EP0053870B1 - Kompaktes Relais - Google Patents

Kompaktes Relais Download PDF

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Publication number
EP0053870B1
EP0053870B1 EP81303143A EP81303143A EP0053870B1 EP 0053870 B1 EP0053870 B1 EP 0053870B1 EP 81303143 A EP81303143 A EP 81303143A EP 81303143 A EP81303143 A EP 81303143A EP 0053870 B1 EP0053870 B1 EP 0053870B1
Authority
EP
European Patent Office
Prior art keywords
adhesive
trough
relay
shaped portion
vent hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP81303143A
Other languages
English (en)
French (fr)
Other versions
EP0053870A1 (de
Inventor
Fujita Teizo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IZUMI DENKI CORP
Original Assignee
IZUMI DENKI CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IZUMI DENKI CORP filed Critical IZUMI DENKI CORP
Publication of EP0053870A1 publication Critical patent/EP0053870A1/de
Application granted granted Critical
Publication of EP0053870B1 publication Critical patent/EP0053870B1/de
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin

Definitions

  • This invention relates to miniature or compact design relays and, more particularly, to compact design relays having a sealed construction.
  • a compact design relay of this type is manufactured by covering a base member provided with necessary terminal pins with a case open at the bottom, and a resin adhesive is applied to portions of the base in engagement with the open end of the cover and those receiving the terminal pins and then thermally hardened.
  • a resin adhesive is applied to portions of the base in engagement with the open end of the cover and those receiving the terminal pins and then thermally hardened.
  • An object of the invention is to remove the drawbacks discussed above.
  • German Specification DE-A-2,618,492 there is disclosed a base member provided with a relay mechanism and terminal pins connected to said relay mechanism; a case member covering said base member; a first adhesive applied to gaps formed between said base member and said case member and between said base member and said terminal pins, said first adhesive being thermally hardened so as to seal said gaps in an air-tight manner; an air vent hole formed in the base member; a second adhesive which has been applied to said air vent hole after the said first adhesive has been hardened.
  • the base member is substantially flat and the air vent hole is not disposed outwardly of the first adhesive.
  • the present invention is therefore characterised in that said base member, as known per se, has a centrally disposed trough-shaped portion and first and second flat portions on opposite sides of said trough-shaped portion, said terminal pins being mounted in said flat portions, and further characterised in that the bottom of the trough-shaped portion projects substantially outwardly both of the first adhesive and of the first and second flat portions, the air vent hole being formed in the bottom of the trough-shaped portion so as to be free from said first adhesive.
  • the construction of the present invention ensures that the first adhesive can be introduced in such a way that the gaps between the flat portions of the base member and the case member, and the gaps between the flat portions and the terminal pins, can be easily sealed in a single manufacturing process with a minimum of first adhesive and without any risk that the first adhesive will enter the air vent hole.
  • the construction of the present invention also ensures that there is a substantial gap between the portion of the relay base at which the terminal pins are mounted and the surface portion of the printed circuit board so as to ensure adequate ventilation.
  • a relay having a centrally disposed trough-shaped portion is disclosed per se in the Applicants' German Specification DE-A-2,908,887.
  • the relay of the latter specification does not have an air vent hole sealed by a second adhesive.
  • FIG. 1 For the better understanding of the invention, an example of a conventional compact design relay, which is shown in Figure 1 will first be described.
