EP0053870A1 - Kompaktes Relais - Google Patents

Kompaktes Relais Download PDF

Info

Publication number
EP0053870A1
EP0053870A1 EP81303143A EP81303143A EP0053870A1 EP 0053870 A1 EP0053870 A1 EP 0053870A1 EP 81303143 A EP81303143 A EP 81303143A EP 81303143 A EP81303143 A EP 81303143A EP 0053870 A1 EP0053870 A1 EP 0053870A1
Authority
EP
European Patent Office
Prior art keywords
base member
adhesive
relay
compact design
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP81303143A
Other languages
English (en)
French (fr)
Other versions
EP0053870B1 (de
Inventor
Fujita Teizo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idec Corp
IZUMI DENKI CORP
Original Assignee
Idec Izumi Corp
IZUMI DENKI CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idec Izumi Corp, IZUMI DENKI CORP filed Critical Idec Izumi Corp
Publication of EP0053870A1 publication Critical patent/EP0053870A1/de
Application granted granted Critical
Publication of EP0053870B1 publication Critical patent/EP0053870B1/de
Expired legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin

Definitions

  • This invention relates to miniature or compact design relays and, more particulaly, to compact design relays having a sealed construction.
  • a compact design relay of this type is manufactured by covering a base member provided with necessary terminal pins with a case open at the bottom and a resin adhesive which is applied to portions of the base in engagement with the open end of the cover and those receiving the terminal pins and then thermally hardened.
  • a resin adhesive which is applied to portions of the base in engagement with the open end of the cover and those receiving the terminal pins and then thermally hardened.
  • An object of the invention is to remove the drawbacks discussed above.
  • a compact design relay in which a gap between a base member provided with terminal pins and a case coverinq the base is sealed by fillinq the qap with an adhesive and thermally hardening the adhesive, and in which a vent hole is formed in a portion of the case and/or the base free from the adhesive and is sealed with a further adhesive after the thermal treatment of the first-mentioned adhesive.
  • This compact design relay is manufactured by covering a base member 2 provided with terminal pins 1 with a case 3 open at the bottom and sealing the assembly with a resin adhesive 4 which is applied to portions of the base in engagement with the open end of the cover and those receiving the terminal pins and then thermally hardened.
  • the adhesive 4 may extend over the while area of the lower end opening of the case 4 and this construction has the drawbacks as discussed previously.
  • FIGs. 2 and 3 show a preferred embodiment in which the invention is applied to such a compact design relay as disclosed in the United States Patent No. 4,227,162 assigned to the same assignee of this invention.
  • a base 2 has a portion 6 which expands outwardly downwardly and extends along the longitudinal center axis of the base 2.
  • a small hol 5 is formed in a recess 7 provided at a given portion of the expanded base portion 6 and a plurality of terminal pins 1 are arranged parallelly along the opposite sides of the expanded portion 6.
  • the inflated air due to the inner pressure produced when thermally hardening the adhesive 4 filing the gap between the case 3 and base 2 and also gases produced from the adhesive at this time may be exhausted through the hole 5 to the outside, so that there is no possibility of the formation of small air passages in the hardened adhesive and also a cloud of gases produced from the adhesive.
  • the small hole 5 is sealed with a small quantity of adhesive 8 in the last step.
  • a very small quantity of adhesive 8 is required for sealing the small hole 5, so that there is no possibility of increasing the internal pressure, and the reliability of sealing can be increased.
  • the molding can be provided over a reduced area, and the quantity of the necessary resin can be reduced.
  • improved ventilation can be obtained since a gap is formed between the portion of the relay base at which the terminal pins are mounted the surface portion of the printed-circuit board.
  • the expanded portion 6 is provided on the underside of the base, the small hole 5 for sealing can be provided in the expanded portion 6 without sacrifice in appearance in use at all. Further, if the interior of the expanded portion 6 of the base 2 is utilized for accommodating a relay coil section, the height of the relay from the printed-circuit board in the mounted state can be reduced to obtain a more compact construction as a whole.
  • a recess 7 is formed so that adhesive may spread over the portion of the recess 7 around the small hole 5, it is only necessary for the adhesive to close the small hole 5 which is very small, and it is not necessary to fill the entire recess 7 with the adhesive.
  • the small hole 5 is provided at the center of the expanded portion 6 of the base 2 in the longitudinal direction thereof, this position of the small hole 5 is by no means limitative.
  • a ridge 9 provided on the expanded portion 6 to surround the small hall 5 may prevent the adhesive 8 from spreading widely over the surface of the expanded portion 6 in case an excessive quantity of adhesive is applied to the hole 5.
  • the base 2 is provided with the expanded portion 6, it is also possible to make the lower surface of the base 2 flat, as shown in Figs. 6 and 7, with grooves 11 formed in the terminal pin mounting portions of the base 2 so that the terminal pins 1 are mounted in these grooves 11 and the grooves 11 are filled with the adhesive 4, provided that there is no problem in ventilation of the underside of the relay.
  • the small hole 5 may be provided in any suitable portion other than the qrooves.
  • the ridge 9 surrounding the small hole 5 and the ridge 10 for the purpose of steadiness may be provided also in this embodiment in the same manner as in the embodiment of Figs. 4 and 5. However, such a single bar-like ridge 12 may be substituted for the surrounding ridge 10, as shown in Fiq. 6.
  • Figs. 8 and 9 may be utilized.
  • no grooves are not provided in the base 2 and the adhesive 4 is applied to whole the bottom surface.s of the base 2 except for the areas surrounded by the ridge 9 surrounding the small hole 5 and the ridge 10 for the purpose of steadiness.
  • the adhesive is unavoidably increased in its quantity. However, the increase in the quantity of adhesive may be considerably reduced by widening the areas surrounded by the ridges 9 and 10.
  • the small hole 5 may be provided in the case 3 or to penetrate both the case 3 and base 2. From the standpoint of appearance, howevere, it is of course better to provide the small hole 5 in the underside of the base 2.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switch Cases, Indication, And Locking (AREA)
EP81303143A 1980-12-05 1981-07-09 Kompaktes Relais Expired EP0053870B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP175421/80U 1980-12-05
JP1980175421U JPS5797347U (de) 1980-12-05 1980-12-05

