| WO (1) | WO2008019833A1 (da) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286263A (zh) * | 2011-06-15 | 2011-12-21 | 蒋德海 | 一种锭带粘合胶 |
| DE102013111867A1 (de) | 2013-10-28 | 2015-04-30 | Phoenix Contact Gmbh & Co. Kg | Anschlusszeile für eine Anschlussvorrichtung |
| DE102018124322A1 (de) * | 2018-10-02 | 2020-04-02 | Phoenix Contact Gmbh & Co. Kg | Baugruppe einer elektrischen Einrichtung und Verfahren zum Herstellen einer solchen Baugruppe |
| BE1028555B1 (de) * | 2020-08-20 | 2022-03-22 | Phoenix Contact Gmbh & Co | Verfahren zum Herstellen einer elektrischen Anschlussanordnung und elektrische Anschlussanordnung |
| AU2021366642A1 (en) * | 2020-10-20 | 2023-04-06 | Bostik, Inc. | Amorphous copolyester resins for use as a cold seal adhesive, coating compositions comprising the same, and methods for adhering substrates using the coating compositions |
| CN113013699B (zh) * | 2021-03-02 | 2024-10-29 | 富加宜连接器（东莞）有限公司 | 一种内存条连接器快速贴高温胶装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB748607A (en) * | 1953-05-04 | 1956-05-09 | Small & Parkes Ltd | Improved bonding compositions for bonding surfaces of nylon |
| BE550803A (da) * | 1955-09-06 | |||
| BE634335A (da) * | 1962-11-19 | |||
| DE1594117A1 (de) * | 1967-01-11 | 1969-08-28 | Henkel & Cie Gmbh | Klebmittel fuer Polyamide |
| US3616963A (en) * | 1967-02-24 | 1971-11-02 | Grace W R & Co | Polyamide epoxy resin reaction product adhesive |
| US4191987A (en) * | 1978-02-24 | 1980-03-04 | Gerald Coren | Clip-on protector |
| JPS5817155A (ja) * | 1981-07-09 | 1983-02-01 | イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− | ポリアミド樹脂組成物 |
| DE3700981A1 (de) * | 1987-01-15 | 1988-07-28 | Geiger Plastic Verwaltung | Verfahren fuer die verbindung von teilen aus polyamid durch friktionsschweissen |
| GB8708386D0 (en) * | 1987-04-08 | 1987-05-13 | Cesaroni A J | Heat sealing of polyamides |
| DE3800846A1 (de) * | 1988-01-14 | 1989-07-27 | Phoenix Elekt | Steckverbindungsleiste |
| JPH0244668A (ja) * | 1988-08-04 | 1990-02-14 | Matsushita Electric Ind Co Ltd | 電気部品 |
| NZ231391A (en) * | 1988-11-18 | 1992-04-28 | Australian Gas Light Co | Adhesive composition comprising a dialkyl phenol and a polyamide |
| JPH0359070A (ja) * | 1989-07-28 | 1991-03-14 | Toray Ind Inc | 繊維接着用粉体 |
| JPH03173910A (ja) * | 1989-11-30 | 1991-07-29 | Nec Kansai Ltd | 薄膜磁気ヘッド |
| FR2718073B1 (fr) * | 1994-03-30 | 1996-05-03 | Rhone Poulenc Chimie | Procédé d'assemblage par soudage de pièces en compositions thermoplastiques à base de polyamides. |
| JPH11116799A (ja) * | 1997-09-30 | 1999-04-27 | E I Du Pont De Nemours & Co | 溶着用ポリアミド組成物 |
| JP2912914B1 (ja) * | 1998-06-08 | 1999-06-28 | 岐阜県 | 繊維強化基材及びその製造方法並びに繊維強化材料及びその製造方法 |
| DE10040762A1 (de) * | 2000-08-19 | 2002-03-07 | Henkel Kgaa | Formteile aus Dimerfettsäurefreie Polyamiden |
| JP2002134219A (ja) * | 2000-10-30 | 2002-05-10 | Yazaki Corp | 防水コネクタ及び該防水コネクタの製造方法 |
| EP1254919A1 (en) * | 2001-05-04 | 2002-11-06 | Dsm N.V. | Process for the welding of two polyamide parts |
| JP2003089783A (ja) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | ナイロン樹脂成形品用接着剤 |
| JP4246619B2 (ja) * | 2003-01-10 | 2009-04-02 | 株式会社 型善 | ポリアミド樹脂の接合助剤、並びにこれを用いた射出成形接合方法、及び超音波溶着接合方法 |
| DE102004009071B4 (de) * | 2004-02-23 | 2006-06-14 | Phoenix Contact Gmbh & Co. Kg | Elektrischer Steckverbinder |
| KR100444925B1 (ko) * | 2004-04-19 | 2004-08-21 | (주)새한마이크로닉스 | 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프 |
-
2006
- 2006-08-15 DE DE102006038330A patent/DE102006038330A1/de not_active Ceased
-
2007
- 2007-08-15 KR KR1020097005434A patent/KR101498565B1/ko not_active Expired - Fee Related
- 2007-08-15 EP EP07801659.9A patent/EP2052013B1/de not_active Not-in-force
- 2007-08-15 JP JP2009524118A patent/JP5240584B2/ja not_active Expired - Fee Related
- 2007-08-15 DK DK07801659.9T patent/DK2052013T5/da active
- 2007-08-15 WO PCT/EP2007/007195 patent/WO2008019833A1/de not_active Ceased
- 2007-08-15 US US12/377,547 patent/US20110092101A1/en not_active Abandoned
- 2007-08-15 CN CN200780030257XA patent/CN101501111B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010500728A (ja) | 2010-01-07 |
| KR20090045346A (ko) | 2009-05-07 |
| CN101501111B (zh) | 2012-09-05 |
| DE102006038330A1 (de) | 2008-02-21 |
| JP5240584B2 (ja) | 2013-07-17 |
| CN101501111A (zh) | 2009-08-05 |
| DE102006038330A8 (de) | 2008-06-19 |
| WO2008019833A1 (de) | 2008-02-21 |
| EP2052013B1 (de) | 2018-04-25 |
| US20110092101A1 (en) | 2011-04-21 |
| KR101498565B1 (ko) | 2015-03-04 |
| EP2052013A1 (de) | 2009-04-29 |
| DK2052013T3 (da) | 2018-07-30 |
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