  • This compact design relay is manufactured by covering a base member 2 provided with terminal pins 1 with a case 3 which is open at the bottom, and sealing the assembly with a resin adhesive 4 which is applied to portions of the base in engagement with the open end of the cover and those receiving the terminal pins, the resin then being thermally hardened.
  • the adhesive 4 may extend over the whole area of the lower end opening of the case 4 and this construction has the drawbacks as discussed previously.
  • Figures 2 and 3 show a preferred embodiment in which the invention is applied to a compact design relay such as disclosed in German Specification DE-A-2 908 887 assigned to the same assignee of this invention.
  • a base 2 has a projecting trough-shaped portion 6 which projects outwardly downwardly and extends along the longitudinal centre axis of the base 2.
  • the base 2 has first and second flat portions 2a, 2b on opposite sides of the projecting trough-shaped portions 6.
  • the bottom of the projecting trough-shaped portion 6 thus projects substantially outwardly of the adhesive 4 and of the flat portions 1a, 2b.
  • a small vent hole 5 is formed in a recess 7 provided in the bottom of the projecting trough-shaped portion 6 so that the vent hole 5 is free from the adhesive 4.
  • a plurality of terminal pins 1 are arranged parallel to each other along the opposite sides of the projecting portion 6, the terminal pins 1 being mounted in the flat portions 2a, 2b.
  • the inflated air due to the inner pressure produced when thermally hardening the adhesive 4 filling the gap between the case 3 and base 2 and also gases produced from the adhesive at this time may be exhausted through the hole 5 to the outside, so that there is no possibility of either the formation of small air passages in the hardened adhesive or of a cloud of gases produced from the adhesive.
  • the small vent hole 5 is sealed with a small quantity of adhesive 8 as the last step. At this time, only a very small quantity of adhesive 8 is required for sealing the small vent hole 5, so that there is no possibility of increasing the internal pressure, and the reliability of sealing can be increased.
  • the moulding can be provided over a reduced area, and the quantity of the necessary resin can be reduced. Further, when the relay is mounted on a printed circuit board P for use thereon, improved ventilation can be obtained since a gap is formed between the portion of the relay base at which the terminal pins are mounted on the surface portion of the printed-circuit board. Further, since the projection trough-shaped portion 6 is provided on the underside of the base, the small vent hole 5 for sealing is provided in the bottom of the projecting trough-shaped portion 6 without any sacrifice in appearance in use at all. Further, if the interior of the projecting trough-shaped portion 6 of the base 2 is utilized for accommodating a relay coil section, the height of the relay from the printed-circuit board in the mounted state can be reduced to obtain a more compact construction as a whole.
  • a recess 7 is formed so that adhesive may spread over the portion of the recess 7 around the small vent hole 5, it is only necessary for the adhesive to close the vent hole 5 which is very small, and it is not necessary to fill the entire recess 7 with the adhesive.
  • the small vent hole 5 is provided at the centre of the bottom of the projecting trough-shaped portion 6 of the base 2 in the longitudinal direction thereof, this position of the small vent hole 5 is by no means limitative.
  • a ridge 9 which is provided on the bottom of the projecting trough-shaped portion 6 to surround the small vent hole 5 may prevent the adhesive 8 from spreading widely over the surface of the bottom of the projecting trough-shaped portion 6 in case an excessive quantity of adhesive is applied to the vent hole 5.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Switch Cases, Indication, And Locking (AREA)