Publications (2)

Publication Number Publication Date
EP0053870A1 true EP0053870A1 (de) 1982-06-16
EP0053870B1 EP0053870B1 (de) 1985-10-02

Family

ID=15995796

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81303143A Expired EP0053870B1 (de) 1980-12-05 1981-07-09 Kompaktes Relais

Country Status (3)

Country Link
EP (1) EP0053870B1 (de)
JP (1) JPS5797347U (de)
DE (1) DE3172517D1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120853A (en) * 1982-05-24 1983-12-07 Illinois Tool Works Liquid contaminant resistant electric switches
EP0110098A1 (de) * 1982-10-22 1984-06-13 International Standard Electric Corporation Elektromagnetisches Relais
EP0118841A3 (en) * 1983-03-12 1985-01-23 International Standard Electric Corporation Method of sealing a relay
US4580005A (en) * 1983-07-02 1986-04-01 International Standard Electric Corporation Wash-tight electromagnetic relay
EP0351547A3 (de) * 1988-07-20 1990-12-19 Trw Inc. Abgedichtete Relaisanordnung
EP0713233A3 (de) * 1994-10-24 1998-03-04 Siemens Aktiengesellschaft Anordnung eines Relais mit einem Steckadapter und Verfahren zur Herstellung dieser Anordnung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2618492A1 (de) * 1976-04-27 1977-11-10 Siemens Ag Schutzvorrichtung fuer ein elektromechanisches bauelement
DE2908887A1 (de) * 1978-03-08 1979-09-13 Idec Izumi Corp Elektromagnetisches relais
GB2029107A (en) * 1978-08-17 1980-03-12 Bosch Gmbh Robert Electro-magnetic relay

