DK385578A - Trykt kredsloebsplade med komponenter og fremgangsmaade til dens fremstilling - Google Patents

Trykt kredsloebsplade med komponenter og fremgangsmaade til dens fremstilling

Info

Publication number
DK385578A
DK385578A DK385578A DK385578A DK385578A DK 385578 A DK385578 A DK 385578A DK 385578 A DK385578 A DK 385578A DK 385578 A DK385578 A DK 385578A DK 385578 A DK385578 A DK 385578A
Authority
DK
Denmark
Prior art keywords
procedure
manufacture
components
printed circuit
circuit plate
Prior art date
Application number
DK385578A
Other languages
English (en)
Other versions
DK152480C (da
DK152480B (da
Inventor
F Stahl
Original Assignee
Kollmorgen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen filed Critical Kollmorgen
Publication of DK385578A publication Critical patent/DK385578A/da
Publication of DK152480B publication Critical patent/DK152480B/da
Application granted granted Critical
Publication of DK152480C publication Critical patent/DK152480C/da

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936Marks, inscriptions, etc. for information
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10477Inverted
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465Application of solder
    • H05K3/3468Application of molten solder, e.g. dip soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating processes for reflow soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DK385578A 1978-02-28 1978-08-31 Fremgangsmaade til fremstilling af ensidigt med komponenter bestykkede kredsloebsplader. DK152480C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2809013 1978-02-28
DE2809013A DE2809013C2 (de) 1978-02-28 1978-02-28 Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte

Publications (3)

Publication Number Publication Date
DK385578A true DK385578A (da) 1979-08-29
DK152480B DK152480B (da) 1988-02-29
DK152480C DK152480C (da) 1988-07-25

Family

ID=6033380

Family Applications (1)

Application Number Title Priority Date Filing Date
DK385578A DK152480C (da) 1978-02-28 1978-08-31 Fremgangsmaade til fremstilling af ensidigt med komponenter bestykkede kredsloebsplader.

Country Status (9)

Country Link
JP (2) JPS54118573A (da)
AT (1) AT377889B (da)
AU (1) AU531356B2 (da)
CA (1) CA1131746A (da)
DE (1) DE2809013C2 (da)
DK (1) DK152480C (da)
IL (1) IL56306A (da)
IT (1) IT7947865A0 (da)
SE (1) SE443276B (da)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144535A (en) * 1989-04-20 1992-09-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components of a printed circuit board
JPH0468198A (ja) * 1990-07-09 1992-03-03 Tekken Constr Co Ltd トンネルの構築工法
DE4028978C2 (de) * 1990-09-12 1993-10-14 Siemens Ag Lötkontaktelement für Leiterplatten zur Verlötung von oberflächenmontierbaren SMD-Bauteilen, und bevorzugte Verwendung desselben zur Verlötung von übereinanderliegenden Bauteilen
US20040108130A1 (en) * 2002-12-09 2004-06-10 Yazaki Corporation Mounting structure for electronic component

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1246840B (de) * 1963-09-30 1967-08-10 Siemens Ag Gedruckte Schaltung
CA939831A (en) * 1969-03-27 1974-01-08 Frederick W. Schneble (Jr.) Plated through hole printed circuit boards
JPS48100660A (da) * 1972-04-04 1973-12-19
JPS5629805Y2 (da) * 1974-08-02 1981-07-15

Also Published As

Publication number Publication date
AU4445479A (en) 1979-09-06
JPS58103163U (ja) 1983-07-13
AT377889B (de) 1985-05-10
DK152480C (da) 1988-07-25
DK152480B (da) 1988-02-29
IL56306A (en) 1982-07-30
AU531356B2 (en) 1983-08-18
IL56306A0 (en) 1979-03-12
ATA704878A (de) 1984-09-15
JPS639396B2 (da) 1988-02-29
JPS54118573A (en) 1979-09-14
IT7947865A0 (it) 1979-02-02
SE7809290L (sv) 1979-08-29
DE2809013C2 (de) 1985-08-01
DE2809013A1 (de) 1979-08-30
SE443276B (sv) 1986-02-17
CA1131746A (en) 1982-09-14

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