DK495885A - Diffusionsisolationslag til en maskeloes belaegningsproces - Google Patents

Diffusionsisolationslag til en maskeloes belaegningsproces Download PDF

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Publication number
DK495885A
DK495885A DK495885A DK495885A DK495885A DK 495885 A DK495885 A DK 495885A DK 495885 A DK495885 A DK 495885A DK 495885 A DK495885 A DK 495885A DK 495885 A DK495885 A DK 495885A
Authority
DK
Denmark
Prior art keywords
mascular
insulation layer
coating process
diffusion insulation
diffusion
Prior art date
Application number
DK495885A
Other languages
English (en)
Other versions
DK495885D0 (da
Inventor
Lester Wynn Herron
Ananda Hosakere Kumar
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of DK495885D0 publication Critical patent/DK495885D0/da
Publication of DK495885A publication Critical patent/DK495885A/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/04—Diffusion into selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0743—Mechanical agitation of fluid, e.g. during cleaning of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DK495885A 1984-10-30 1985-10-29 Diffusionsisolationslag til en maskeloes belaegningsproces DK495885A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/666,954 US4582722A (en) 1984-10-30 1984-10-30 Diffusion isolation layer for maskless cladding process

Publications (2)

Publication Number Publication Date
DK495885D0 DK495885D0 (da) 1985-10-29
DK495885A true DK495885A (da) 1986-05-01

Family

ID=24676216

Family Applications (1)

Application Number Title Priority Date Filing Date
DK495885A DK495885A (da) 1984-10-30 1985-10-29 Diffusionsisolationslag til en maskeloes belaegningsproces

Country Status (10)

Country Link
US (1) US4582722A (da)
EP (1) EP0180091B1 (da)
JP (1) JPH0738420B2 (da)
KR (1) KR900000438B1 (da)
CN (1) CN85107549B (da)
AU (1) AU569805B2 (da)
BR (1) BR8504923A (da)
CA (1) CA1267990A (da)
DE (1) DE3576098D1 (da)
DK (1) DK495885A (da)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582722A (en) * 1984-10-30 1986-04-15 International Business Machines Corporation Diffusion isolation layer for maskless cladding process
DE3517965A1 (de) * 1985-05-18 1986-11-20 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung einer elektrischen schaltung in hybridtechnik
US4663186A (en) * 1986-04-24 1987-05-05 International Business Machines Corporation Screenable paste for use as a barrier layer on a substrate during maskless cladding
US4829020A (en) * 1987-10-23 1989-05-09 The United States Of America As Represented By The United States Department Of Energy Substrate solder barriers for semiconductor epilayer growth
NL9000545A (nl) * 1990-03-09 1991-10-01 Philips Nv Werkwijze voor het vervaardigen van geleidersporen.
DE4344061C1 (de) * 1993-12-23 1995-03-30 Mtu Muenchen Gmbh Bauteil mit Schutzanordnung gegen Alitieren oder Chromieren beim Gasdiffusionsbeschichten und Verfahren zu seiner Herstellung
US5787578A (en) * 1996-07-09 1998-08-04 International Business Machines Corporation Method of selectively depositing a metallic layer on a ceramic substrate
JP2000203885A (ja) * 1999-01-11 2000-07-25 Ulvac Japan Ltd 機能性薄膜、機能性基板、及び酸化チタン薄膜製造方法。
WO2002092242A1 (en) * 2001-05-16 2002-11-21 Board Of Regents Selective deposition of materials for the fabrication of interconnects and contacts on semiconductors devices
US6650016B1 (en) * 2002-10-01 2003-11-18 International Business Machines Corporation Selective C4 connection in IC packaging
WO2012040699A2 (en) * 2010-09-24 2012-03-29 Molecular Imprints, Inc. High contrast alignment marks through multiple stage imprinting
EP2895562A1 (en) * 2012-09-13 2015-07-22 Eckart America Corporation Methods for producing platelet materials

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2788289A (en) * 1951-06-29 1957-04-09 Climax Molybdenum Co Method of forming protective coatings for molybdenum and molybdenum-base alloys
US3741735A (en) * 1964-01-08 1973-06-26 Atomic Energy Commission Coating molybdenum with pure gold
FR1554958A (da) * 1967-02-22 1969-01-24
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
JPS5938268B2 (ja) * 1974-03-22 1984-09-14 カンザキセイシ カブシキガイシヤ 新規フタリド化合物の製造法
JPS5159274A (en) * 1974-11-20 1976-05-24 Tdk Electronics Co Ltd Hakumakusoshino seizohoho
US3957552A (en) * 1975-03-05 1976-05-18 International Business Machines Corporation Method for making multilayer devices using only a single critical masking step
JPS5248992A (en) * 1975-10-17 1977-04-19 Nec Corp Method for manufacturing high frequency elastic surface wave electrode like grating
US4293587A (en) * 1978-11-09 1981-10-06 Zilog, Inc. Low resistance backside preparation for semiconductor integrated circuit chips
US4206254A (en) * 1979-02-28 1980-06-03 International Business Machines Corporation Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern
US4273859A (en) * 1979-12-31 1981-06-16 Honeywell Information Systems Inc. Method of forming solder bump terminals on semiconductor elements
US4493856A (en) * 1982-03-18 1985-01-15 International Business Machines Corporation Selective coating of metallurgical features of a dielectric substrate with diverse metals
US4442137A (en) * 1982-03-18 1984-04-10 International Business Machines Corporation Maskless coating of metallurgical features of a dielectric substrate
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
US4582722A (en) * 1984-10-30 1986-04-15 International Business Machines Corporation Diffusion isolation layer for maskless cladding process

Also Published As

Publication number Publication date
AU4791285A (en) 1986-05-08
US4582722A (en) 1986-04-15
EP0180091A3 (en) 1987-01-14
AU569805B2 (en) 1988-02-18
JPH0738420B2 (ja) 1995-04-26
DK495885D0 (da) 1985-10-29
CA1267990A (en) 1990-04-17
KR860003650A (ko) 1986-05-28
JPS61107750A (ja) 1986-05-26
CN85107549A (zh) 1986-08-13
CN85107549B (zh) 1988-05-25
EP0180091B1 (en) 1990-02-21
DE3576098D1 (de) 1990-03-29
KR900000438B1 (ko) 1990-01-30
EP0180091A2 (en) 1986-05-07
BR8504923A (pt) 1986-07-22

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AHB Application shelved due to non-payment