EP0062863A1 - Procédé de dépôt électrolytique de cuivre sur un support - Google Patents

Procédé de dépôt électrolytique de cuivre sur un support Download PDF

Info

Publication number: EP0062863A1
Authority: EP; European Patent Office
Prior art keywords: bath; convection; galvanic; copper; substrate
Prior art date: 1981-04-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP82102850A

Other languages

German (de)

English (en)

Inventor

Herbert Dipl.-Ing. Knothe

Klaus Röschmann

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

TELDEC Telefunken Decca Schallplatten GmbH

Original Assignee

TELDEC Telefunken Decca Schallplatten GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-04-08

Filing date

1982-04-03

Publication date

1982-10-20

1982-04-03 Application filed by TELDEC Telefunken Decca Schallplatten GmbH filed Critical TELDEC Telefunken Decca Schallplatten GmbH

1982-10-20 Publication of EP0062863A1 publication Critical patent/EP0062863A1/fr

Status Withdrawn legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 12
238000000034 method Methods 0.000 title claims description 17
229910052802 copper Inorganic materials 0.000 title claims description 10
239000010949 copper Substances 0.000 title claims description 10
239000000758 substrate Substances 0.000 title claims description 10
230000008021 deposition Effects 0.000 title claims 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 9
238000009713 electroplating Methods 0.000 claims abstract description 7
238000004519 manufacturing process Methods 0.000 claims abstract description 7
230000008929 regeneration Effects 0.000 claims abstract description 5
238000011069 regeneration method Methods 0.000 claims abstract description 5
239000000126 substance Substances 0.000 claims abstract description 5
239000003792 electrolyte Substances 0.000 claims abstract description 4
238000005520 cutting process Methods 0.000 claims description 4
239000000080 wetting agent Substances 0.000 claims description 4
239000000969 carrier Substances 0.000 claims description 2
238000000151 deposition Methods 0.000 claims description 2
238000005187 foaming Methods 0.000 claims description 2
230000002378 acidificating effect Effects 0.000 claims 1
238000001035 drying Methods 0.000 claims 1
238000002347 injection Methods 0.000 claims 1
239000007924 injection Substances 0.000 claims 1
238000007747 plating Methods 0.000 claims 1
239000000243 solution Substances 0.000 claims 1
238000002604 ultrasonography Methods 0.000 claims 1
238000012795 verification Methods 0.000 claims 1
239000011889 copper foil Substances 0.000 abstract description 2
238000001914 filtration Methods 0.000 abstract description 2
229910052799 carbon Inorganic materials 0.000 abstract 1
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
239000004922 lacquer Substances 0.000 description 4
229910052782 aluminium Inorganic materials 0.000 description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000002184 metal Substances 0.000 description 3
239000000654 additive Substances 0.000 description 2
238000007664 blowing Methods 0.000 description 2
239000011248 coating agent Substances 0.000 description 2
238000000576 coating method Methods 0.000 description 2
238000011109 contamination Methods 0.000 description 2
238000000354 decomposition reaction Methods 0.000 description 2
150000002500 ions Chemical class 0.000 description 2
239000007788 liquid Substances 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
239000002244 precipitate Substances 0.000 description 2
239000000047 product Substances 0.000 description 2
238000005086 pumping Methods 0.000 description 2
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000004927 clay Substances 0.000 description 1
229910001431 copper ion Inorganic materials 0.000 description 1
238000004070 electrodeposition Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000000227 grinding Methods 0.000 description 1
238000005342 ion exchange Methods 0.000 description 1
239000002932 luster Substances 0.000 description 1
239000000463 material Substances 0.000 description 1
239000006259 organic additive Substances 0.000 description 1
239000011148 porous material Substances 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
230000002829 reductive effect Effects 0.000 description 1
238000000926 separation method Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000007785 strong electrolyte Substances 0.000 description 1
230000002277 temperature effect Effects 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

the container 1 shown in the figure contains the electroplating liquid, in which the recording medium 2 to be electroplated is suspended obliquely on a rotating plate 3.
the rotating plate 3 forms the cathode of the bath.
the anode is formed by the electrode box 4 arranged at a distance from the recording medium.
an aperture 5 known from DE-OS 24 52 401 is arranged between the two electrodes.
Below the recording medium there is a pipe 6 with side openings through which air can be blown into the bath.

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating Methods And Accessories (AREA)

EP82102850A 1981-04-08 1982-04-03 Procédé de dépôt électrolytique de cuivre sur un support Withdrawn EP0062863A1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE19813114106 DE3114106A1 (de)	1981-04-08	1981-04-08	Verfahren zur galvanischen abscheidung von kupfer auf einem substrat
DE3114106		1981-04-08

Publications (1)

Publication Number	Publication Date
EP0062863A1 true EP0062863A1 (fr)	1982-10-20

Family

ID=6129630

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP82102850A Withdrawn EP0062863A1 (fr)	1981-04-08	1982-04-03	Procédé de dépôt électrolytique de cuivre sur un support

Country Status (2)

Country	Link
EP (1)	EP0062863A1 (fr)
DE (1)	DE3114106A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2452401A1 (de) *	1974-11-05	1976-05-06	Teldec Telefunken Decca	Verfahren zur beeinflussung der dicke galvanisch abgeschiedener metallniederschlaege
DE2630688A1 (de) *	1976-07-08	1978-01-12	Bosch Gmbh Robert	Verfahren zur herstellung galvanischer kupferschichten fuer leiterzuege auf leiterplatten
EP0020008A1 (fr) *	1979-06-01	1980-12-10	EMI Limited	Procédé de dépôt électrolytique à grande vitesse et plaque de moulage pour disques, électroformée selon un tel procédé

