EP0053719B1 - Procédé pour le décapage de surfaces métalliques - Google Patents

Procédé pour le décapage de surfaces métalliques Download PDF

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Publication number
EP0053719B1
EP0053719B1 EP81109230A EP81109230A EP0053719B1 EP 0053719 B1 EP0053719 B1 EP 0053719B1 EP 81109230 A EP81109230 A EP 81109230A EP 81109230 A EP81109230 A EP 81109230A EP 0053719 B1 EP0053719 B1 EP 0053719B1
Authority
EP
European Patent Office
Prior art keywords
solution
etching
copper
etching solution
hydrogen peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP81109230A
Other languages
German (de)
English (en)
Other versions
EP0053719A1 (fr
Inventor
Dieter C. Ing. Grad. Schmid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6118774&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP0053719(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Publication of EP0053719A1 publication Critical patent/EP0053719A1/fr
Application granted granted Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Definitions

  • the invention relates to a method for etching metal surfaces, in particular printed circuits, as specified in the preamble of claim 1.
  • etching with copper chloride and regeneration with hydrochloric acid / hydrogen peroxide or chlorine gas are known.
  • etching is generally carried out using ammoniacal-alkaline etching agents; iron-III chloride or ammonium persulfate is also used in special cases.
  • the copper sulfate formed in this reaction is more suitable than copper chloride for further use. There is also the possibility of creating a closed cycle without waste water problems within the etching process and of recovering the etched copper.
  • the hydrogen peroxide is added to the etching solution only shortly before it is applied to the circuit to be etched or even only during the application, in an amount which is sufficient for the respective etching process, but which is so it is small that after the etching process, the solution dripping from the circuit contains essentially no more peroxide.
  • the amount of peroxide added is relatively easy to adjust and regulate.
  • This method has the advantage that catalytic decomposition of the peroxide in the etching solution collected after the etching process can no longer take place since there is practically no peroxide in this etching solution.
  • the etching solution can therefore be pumped back into a storage tank in a manner known per se and used again for a new etching process. Nevertheless, the etching process proceeds in the desired manner, because in the reaction area, i. H. on the circuit, the required amount of peroxide is added to the etching solution, so that the desired decomposition of the peroxide, oxidation of the metal and etching of the copper take place here.
  • the etched copper is at least partially removed from the etching solution after each etching process.
  • the copper is preferably removed electrolytically from the etching solution.
  • the copper is removed from the etching solution by cooling the etching solution and thereby precipitating copper sulfate.
  • etching solution and the hydrogen peroxide are sprayed separately onto the circuit to be etched.
  • any contact between the peroxide and the etched-off copper in the etching solution is reliably avoided before the substances meet in the reaction area.
  • the etching process of the printed circuit boards, which are coated with copper, a lacquer, photoresist material or metal resist, such as lead tin, between guide rollers 1 in the horizontal direction takes place in the interior of a housing 2, which has a collecting container 3 for the etching solution dripping from the printed circuit boards below the feed path of the printed circuit boards.
  • the printed circuit boards are inserted along the feed path formed by the guide rollers 1 into the housing 2 and leave it again on the opposite side.
  • stations for pre-treatment and stations for post-treatment of the printed circuit boards are connected upstream or downstream of the etching housing.
  • the etching solution collected in the collecting container 3 is fed by means of a suitable pump 6 via a line 7 either to an electrolysis vessel 8 or to a cooling station 9. After passing through the electrolysis vessel or the cooling station, a pump 10 conveys the etching solution into a collecting container 11.
  • the etching solution is fed to the spray nozzles 4 by means of a pump 12 or via a line 13.
  • this is fed from a storage container for oxidizing agent separated from the collecting container 11 by means of a pump 15 to the line 13, so that a mixture of the etching solution and the oxidizing agent is sprayed onto the printed circuit boards through the spray nozzles. It is also possible to spray the oxidizing agent evenly through separate nozzles.
  • an acid for example sulfuric acid or phosphoric acid
  • the oxidizing agent in the storage container 14 is hydrogen peroxide.
  • phosphoric acid can also be used, in which case corresponding phosphates are formed.
  • This etchant can be fed directly to the collecting container 11 and applied again to the printed circuit boards by means of the pump 12 with the addition of the appropriate amount of the peroxide.
  • This procedure also has the advantage that the etching solution supplied to the collecting container 11 contains little copper, so that when this low-copper etching solution is mixed with peroxide from the storage container, the catalytic decomposition of the peroxide is reduced. It is entirely possible to produce the mixture of etching solution and peroxide shortly before it is applied to the printed circuit boards and to spray it through common nozzles.
  • separate spray nozzles are provided for the etching solution and peroxide, so that the reactive mixture is only formed on the circuit boards themselves. In this case, any catalytic decomposition of the peroxide before the actual reaction is avoided with certainty.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Claims (5)