Claims (5)

1. Relais kompakter Bauweise, umfassend ein Basiselement (2) mit einem Relaismechanismus sowie mit letzterem verbundenen Anschlußstiften (1), ein das Basiselement (2) umschließendes Gehäuseelement (3), ein erstes Klebmittel (4), das in die zwischen Basiselement (2) und Gehäuseelement (3) sowie zwischen Basiselement (2) und Anschlußstiften (1) gebildeten Fugen eingebracht und thermisch ausgehärtet ist, so daß es die Fugen luftdicht verschließt, eine im Basiselement (2) ausgebildete Entlüftungsöffnung (5), (und) ein zweites Klebmittel (8), das nach dem Aushärten des ersten Klebmittels in die Entlüftungsöffnung (5) eingebracht worden ist, dadurch gekennzeichnet, daß das Basiselement (2) in an sich bekannter Weise einen mittigen, muldenförmigen Abschnitt (6) sowie erste und zweite flache Abschnitte (2a, 2b) auf gegenüberliegenden Seiten des muldenförmigen Abschnitts (6) aufweist, wobei die Anschlußstifte (1) in den flachen Abschnitten (2a, 2b) montiert sind, sowie weiterhin dadurch gekennzeichnet, daß der Boden des muldenförmigen Abschnitts (6) gegenüber sowohl dem ersten Klebmittel (4) als auch erstem und zweitem flachen Abschnitt (2a, 2b) wesentlich nach außen vorsteht, wobei die Entlüftungsöffnung (5) im Boden des muldenförmigen Abschnitts (6) so ausgebildet ist, daß sie vom ersten Klebmittel (4) frei ist.
2. Relais kompakter Bauweise nach Anspruch 1, dadurch gekennzeichnet, daß der Boden des muldenförmigen Abschnitts (6) auf einem Relaistragelement (P) montiert ist.
3. Relais kompakter Bauweise nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Boden des muldenförmigen Abschnitts (6) mit einem vertieften Abschnitt (7) versehen ist und die Entlüftungsöffnung (5) im vertieften Abschnitt ausgebildet ist.
4. Relais kompakter Bauweise nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Boden des muldenförmigen Abschnitts (6) mit einem ersten, die Entlüftungsöffnung (5) umgebenden Steg (9) versehen ist.
5. Relais kompakter Bauweise nach Anspruch 4, dadurch gekennzeichnet, daß der Boden des muldenförmigen Abschnitts (6) mit einem zweiten Steg (10, 12) versehen ist, der zusammen mit dem ersten Steg (9) die Anbringung des Relais an einem Relaistragelement (P) zu stabilisieren vermag.
EP81303143A 1980-12-05 1981-07-09 Kompaktes Relais Expired EP0053870B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP175421/80U 1980-12-05
JP1980175421U JPS5797347U (de) 1980-12-05 1980-12-05

Publications (2)

Publication Number Publication Date
EP0053870A1 EP0053870A1 (de) 1982-06-16
EP0053870B1 true EP0053870B1 (de) 1985-10-02

Family

ID=15995796

Family Applications (1)

Application Number Title Priority Date Filing Date
EP81303143A Expired EP0053870B1 (de) 1980-12-05 1981-07-09 Kompaktes Relais

Country Status (3)

Country Link
EP (1) EP0053870B1 (de)
JP (1) JPS5797347U (de)
DE (1) DE3172517D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58214231A (ja) * 1982-05-24 1983-12-13 イリノイ・ツ−ル・ワ−クス・インコ−ポレイテツド 耐液電気スイツチ
DE3239047C2 (de) * 1982-10-22 1986-01-16 Standard Elektrik Lorenz Ag, 7000 Stuttgart Elektromagnetisches Relais
DE3308791C2 (de) * 1983-03-12 1986-08-21 Standard Elektrik Lorenz Ag, 7000 Stuttgart Verfahren zur Herstellung eines dichten elektromagnetischen Relais
DE3323922A1 (de) * 1983-07-02 1985-01-03 Standard Elektrik Lorenz Ag, 7000 Stuttgart Waschdichtes elektromagnetisches relais
US4975545A (en) * 1988-07-20 1990-12-04 Wickes Manufacturing Company Sealed relay assembly
DE4437954C1 (de) * 1994-10-24 1996-02-08 Siemens Ag Anordnung eines Relais mit einem Steckadapter und Verfahren zur Herstellung dieser Anordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2618492C2 (de) * 1976-04-27 1984-03-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Waschdichte Schutzvorrichtung für ein elektromechanisches Bauelement
JPS54119657A (en) * 1978-03-08 1979-09-17 Idec Izumi Corp Small relay
DE7824507U1 (de) * 1978-08-17 1984-07-26 Robert Bosch Gmbh, 7000 Stuttgart Elektromagnetisches Relais
JPS6030049A (ja) * 1983-07-28 1985-02-15 Seiko Electronic Components Ltd リチウムシ−ト打抜型

Also Published As

Publication number Publication date
DE3172517D1 (en) 1985-11-07
JPS5797347U (de) 1982-06-15
EP0053870A1 (de) 1982-06-16

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