1981
- 1981-04-08 DE DE19813114106 patent/DE3114106A1/de not_active Withdrawn
1982
- 1982-04-03 EP EP82102850A patent/EP0062863A1/fr not_active Withdrawn

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2452401A1 (de) *	1974-11-05	1976-05-06	Teldec Telefunken Decca	Verfahren zur beeinflussung der dicke galvanisch abgeschiedener metallniederschlaege
DE2630688A1 (de) *	1976-07-08	1978-01-12	Bosch Gmbh Robert	Verfahren zur herstellung galvanischer kupferschichten fuer leiterzuege auf leiterplatten
EP0020008A1 (fr) *	1979-06-01	1980-12-10	EMI Limited	Procédé de dépôt électrolytique à grande vitesse et plaque de moulage pour disques, électroformée selon un tel procédé

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
F.A. LOWENHEIM: "Modern electroplating", John Wiley and Sons, 3rd Edition, Seiten 187-191, 209-211, New York, USA *

Also Published As

Publication number	Publication date
DE3114106A1 (de)	1982-10-28

Similar Documents

Publication	Publication Date	Title
DE69210650T2 (de)	1996-09-19	Vorrichtung und Verfahren zum Elektroplattieren
DE3704546A1 (de)	1988-08-25	Verfahren zur herstellung eines filters und danach hergestelltes filter
EP0227857A1 (fr)	1987-07-08	Procédé de fabrication de circuits imprimés
DE3741421A1 (de)	1988-06-09	Galvanoformungs-verfahren und galvanoformungs-vorrichtung
CH647264A5 (de)	1985-01-15	Verfahren und bad zum stromlosen abscheiden eines kupferueberzugs auf einem werkstueck.
DE2422918A1 (de)	1974-12-05	Elektroplattierte bzw. galvanisierte, eloxierte aluminiumgegenstaende und verfahren und vorrichtung zu ihrer herstellung
EP3527359A1 (fr)	2019-08-21	Procédé et dispositif de structuration d'une surface pour un outil de gaufrage
DE69726570T2 (de)	2004-11-11	Verfahren zur herstellung streuender prismenflanken auf einer fresnellinsenmatrize
DE1496161B2 (de)	1973-12-20	Verfahren zur Herstellung einer Druckplatte
EP0767257B1 (fr)	2001-12-05	Procédé de fabrication d'électrodes intégrées, dans des moules en matière plastique
DE2050285C3 (de)	1974-03-21	Verfahren zum Herstellen von Siebdruckschablonen aus Metall
DE69316750T2 (de)	1998-09-17	Verfahren zur herstellung einer leiterplatte.
DE3408897A1 (de)	1984-09-20	Verfahren zum galvanischen niederschlagen einer homogenen dicken metallschicht, auf diese weise erhaltene metallschicht und verwendung der auf diese weise erhaltenen metallschicht, vorrichtung zum durchfuehren des verfahrens und erhaltene matrize
DE2404097A1 (de)	1974-08-15	Verfahren und vorrichtung zum aufbringen eines fein verteiltes pulver enthaltenden verbundueberzugs auf gegenstaende
DE3114106A1 (de)	1982-10-28	Verfahren zur galvanischen abscheidung von kupfer auf einem substrat
DE4116686C2 (de)	1997-07-03	Verfahren und Vorrichtung zur Herstellung von Gleitflächen
DE2811888C3 (de)	1980-11-20	Verfahren zur Herstellung einer mit einer Rillenmodulation versehenen Metallmatrize
DE19548198C2 (de)	1999-05-12	Verfahren und Vorrichtung zur Nach- und/oder Ausbesserung von kleinen Oberflächenschäden in einer großformatigen Preßplatte oder einem Endlosband aus Blech mit einer strukturierten Oberfläche zur Oberflächenprägung kunststoffbeschichteter Holzwerkstoff- oder Laminatplatten
EP0976130B1 (fr)	2002-11-27	Modele-maitre pour la fabrication de plaques optiques
DE2048562A1 (de)	1971-05-27	Vorrichtung und Verfahren zum Elektro plattieren
DE19736340C2 (de)	1999-09-02	Vorrichtung und Verfahren zum Herstellen von Galvanikschichten auf elektrisch leitfähigen Substraten
DE69508705T2 (de)	1999-07-29	Stiftfreie Dünnschicht für eine permanente Form für eine Düsenöffnungsplatte
US2932609A (en)	1960-04-12	Electroforming millimeter wave components
DE2643424C3 (de)	1979-06-21	Verfahren zur stromlosen Vernickelung von nichtleitenden Werkstoffen
EP1204786A1 (fr)	2002-05-15	Dispositif permettant a un liquide de s'ecouler uniformement sur la surface d'un echantillon et utilisation de ce dispositif

Legal Events

Date	Code	Title	Description
1982-08-20	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1982-10-20	AK	Designated contracting states	Designated state(s): AT BE CH DE FR GB IT LU NL SE
1983-03-30	17P	Request for examination filed	Effective date: 19830119
1984-10-02	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
1984-12-05	18D	Application deemed to be withdrawn	Effective date: 19840517
2007-08-08	RIN1	Information on inventor provided before grant (corrected)	Inventor name: KNOTHE, HERBERT, DIPL.-ING. Inventor name: ROESCHMANN, KLAUS