DK252987A - Bad til galvanisk forgyldning - Google Patents

Bad til galvanisk forgyldning

Info

Publication number: DK252987A
Authority: DK; Denmark
Prior art keywords: bathroom; gold; acrylic acid; gilding; galvanic
Prior art date: 1986-05-21

Application number

DK252987A

Other languages

English (en)

Other versions

DK168303B1 (da

DK252987D0 (da

Inventor

Peter Wilkinson

Original Assignee

Engelhard Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-05-21

Filing date

1987-05-19

Publication date

1987-11-22

1987-05-19 Application filed by Engelhard Corp filed Critical Engelhard Corp

1987-05-19 Publication of DK252987D0 publication Critical patent/DK252987D0/da

1987-11-22 Publication of DK252987A publication Critical patent/DK252987A/da

1994-03-07 Application granted granted Critical

1994-03-07 Publication of DK168303B1 publication Critical patent/DK168303B1/da

Links

PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
239000000654 additive Substances 0.000 abstract 2
230000000996 additive effect Effects 0.000 abstract 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
229910052737 gold Inorganic materials 0.000 abstract 2
239000010931 gold Substances 0.000 abstract 2
VUVORVXMOLQFMO-ONEGZZNKSA-N (e)-3-pyridin-3-ylprop-2-enoic acid Chemical compound OC(=O)\C=C\C1=CC=CN=C1 VUVORVXMOLQFMO-ONEGZZNKSA-N 0.000 abstract 1
YBIWIEFOLKWDNV-UHFFFAOYSA-N 3-quinolin-3-ylprop-2-enoic acid Chemical compound C1=CC=CC2=CC(C=CC(=O)O)=CN=C21 YBIWIEFOLKWDNV-UHFFFAOYSA-N 0.000 abstract 1
239000002253 acid Substances 0.000 abstract 1
229910017052 cobalt Inorganic materials 0.000 abstract 1
239000010941 cobalt Substances 0.000 abstract 1
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
238000009713 electroplating Methods 0.000 abstract 1
150000002505 iron Chemical class 0.000 abstract 1
229910052759 nickel Inorganic materials 0.000 abstract 1
XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Building Environments (AREA)
Residential Or Office Buildings (AREA)
Electrolytic Production Of Metals (AREA)
Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)

DK252987A 1986-05-21 1987-05-19 Guldelektropletteringsbad og fremgangsmåde til elektroplettering DK168303B1 (da)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
GB8612361		1986-05-21
GB868612361A GB8612361D0 (en)	1986-05-21	1986-05-21	Gold electroplating bath

Publications (3)

Publication Number	Publication Date
DK252987D0 DK252987D0 (da)	1987-05-19
DK252987A true DK252987A (da)	1987-11-22
DK168303B1 DK168303B1 (da)	1994-03-07

Family

ID=10598205

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK252987A DK168303B1 (da)	1986-05-21	1987-05-19	Guldelektropletteringsbad og fremgangsmåde til elektroplettering

Country Status (14)

Country	Link
US (1)	US4767507A (da)
EP (1)	EP0246869B1 (da)
JP (1)	JPS62287094A (da)
KR (1)	KR870011277A (da)
AT (1)	ATE68835T1 (da)
DE (1)	DE3773990D1 (da)
DK (1)	DK168303B1 (da)
ES (1)	ES2026910T3 (da)
FI (1)	FI872065A7 (da)
GB (1)	GB8612361D0 (da)
GR (1)	GR3002980T3 (da)
HK (1)	HK58592A (da)
NO (1)	NO872114L (da)
SG (1)	SG16192G (da)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5039381A (en) *	1989-05-25	1991-08-13	Mullarkey Edward J	Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
JP2779207B2 (ja) *	1989-06-06	1998-07-23	富士通株式会社	半導体装置の製造方法
US6417366B2 (en) *	1999-06-24	2002-07-09	Abbott Laboratories	Preparation of quinoline-substituted carbonate and carbamate derivatives
FR2807422B1 (fr) *	2000-04-06	2002-07-05	Engelhard Clal Sas	Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR2807450B1 (fr) *	2000-04-06	2002-07-05	Engelhard Clal Sas	Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
FR2828889B1 (fr) *	2001-08-24	2004-05-07	Engelhard Clal Sas	Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7279086B2 (en) *	2003-05-21	2007-10-09	Technic, Inc.	Electroplating solution for alloys of gold with tin
JP5116956B2 (ja) *	2005-07-14	2013-01-09	関東化学株式会社	無電解硬質金めっき液
JP4868116B2 (ja) *	2005-09-30	2012-02-01	学校法人早稲田大学	金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
JP5317433B2 (ja) *	2007-06-06	2013-10-16	ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー．	酸性金合金めっき液
JP5854727B2 (ja)	2010-09-21	2016-02-09	ロームアンドハースエレクトロニックマテリアルズエルエルシーＲｏｈｍａｎｄＨａａｓＥｌｅｃｔｒｏｎｉｃＭａｔｅｒｉａｌｓＬＬＣ	シアン化物を含まない銀電気めっき液
EP2990507A1 (en) *	2014-08-25	2016-03-02	ATOTECH Deutschland GmbH	Composition, use thereof and method for electrodepositing gold containing layers
DE102016211594A1 (de) *	2016-06-28	2017-12-28	Voith Patent Gmbh	Elektrokontakt-Kupplung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH455434A (de) *	1963-08-15	1968-07-15	Werner Fluehmann Galvanische A	Verfahren zur Herstellung von Weissgoldüberzügen
DE2237807C3 (de) *	1972-08-01	1978-04-27	Langbein-Pfanhauser Werke Ag, 4040 Neuss	Verfahren zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
DE2355581C3 (de) *	1973-11-07	1979-07-12	Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt	Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
US4038161A (en) *	1976-03-05	1977-07-26	R. O. Hull & Company, Inc.	Acid copper plating and additive composition therefor
GB8334226D0 (en) *	1983-12-22	1984-02-01	Learonal Uk Ltd	Electrodeposition of gold alloys

