DK3230796T3 - Poly- eller præpolymersammensætning eller prægelak, der omfatter en sådan sammensætning, og anvendelse deraf - Google Patents

Poly- eller præpolymersammensætning eller prægelak, der omfatter en sådan sammensætning, og anvendelse deraf Download PDF

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Publication number
DK3230796T3
DK3230796T3 DK15817054.8T DK15817054T DK3230796T3 DK 3230796 T3 DK3230796 T3 DK 3230796T3 DK 15817054 T DK15817054 T DK 15817054T DK 3230796 T3 DK3230796 T3 DK 3230796T3
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Denmark
Prior art keywords
composition
prevention
polymer
embodiment composition
Prior art date
Application number
DK15817054.8T
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English (en)
Inventor
Dieter Nees
Markus Leitgeb
Barbara Stadlober
Stephan Ruttloff
André Lintschnig
Valentin Satzinger
Original Assignee
Joanneum Res Forschungsgmbh
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Publication of DK3230796T3 publication Critical patent/DK3230796T3/da

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Paints Or Removers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DK15817054.8T 2014-12-10 2015-12-09 Poly- eller præpolymersammensætning eller prægelak, der omfatter en sådan sammensætning, og anvendelse deraf DK3230796T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA888/2014A AT516559B1 (de) 2014-12-10 2014-12-10 Poly- bzw. Präpolymerzusammensetzung bzw. Prägelack, umfassend eine derartige Zusammensetzung sowie Verwendung derselben
PCT/AT2015/000157 WO2016090395A1 (de) 2014-12-10 2015-12-09 Poly- bzw. präpolymerzusammensetzung bzw. prägelack, umfassend eine derartige zusammenstzung und verwendung desselben

Publications (1)

Publication Number Publication Date
DK3230796T3 true DK3230796T3 (da) 2019-07-15

Family

ID=55066254

Family Applications (1)

Application Number Title Priority Date Filing Date
DK15817054.8T DK3230796T3 (da) 2014-12-10 2015-12-09 Poly- eller præpolymersammensætning eller prægelak, der omfatter en sådan sammensætning, og anvendelse deraf

Country Status (10)

Country Link
US (1) US10308768B2 (da)
EP (1) EP3230796B1 (da)
JP (1) JP6640870B2 (da)
KR (1) KR102423758B1 (da)
CN (1) CN107533287B (da)
AT (1) AT516559B1 (da)
DK (1) DK3230796T3 (da)
ES (1) ES2743812T3 (da)
HK (1) HK1244068B (da)
WO (1) WO2016090395A1 (da)

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DE102017201991A1 (de) 2017-02-08 2018-08-09 Lufthansa Technik Ag Prägelackzusammensetzung, daraus hergestellte mikrostrukturierte Oberfläche und Flugzeugbauteil mit einer solchen mikrostrukturierten Oberfläche
DE102017201990A1 (de) 2017-02-08 2018-08-09 Lufthansa Technik Ag Aushärtbare Vorläuferbeschichtung, daraus hergestellte mikrostrukturierte Oberflächenbeschichtung und Verfahren zur Herstellung einer mikrostrukturierten Oberflächenbeschichtung
DE102017202675A1 (de) 2017-02-20 2018-08-23 Lufthansa Technik Ag Prägelackzusammensetzung, daraus hergestellte mikrostrukturierte Oberfläche und Flugzeugbauteil mit einer solchen mikrostrukturierten Oberfläche
DE102017218543A1 (de) * 2017-10-17 2019-04-18 Lufthansa Technik Ag Strömungsoptimierte Oberfläche und Fahrzeug mit einer derartigen strömungsoptimierten Oberfläche
KR102877919B1 (ko) * 2018-03-28 2025-10-31 바스프 코팅스 게엠베하 엠보싱 구조를 코팅의 표면으로 전사시키는 방법 및 상기 코팅을 함유하는 화합물 구조
CA3093719A1 (en) 2018-03-28 2019-10-03 Basf Coatings Gmbh Method for transferring an embossed structure to the surface of a coating means and compound structure usable as an embossing die
CN108977048A (zh) * 2018-06-08 2018-12-11 上海展辰涂料有限公司 一种uv耐磨高硬度地板漆
JP7105171B2 (ja) * 2018-10-30 2022-07-22 三菱電線工業株式会社 シール材及びそれに用いるコーティング剤
US20200207142A1 (en) * 2019-01-02 2020-07-02 Macdermid Graphics Solutions Llc Liquid Photopolymer Resin Compositions for Flexographic Printing
ES2971522T3 (es) 2019-09-25 2024-06-05 Basf Coatings Gmbh Método para transferir una estructura grabada a la superficie de un recubrimiento, y material compuesto empleable como molde de grabado
DE102020123252A1 (de) 2019-12-12 2021-06-17 Heliatek Gmbh Beschichtung für ein optoelektronisches Bauelement, Verfahren zur Herstellung einer solchen Beschichtung, optoelektronisches Bauelement mit einer solchen Beschichtung
CN111077732A (zh) * 2019-12-20 2020-04-28 深圳市华星光电半导体显示技术有限公司 光耦合输出透镜的材料组成物及制造方法
EP3923072A1 (en) * 2020-06-08 2021-12-15 Joanneum Research Forschungsgesellschaft mbH A method of preparing an embossed structure, embossed structure and use thereof
CN113050371B (zh) * 2021-04-09 2025-02-11 深圳技术大学 基于丝网印刷的亚微米压印设备及其控制方法
EP4160312A1 (en) 2021-10-04 2023-04-05 Joanneum Research Forschungsgesellschaft mbH Elastic embossing lacquer having high optical dispersion
WO2023072369A1 (de) * 2021-10-26 2023-05-04 Joanneum Research Forschungsgesellschaft Mbh Prägelacke mit aliphatischen photoinitiatoren und biobasierte mikrostruktursysteme
DE102021134562A1 (de) * 2021-12-23 2023-06-29 INM - Leibniz-Institut für Neue Materialien gemeinnützige Gesellschaft mit beschränkter Haftung Härtbare Zusammensetzung und ihre Anwendung
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CN115894919B (zh) * 2022-11-15 2024-02-09 中国科学院兰州化学物理研究所 一种交联梯度双晶相聚氨酯及其制备方法和应用

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Also Published As

Publication number Publication date
JP2018505288A (ja) 2018-02-22
US20170349707A1 (en) 2017-12-07
EP3230796A1 (de) 2017-10-18
KR102423758B1 (ko) 2022-07-20
CN107533287B (zh) 2021-06-01
WO2016090395A1 (de) 2016-06-16
JP6640870B2 (ja) 2020-02-05
US10308768B2 (en) 2019-06-04
AT516559A1 (de) 2016-06-15
CN107533287A (zh) 2018-01-02
KR20170093229A (ko) 2017-08-14
ES2743812T3 (es) 2020-02-20
WO2016090395A8 (de) 2018-09-07
HK1244068B (zh) 2020-03-20
EP3230796B1 (de) 2019-06-05
AT516559B1 (de) 2017-12-15

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