1. Procédé de décapage de surfaces métalliques, en particulier de circuits imprimés, dans lequel on enlève par décapage le métal (le cuivre) qui se trouve sur circuits imprimés au moyen d'une solution contenant de l'acide sulfurique ou de l'acide phosphorique et du peroxyde d'hydrogène et dans lequel on amène cette solution dans un circuit de recyclage et la réemploie de façon répétitive pour le décapage, caractérisé en ce que l'on ajoute à la solution, immédiatement avant toute application ou lors de l'application sur le circuit à décaper, que la quantité de peroxyde d'hydrogène qui suffit juste pour un processus de décapage ; en ce qu'après le processus de décapage il ne reste sensiblement pas de peroxyde d'hydrogène dans la solution.
2. Procédé selon la revendication 1, caractérisé en ce que l'on extrait au moins partiellement de la solution, après chaque processus de décapage, le cuivre enlevé par décapage.
3. Procédé selon la revendication 2, caractérisé en ce que l'on extrait le cuivre hors de la solution par voie électrolytique.
4. Procédé selon la revendication 2, caractérisé en ce que si l'on utilise l'acide sulfurique, on extrait le cuivre de la solution par refroidissement de la solution et par la précipitation, qui en résulte, du sulfate de cuivre.
5. Procédé selon l'une des revendications précédentes, caractérisé en ce que l'on pulvérise la solution et le peroxyde d'hydrogène séparément sur le circuit à décaper.
EP81109230A 1980-12-10 1981-10-29 Procédé pour le décapage de surfaces métalliques Expired EP0053719B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3046477 1980-12-10
DE19803046477 DE3046477A1 (de) 1980-12-10 1980-12-10 "verfahren zum aetzen von metalloberflaechen"

Publications (2)

Publication Number Publication Date
EP0053719A1 EP0053719A1 (fr) 1982-06-16
EP0053719B1 true EP0053719B1 (fr) 1987-09-09

Family

ID=6118774

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81109230A Expired EP0053719B1 (fr) 1980-12-10 1981-10-29 Procédé pour le décapage de surfaces métalliques

Country Status (2)

Country Link
EP (1) EP0053719B1 (fr)
DE (2) DE3046477A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4206626A1 (de) * 1992-03-03 1993-09-09 Heidelberger Druckmasch Ag Verfahren zur verringerung von dublieren beim anlaufen einer bogendruckmaschine

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3539874A1 (de) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H Anlage zum aetzen von zumindest teilweise aus metall, vorzugsweise kupfer, bestehendem aetzgut
DE3539886A1 (de) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H Verfahren und vorrichtung zum aetzen eines zumindest teilweise aus metall, vorzugsweise kupfer, bestehenden aetzguts
US5244000A (en) * 1991-11-13 1993-09-14 Hughes Aircraft Company Method and system for removing contaminants
DK0566712T3 (da) * 1991-11-13 1995-12-18 Hughes Aircraft Co Fremgangsmåde og system til fjernelse af forureninger
DE4402788A1 (de) * 1994-01-31 1995-08-10 Emil Krechen Industrievertretu Verfahren zum Abtragen von Metallen
SK278921B6 (sk) * 1995-10-30 1998-04-08 Chemasol Spôsob výroby monohydrátu síranu meďnatého
US5958147A (en) * 1997-05-05 1999-09-28 Akzo Nobel N.V. Method of treating a metal
CA2235976C (fr) * 1997-05-05 2001-06-05 Akzo Nobel N.V. Methode de traitement d'un metal
EP0885985A1 (fr) * 1997-05-05 1998-12-23 Akzo Nobel N.V. Procédé de traitement d'un métal
DE102013112045A1 (de) 2013-10-31 2015-04-30 Holger Manfred Schmid Vorrichtung und Verfahren zur Bearbeitung von metallischen Oberflächen mit einer Ätzflüssigkeit
DE102017128630A1 (de) * 2017-12-01 2019-06-19 Wen Yao Chang Leiterplatte mit einem siliziumsubstrat und fertigungsverfahren dafür

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6603696A (fr) * 1965-04-28 1966-10-31
DE1906304A1 (de) * 1969-02-08 1970-09-03 Wiederhold Fa Hermann Verfahren und Vorrichtung zum kontinuierlichen AEtzen
US3756957A (en) * 1971-03-15 1973-09-04 Furukawa Electric Co Ltd Solutions for chemical dissolution treatment of metallic materials
DE2358683A1 (de) * 1973-11-24 1975-06-05 Kalman Von Dipl Phys Soos Verfahren zum beizen und aetzen von metallen
IT1083401B (it) * 1977-05-27 1985-05-21 Alfachimici Spa Soluzione acida per l'attacco selettivo del rame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4206626A1 (de) * 1992-03-03 1993-09-09 Heidelberger Druckmasch Ag Verfahren zur verringerung von dublieren beim anlaufen einer bogendruckmaschine

Also Published As

Publication number Publication date
DE3176426D1 (en) 1987-10-22
DE3046477A1 (de) 1982-07-08
EP0053719A1 (fr) 1982-06-16

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