1986
- 1986-05-21 GB GB868612361A patent/GB8612361D0/en active Pending
1987
- 1987-05-11 FI FI872065A patent/FI872065A7/fi not_active Application Discontinuation
- 1987-05-19 ES ES198787304445T patent/ES2026910T3/es not_active Expired - Lifetime
- 1987-05-19 DE DE8787304445T patent/DE3773990D1/de not_active Expired - Lifetime
- 1987-05-19 DK DK252987A patent/DK168303B1/da active IP Right Grant
- 1987-05-19 AT AT87304445T patent/ATE68835T1/de not_active IP Right Cessation
- 1987-05-19 EP EP87304445A patent/EP0246869B1/en not_active Expired - Lifetime
- 1987-05-20 NO NO872114A patent/NO872114L/no unknown
- 1987-05-20 JP JP62121429A patent/JPS62287094A/ja active Pending
- 1987-05-20 KR KR870004986A patent/KR870011277A/ko not_active Withdrawn
1988
- 1988-01-11 US US07/144,607 patent/US4767507A/en not_active Expired - Lifetime
1991
- 1991-10-24 GR GR91400797T patent/GR3002980T3/el unknown
1992
- 1992-02-19 SG SG161/92A patent/SG16192G/en unknown
- 1992-08-06 HK HK585/92A patent/HK58592A/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
DE3773990D1 (de)	1991-11-28
ES2026910T3 (es)	1992-05-16
KR870011277A (ko)	1987-12-22
NO872114L (no)	1987-11-23
DK168303B1 (da)	1994-03-07
SG16192G (en)	1992-04-16
HK58592A (en)	1992-08-14
FI872065A0 (fi)	1987-05-11
FI872065L (fi)	1987-11-22
EP0246869B1 (en)	1991-10-23
US4767507A (en)	1988-08-30
JPS62287094A (ja)	1987-12-12
GR3002980T3 (en)	1993-01-25
GB8612361D0 (en)	1986-06-25
DK252987D0 (da)	1987-05-19
EP0246869A1 (en)	1987-11-25
ATE68835T1 (de)	1991-11-15
NO872114D0 (no)	1987-05-20
FI872065A7 (fi)	1987-11-22

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IT8447591A0 (it)	1984-01-25	Soluzione elettrolitica e metodo per elettrodepositare oro brillante a bassa durezza
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SE8002598L (sv)	1980-10-05	Silver- och silver/guld-pleteringsbad
BE868015A (fr)	1978-10-02	Electrodeposition d'un alliage de fer, nickel et/ou cobalt
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IT1171616B (it)	1987-06-10	Procedimento di elettrodeposizione di oro su sostrati ricoperti con elettrodeposizione di nickel
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KR870003234A (ko)	1987-04-16	전자부품의 도금방법
DE3472115D1 (en)	1988-07-21	Galvanic bath for the electroplating of a gold-copper-cadmium alloy, process for using it and article resulting from the process
ATE40576T1 (de)	1989-02-15	Verfahren zum elektroplattieren von stahldraehten und so hergestellte bekleidete draehte.
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Legal Events

Date	Code	Title	Description
1994-03-07	B1	Patent granted (law 1993)