DK3785502T3 - Tilvejebringelse af væskekølet udstyr til datacenter - Google Patents

Tilvejebringelse af væskekølet udstyr til datacenter Download PDF

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Publication number
DK3785502T3
DK3785502T3 DK19752835.9T DK19752835T DK3785502T3 DK 3785502 T3 DK3785502 T3 DK 3785502T3 DK 19752835 T DK19752835 T DK 19752835T DK 3785502 T3 DK3785502 T3 DK 3785502T3
Authority
DK
Denmark
Prior art keywords
supply
liquid
data centers
cooled equipment
cooled
Prior art date
Application number
DK19752835.9T
Other languages
English (en)
Inventor
Jerry Chiu
Skyler Salman
Madhusudan Krishnan Iyengar
Original Assignee
Google Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Llc filed Critical Google Llc
Application granted granted Critical
Publication of DK3785502T3 publication Critical patent/DK3785502T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
DK19752835.9T 2018-12-05 2019-07-31 Tilvejebringelse af væskekølet udstyr til datacenter DK3785502T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862775513P 2018-12-05 2018-12-05
US16/250,418 US10869412B2 (en) 2018-12-05 2019-01-17 Provisioning data center server cooling equipment
PCT/US2019/044409 WO2020117326A1 (en) 2018-12-05 2019-07-31 Provisioning data center server cooling equipment

Publications (1)

Publication Number Publication Date
DK3785502T3 true DK3785502T3 (da) 2023-07-10

Family

ID=70970699

Family Applications (1)

Application Number Title Priority Date Filing Date
DK19752835.9T DK3785502T3 (da) 2018-12-05 2019-07-31 Tilvejebringelse af væskekølet udstyr til datacenter

Country Status (6)

Country Link
US (2) US10869412B2 (da)
EP (1) EP3785502B1 (da)
CN (2) CN113170594B (da)
DK (1) DK3785502T3 (da)
FI (1) FI3785502T3 (da)
WO (1) WO2020117326A1 (da)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11229143B2 (en) * 2019-10-29 2022-01-18 Asia Vital Components Co., Ltd. Liquid-cooling heat dissipation system capable of regulating water quality
US11445631B2 (en) * 2020-03-19 2022-09-13 Baidu Usa Llc High performance computing based holistic liquid cooled rack cost optimization
CN114942868B (zh) * 2022-04-08 2026-04-21 阿里巴巴（中国）有限公司 数据中心的测试设备、测试方法及数据中心测试系统
US12520452B2 (en) 2022-05-04 2026-01-06 Hoffman Enclosures Inc. Replaceable pump unit for cooling systems
WO2023215620A1 (en) * 2022-05-05 2023-11-09 Hoffman Enclosures Inc. Liquid cooling system fill kit and method of use
US12349311B2 (en) * 2022-07-28 2025-07-01 Dell Products L.P. Systems and methods for filling and draining liquid of a liquid cooling system
US20240314986A1 (en) * 2023-03-14 2024-09-19 Schneider Electric It Corporation Manifold and methods to implement liquid cooling in an uninterruptible power supply
US20240373585A1 (en) * 2023-05-07 2024-11-07 Abdul Luke Gomez GSGDG 7154 Computer System

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US4513696A (en) 1982-05-24 1985-04-30 Toyo Kogyo Co., Ltd. Apparatus for charging cooling liquid to engine cooling system
JP2748732B2 (ja) 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
US6161578A (en) * 1996-10-09 2000-12-19 Colder Products Company Low spill high flow quick coupling valve assembly
US6880351B2 (en) * 2001-09-05 2005-04-19 Be Intellectual Property, Inc. Liquid galley refrigeration system for aircraft
US7043933B1 (en) 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
US7106590B2 (en) * 2003-12-03 2006-09-12 International Business Machines Corporation Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
US7270174B2 (en) 2003-12-16 2007-09-18 International Business Machines Corporation Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment
US20070193721A1 (en) 2006-02-21 2007-08-23 Tilton Donald E Automated Venting and Refilling of Multiple Liquid Cooling Systems
US7508665B1 (en) 2006-10-18 2009-03-24 Isothermal Systems Research, Inc. Server farm liquid thermal management system
US10123463B2 (en) * 2008-08-11 2018-11-06 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and method of cooling such a server rack
US8500419B2 (en) * 2008-11-10 2013-08-06 Schlumberger Technology Corporation Subsea pumping system with interchangable pumping units
US9010141B2 (en) 2010-04-19 2015-04-21 Chilldyne, Inc. Computer cooling system and method of use
US20110253347A1 (en) * 2010-04-19 2011-10-20 Steve Harrington Vacuum Pumped Liquid Cooling System for Computers
JP6191104B2 (ja) * 2012-09-07 2017-09-06 富士通株式会社 冷媒供給ユニット、冷却ユニット及び電子機器
US9464854B2 (en) * 2013-02-01 2016-10-11 Dell Products, Lp Techniques for controlling vapor pressure in an immersion cooling tank
US8820351B1 (en) * 2013-06-25 2014-09-02 Chilldyne, Inc. No drip hot swap connector and method of use
WO2016012379A1 (de) * 2014-07-21 2016-01-28 Nidec Gpm Gmbh Kühlmittelpumpe mit integrierter regelung
US9398731B1 (en) * 2014-09-23 2016-07-19 Google Inc. Cooling electronic devices in a data center
US9713286B2 (en) * 2015-03-03 2017-07-18 International Business Machines Corporation Active control for two-phase cooling
US9980415B2 (en) * 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
US10342163B2 (en) * 2015-12-02 2019-07-02 Google Llc Cooling a data center

Also Published As

Publication number Publication date
US20200187388A1 (en) 2020-06-11
CN113170594B (zh) 2022-05-17
EP3785502B1 (en) 2023-04-12
CN114745926B (zh) 2024-11-01
US20210068309A1 (en) 2021-03-04
FI3785502T3 (fi) 2023-06-08
EP3785502A1 (en) 2021-03-03
US11197397B2 (en) 2021-12-07
US10869412B2 (en) 2020-12-15
CN113170594A (zh) 2021-07-23
WO2020117326A1 (en) 2020-06-11
CN114745926A (zh) 2022-07-12

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