DK3799705T3 - Køling af elektroniske enheder i et datacenter - Google Patents

Køling af elektroniske enheder i et datacenter Download PDF

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Publication number
DK3799705T3
DK3799705T3 DK19804991.8T DK19804991T DK3799705T3 DK 3799705 T3 DK3799705 T3 DK 3799705T3 DK 19804991 T DK19804991 T DK 19804991T DK 3799705 T3 DK3799705 T3 DK 3799705T3
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DK
Denmark
Prior art keywords
cooling
electronic devices
data center
center
data
Prior art date
Application number
DK19804991.8T
Other languages
English (en)
Inventor
Christopher Gregory Malone
Madhusudan Krishnan Iyengar
Yuan Li
Jorge Padilla
Woon-Seong Kwon
Teckgyu Kang
Norman Paul Jouppi
Original Assignee
Google Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Llc filed Critical Google Llc
Application granted granted Critical
Publication of DK3799705T3 publication Critical patent/DK3799705T3/da

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DK19804991.8T 2019-01-11 2019-10-25 Køling af elektroniske enheder i et datacenter DK3799705T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/246,013 US10548240B1 (en) 2019-01-11 2019-01-11 Cooling electronic devices in a data center
PCT/US2019/058010 WO2020146033A1 (en) 2019-01-11 2019-10-25 Cooling electronic devices in a data center

Publications (1)

Publication Number Publication Date
DK3799705T3 true DK3799705T3 (da) 2024-11-04

Family

ID=68582411

Family Applications (1)

Application Number Title Priority Date Filing Date
DK19804991.8T DK3799705T3 (da) 2019-01-11 2019-10-25 Køling af elektroniske enheder i et datacenter

Country Status (7)

Country Link
US (1) US10548240B1 (da)
EP (1) EP3799705B1 (da)
CN (1) CN112369131B (da)
DK (1) DK3799705T3 (da)
FI (1) FI3799705T3 (da)
TW (1) TWI724620B (da)
WO (1) WO2020146033A1 (da)

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US12490410B2 (en) 2021-12-06 2025-12-02 Intel Corporation Circuit devices integrated with boiling enhancement for two-phase immersion cooling
CN116564906A (zh) 2022-01-28 2023-08-08 群创光电股份有限公司 电子装置
US20230301019A1 (en) * 2022-03-18 2023-09-21 Baidu Usa Llc System on a chip based cooling system
CN115390647A (zh) * 2022-08-31 2022-11-25 英业达科技有限公司 一种冷却装置
JP2024113442A (ja) * 2023-02-09 2024-08-22 三菱重工業株式会社 冷却装置

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US10548240B1 (en) 2020-01-28
TWI724620B (zh) 2021-04-11
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EP3799705B1 (en) 2024-09-04
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