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030049A (ja) * 1983-07-28 1985-02-15 Seiko Electronic Components Ltd リチウムシ−ト打抜型

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2618492A1 (de) * 1976-04-27 1977-11-10 Siemens Ag Schutzvorrichtung fuer ein elektromechanisches bauelement
DE2908887A1 (de) * 1978-03-08 1979-09-13 Idec Izumi Corp Elektromagnetisches relais
US4227162A (en) * 1978-03-08 1980-10-07 Izumi Denki Corporation Electromagnet relay with specific housing structure
GB2029107A (en) * 1978-08-17 1980-03-12 Bosch Gmbh Robert Electro-magnetic relay

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120853A (en) * 1982-05-24 1983-12-07 Illinois Tool Works Liquid contaminant resistant electric switches
EP0110098A1 (de) * 1982-10-22 1984-06-13 International Standard Electric Corporation Elektromagnetisches Relais
EP0118841A3 (en) * 1983-03-12 1985-01-23 International Standard Electric Corporation Method of sealing a relay
US4580005A (en) * 1983-07-02 1986-04-01 International Standard Electric Corporation Wash-tight electromagnetic relay
EP0130500A3 (de) * 1983-07-02 1986-10-08 Alcatel N.V. Waschdichtes elektromagnetisches Relais
AU568369B2 (en) * 1983-07-02 1987-12-24 Alcatel N.V. Relay in sealed housing
EP0351547A3 (de) * 1988-07-20 1990-12-19 Trw Inc. Abgedichtete Relaisanordnung
EP0713233A3 (de) * 1994-10-24 1998-03-04 Siemens Aktiengesellschaft Anordnung eines Relais mit einem Steckadapter und Verfahren zur Herstellung dieser Anordnung

Also Published As

Publication number Publication date
DE3172517D1 (en) 1985-11-07
EP0053870B1 (de) 1985-10-02
JPS5797347U (de) 1982-06-15

Similar Documents

Publication Publication Date Title
KR100253452B1 (ko) 자동차용 전환 및 제어장치
US20200137904A1 (en) Circuit device, method for manufacturing circuit device and connector
US4913285A (en) Water-and-dust-proof push-button switch housing dummy terminal for air venting
JPS59132522A (ja) 電気スイツチ
EP0053870A1 (de) Kompaktes Relais
US5752856A (en) Sealed fuse connector
JP6499604B2 (ja) 電子制御装置
US4599596A (en) Chip type fuse
JP2005150621A (ja) 半導体装置
US4277663A (en) Electrical switch
US6056576A (en) ZIF socket with top loading contacts
JP2017175069A (ja) 電子制御装置
US5395256A (en) Contact element for SMD printed circuit boards and mounting method
KR102109955B1 (ko) 전자 제어 장치
KR970003325A (ko) 회로 차단기
JP2815443B2 (ja) 電気工学的ユニット、特にリレーのためのケーシング
JP3463310B2 (ja) 表面実装リレー
CN117356003A (zh) 机动车用控制装置
JP6715196B2 (ja) 電子制御装置
JPH0716370U (ja) 気密端子
JP2001152906A (ja) 内燃機関用制御ユニット
JPH0441545Y2 (de)
JP4257832B2 (ja) スイッチ装置
JPS6032800Y2 (ja) 電気部品の封入構造
JPS6244523Y2 (de)

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 19821109

ITF It: translation for a ep patent filed
GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Designated state(s): DE FR GB IT

REF Corresponds to:

Ref document number: 3172517

Country of ref document: DE

Date of ref document: 19851107

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
ITTA It: last paid annual fee
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19930512

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19930702

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19930929

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19940709

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19940709

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Effective date: 19950331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Effective date: 19950401

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST